SG2013030143A - Aluminum alloy bonding wire - Google Patents

Aluminum alloy bonding wire

Info

Publication number
SG2013030143A
SG2013030143A SG2013030143A SG2013030143A SG2013030143A SG 2013030143 A SG2013030143 A SG 2013030143A SG 2013030143 A SG2013030143 A SG 2013030143A SG 2013030143 A SG2013030143 A SG 2013030143A SG 2013030143 A SG2013030143 A SG 2013030143A
Authority
SG
Singapore
Prior art keywords
aluminum alloy
bonding wire
alloy bonding
wire
aluminum
Prior art date
Application number
SG2013030143A
Other languages
English (en)
Inventor
Hiroyuki Amano
Michitaka Mikami
Shinichiro Nakashima
Tsukasa Ichikawa
Original Assignee
Tanaka Electronics Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Electronics Ind filed Critical Tanaka Electronics Ind
Publication of SG2013030143A publication Critical patent/SG2013030143A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/43—Manufacturing methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950 degrees C
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C21/00—Alloys based on aluminium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/43—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
    • H01L2224/45012—Cross-sectional shape
    • H01L2224/45015—Cross-sectional shape being circular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Conductive Materials (AREA)
SG2013030143A 2012-09-03 2013-04-19 Aluminum alloy bonding wire SG2013030143A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012193593A JP5159001B1 (ja) 2012-09-03 2012-09-03 アルミニウム合金ボンディングワイヤ

Publications (1)

Publication Number Publication Date
SG2013030143A true SG2013030143A (en) 2014-04-28

Family

ID=48013553

Family Applications (1)

Application Number Title Priority Date Filing Date
SG2013030143A SG2013030143A (en) 2012-09-03 2013-04-19 Aluminum alloy bonding wire

Country Status (4)

Country Link
JP (1) JP5159001B1 (zh)
KR (1) KR101307022B1 (zh)
CN (1) CN103320654B (zh)
SG (1) SG2013030143A (zh)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2736047B1 (en) * 2012-11-22 2017-11-08 Heraeus Deutschland GmbH & Co. KG Aluminium alloy wire for bonding applications
CN105274397A (zh) * 2015-10-23 2016-01-27 东北大学 一种高强特耐热铝合金导线及其制备方法
DE102016107287A1 (de) * 2016-04-20 2017-11-09 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitereinrichtung und Verfahren zum Betrieb einer Leistungshalbleitereinrichtung
JP6432619B2 (ja) * 2017-03-02 2018-12-05 日立金属株式会社 アルミニウム合金導体、該導体を用いた絶縁電線、および該絶縁電線の製造方法
CN112313091B (zh) 2018-07-02 2023-03-17 横滨橡胶株式会社 充气轮胎
JP7126321B2 (ja) * 2018-10-10 2022-08-26 日鉄マイクロメタル株式会社 Ａｌボンディングワイヤ
CN113557595B (zh) * 2019-03-13 2024-08-09 日铁新材料股份有限公司 接合线
CN110653517A (zh) * 2019-09-27 2020-01-07 桂林理工大学 一种含稀土元素钪和铒的铝合金焊丝
WO2021065551A1 (ja) * 2019-10-01 2021-04-08 日鉄マイクロメタル株式会社 Ａｌ配線材
CN115280475A (zh) 2020-03-13 2022-11-01 日铁新材料股份有限公司 Al接合线
WO2022045134A1 (ja) 2020-08-31 2022-03-03 日鉄マイクロメタル株式会社 Ａｌ配線材
CN115989570A (zh) 2020-08-31 2023-04-18 日铁新材料股份有限公司 Al布线材料
TW202239982A (zh) * 2021-02-05 2022-10-16 日商日鐵新材料股份有限公司 半導體裝置用Al接合線

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61179839A (ja) * 1985-02-04 1986-08-12 Furukawa Electric Co Ltd:The 半導体素子ボンデイング用アルミニウム線材
JPS61179840A (ja) * 1985-02-04 1986-08-12 Furukawa Electric Co Ltd:The 半導体素子ボンデイング用アルミニウム線材
JPH07316705A (ja) * 1994-05-31 1995-12-05 Riyouka Massey Kk 配線材料
JP2001348637A (ja) * 2000-06-05 2001-12-18 Hitachi Cable Ltd アルミニウム合金材及びそれを用いた配線材の製造方法
CN102021444B (zh) * 2010-12-09 2012-08-22 北京科技大学 一种高导电耐热铝合金导线及其制备方法
CN102364605A (zh) * 2011-09-07 2012-02-29 无锡市嘉邦电力管道厂 一种铝合金电线的制造方法
CN102360623A (zh) * 2011-09-13 2012-02-22 无锡市嘉邦电力管道厂 一种铝合金电缆的制造方法

Also Published As

Publication number Publication date
JP5159001B1 (ja) 2013-03-06
CN103320654A (zh) 2013-09-25
JP2014047417A (ja) 2014-03-17
CN103320654B (zh) 2015-11-18
KR101307022B1 (ko) 2013-09-11

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