KR101307022B1 - 알루미늄 합금 본딩 와이어 - Google Patents

알루미늄 합금 본딩 와이어 Download PDF

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Publication number
KR101307022B1
KR101307022B1 KR1020130037348A KR20130037348A KR101307022B1 KR 101307022 B1 KR101307022 B1 KR 101307022B1 KR 1020130037348 A KR1020130037348 A KR 1020130037348A KR 20130037348 A KR20130037348 A KR 20130037348A KR 101307022 B1 KR101307022 B1 KR 101307022B1
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KR
South Korea
Prior art keywords
aluminum
aluminum alloy
mass
scandium
wire
Prior art date
Application number
KR1020130037348A
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English (en)
Korean (ko)
Inventor
히로유키 아마노
미치타카 미카미
신이치로 나카시마
즈카사 이치카와
Original Assignee
타나카 덴시 코오교오 카부시키가이샤
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Application granted granted Critical
Publication of KR101307022B1 publication Critical patent/KR101307022B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/43—Manufacturing methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950 degrees C
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C21/00—Alloys based on aluminium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/43—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
    • H01L2224/45012—Cross-sectional shape
    • H01L2224/45015—Cross-sectional shape being circular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Conductive Materials (AREA)
KR1020130037348A 2012-09-03 2013-04-05 알루미늄 합금 본딩 와이어 KR101307022B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2012-193593 2012-09-03
JP2012193593A JP5159001B1 (ja) 2012-09-03 2012-09-03 アルミニウム合金ボンディングワイヤ

Publications (1)

Publication Number Publication Date
KR101307022B1 true KR101307022B1 (ko) 2013-09-11

Family

ID=48013553

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130037348A KR101307022B1 (ko) 2012-09-03 2013-04-05 알루미늄 합금 본딩 와이어

Country Status (4)

Country Link
JP (1) JP5159001B1 (zh)
KR (1) KR101307022B1 (zh)
CN (1) CN103320654B (zh)
SG (1) SG2013030143A (zh)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2736047B1 (en) * 2012-11-22 2017-11-08 Heraeus Deutschland GmbH & Co. KG Aluminium alloy wire for bonding applications
CN105274397A (zh) * 2015-10-23 2016-01-27 东北大学 一种高强特耐热铝合金导线及其制备方法
DE102016107287A1 (de) * 2016-04-20 2017-11-09 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitereinrichtung und Verfahren zum Betrieb einer Leistungshalbleitereinrichtung
JP6432619B2 (ja) * 2017-03-02 2018-12-05 日立金属株式会社 アルミニウム合金導体、該導体を用いた絶縁電線、および該絶縁電線の製造方法
CN112313091B (zh) 2018-07-02 2023-03-17 横滨橡胶株式会社 充气轮胎
JP7126321B2 (ja) * 2018-10-10 2022-08-26 日鉄マイクロメタル株式会社 Ａｌボンディングワイヤ
CN113557595B (zh) * 2019-03-13 2024-08-09 日铁新材料股份有限公司 接合线
CN110653517A (zh) * 2019-09-27 2020-01-07 桂林理工大学 一种含稀土元素钪和铒的铝合金焊丝
WO2021065551A1 (ja) * 2019-10-01 2021-04-08 日鉄マイクロメタル株式会社 Ａｌ配線材
CN115280475A (zh) 2020-03-13 2022-11-01 日铁新材料股份有限公司 Al接合线
WO2022045134A1 (ja) 2020-08-31 2022-03-03 日鉄マイクロメタル株式会社 Ａｌ配線材
CN115989570A (zh) 2020-08-31 2023-04-18 日铁新材料股份有限公司 Al布线材料
TW202239982A (zh) * 2021-02-05 2022-10-16 日商日鐵新材料股份有限公司 半導體裝置用Al接合線

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61179840A (ja) * 1985-02-04 1986-08-12 Furukawa Electric Co Ltd:The 半導体素子ボンデイング用アルミニウム線材

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61179839A (ja) * 1985-02-04 1986-08-12 Furukawa Electric Co Ltd:The 半導体素子ボンデイング用アルミニウム線材
JPH07316705A (ja) * 1994-05-31 1995-12-05 Riyouka Massey Kk 配線材料
JP2001348637A (ja) * 2000-06-05 2001-12-18 Hitachi Cable Ltd アルミニウム合金材及びそれを用いた配線材の製造方法
CN102021444B (zh) * 2010-12-09 2012-08-22 北京科技大学 一种高导电耐热铝合金导线及其制备方法
CN102364605A (zh) * 2011-09-07 2012-02-29 无锡市嘉邦电力管道厂 一种铝合金电线的制造方法
CN102360623A (zh) * 2011-09-13 2012-02-22 无锡市嘉邦电力管道厂 一种铝合金电缆的制造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61179840A (ja) * 1985-02-04 1986-08-12 Furukawa Electric Co Ltd:The 半導体素子ボンデイング用アルミニウム線材

Also Published As

Publication number Publication date
SG2013030143A (en) 2014-04-28
JP5159001B1 (ja) 2013-03-06
CN103320654A (zh) 2013-09-25
JP2014047417A (ja) 2014-03-17
CN103320654B (zh) 2015-11-18

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