SG2013044755A - Silver-gold-palladium alloy bumping wire - Google Patents

Silver-gold-palladium alloy bumping wire

Info

Publication number
SG2013044755A
SG2013044755A SG2013044755A SG2013044755A SG2013044755A SG 2013044755 A SG2013044755 A SG 2013044755A SG 2013044755 A SG2013044755 A SG 2013044755A SG 2013044755 A SG2013044755 A SG 2013044755A SG 2013044755 A SG2013044755 A SG 2013044755A
Authority
SG
Singapore
Prior art keywords
bumping
gold
silver
wire
palladium alloy
Prior art date
Application number
SG2013044755A
Inventor
Jun Chiba
Yuki ANTOKU
Satoshi Teshima
Kazuhiko Yasuhara
Wei Chen
Nanako Maeda
Original Assignee
Tanaka Electronics Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Electronics Ind filed Critical Tanaka Electronics Ind
Publication of SG2013044755A publication Critical patent/SG2013044755A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
    • H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
    • H01L2224/1134—Stud bumping, i.e. using a wire-bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/13138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/13139—Silver [Ag] as principal constituent
SG2013044755A 2012-09-12 2013-06-10 Silver-gold-palladium alloy bumping wire SG2013044755A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012200927A JP5165810B1 (en) 2012-09-12 2012-09-12 Silver gold palladium alloy bump wire

Publications (1)

Publication Number Publication Date
SG2013044755A true SG2013044755A (en) 2014-04-28

Family

ID=48134628

Family Applications (1)

Application Number Title Priority Date Filing Date
SG2013044755A SG2013044755A (en) 2012-09-12 2013-06-10 Silver-gold-palladium alloy bumping wire

Country Status (4)

Country Link
JP (1) JP5165810B1 (en)
CN (1) CN103409654B (en)
SG (1) SG2013044755A (en)
TW (1) TWI510651B (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI395313B (en) * 2012-11-07 2013-05-01 Wire technology co ltd Stud bump structure and method for forming the same
CN103194637B (en) * 2013-04-27 2015-05-13 烟台招金励福贵金属股份有限公司 Bonding alloy filamentary silver and preparation method thereof
JP5399581B1 (en) * 2013-05-14 2014-01-29 田中電子工業株式会社 High speed signal bonding wire
US8779604B1 (en) * 2013-11-06 2014-07-15 Chipmos Technologies Inc. Semiconductor structure and manufacturing method thereof
US20150171039A1 (en) * 2013-12-13 2015-06-18 Chipmos Technologies Inc. Redistribution layer alloy structure and manufacturing method thereof
TWI538762B (en) * 2014-01-03 2016-06-21 樂金股份有限公司 Stud bump and package structure thereof and method of forming the same
CN104377185A (en) * 2014-01-17 2015-02-25 江西蓝微电子科技有限公司 Gold-plated palladium-silver alloy single crystal bonding wire and manufacturing method thereof
CN103779308A (en) * 2014-01-20 2014-05-07 江西蓝微电子科技有限公司 Gold-silver-palladium alloy single-crystal bonding wire and manufacturing method thereof
WO2016024180A1 (en) * 2014-08-11 2016-02-18 Koninklijke Philips N.V. Alloy stud bump interconnects for semiconductor devices
CN108701622B (en) * 2016-03-11 2021-12-10 拓自达电线株式会社 Bonding wire

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6123329A (en) * 1984-07-12 1986-01-31 Nec Corp Manufacture of semiconductor device
JP3536650B2 (en) * 1998-02-27 2004-06-14 富士ゼロックス株式会社 Bump forming method and apparatus
JP2001049364A (en) * 2000-07-03 2001-02-20 Kazuo Ogasa Hard noble metal alloy member and its production
JP2007142271A (en) * 2005-11-21 2007-06-07 Tanaka Electronics Ind Co Ltd Bump material and bonding structure
CN102130069A (en) * 2008-07-14 2011-07-20 Mk电子株式会社 Ag-base alloy lead wire for semiconductor packaging
TW201028227A (en) * 2009-01-23 2010-08-01 jun-de Li Method for manufacturing composite metal wire and product thereof
CN101786154A (en) * 2009-01-24 2010-07-28 李俊德 Composite gold wire and manufacture method thereof
JP5616165B2 (en) * 2010-08-24 2014-10-29 タツタ電線株式会社 Silver bonding wire
CN102154574A (en) * 2010-10-18 2011-08-17 东莞市正奇电子有限公司 Alloy wire for connecting semiconductor components
JP4771562B1 (en) * 2011-02-10 2011-09-14 田中電子工業株式会社 Ag-Au-Pd ternary alloy bonding wire

Also Published As

Publication number Publication date
CN103409654A (en) 2013-11-27
TW201410885A (en) 2014-03-16
JP5165810B1 (en) 2013-03-21
CN103409654B (en) 2015-06-24
TWI510651B (en) 2015-12-01
JP2014055327A (en) 2014-03-27

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