SG191463A1 - Semiconductor packaging method and structure thereof - Google Patents
Semiconductor packaging method and structure thereof Download PDFInfo
- Publication number
- SG191463A1 SG191463A1 SG2012069548A SG2012069548A SG191463A1 SG 191463 A1 SG191463 A1 SG 191463A1 SG 2012069548 A SG2012069548 A SG 2012069548A SG 2012069548 A SG2012069548 A SG 2012069548A SG 191463 A1 SG191463 A1 SG 191463A1
- Authority
- SG
- Singapore
- Prior art keywords
- copper
- semiconductor packaging
- dissociation
- accordance
- linking
- Prior art date
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 29
- 239000004065 semiconductor Substances 0.000 title claims abstract description 29
- 238000000034 method Methods 0.000 title claims abstract description 19
- 238000010494 dissociation reaction Methods 0.000 claims abstract description 43
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 35
- 229910052802 copper Inorganic materials 0.000 claims abstract description 35
- 239000010949 copper Substances 0.000 claims abstract description 35
- 239000000126 substance Substances 0.000 claims abstract description 24
- 239000000758 substrate Substances 0.000 claims abstract description 24
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 7
- SEULWJSKCVACTH-UHFFFAOYSA-N 1-phenylimidazole Chemical compound C1=NC=CN1C1=CC=CC=C1 SEULWJSKCVACTH-UHFFFAOYSA-N 0.000 claims description 6
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 claims description 6
- 125000003118 aryl group Chemical class 0.000 claims description 6
- 150000001556 benzimidazoles Chemical class 0.000 claims description 6
- 150000002460 imidazoles Chemical class 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 239000003755 preservative agent Substances 0.000 claims description 6
- 230000002335 preservative effect Effects 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 5
- 229910001431 copper ion Inorganic materials 0.000 description 5
- 230000005593 dissociations Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/921—Connecting a surface with connectors of different types
- H01L2224/9212—Sequential connecting processes
- H01L2224/92122—Sequential connecting processes the first connecting process involving a bump connector
- H01L2224/92125—Sequential connecting processes the first connecting process involving a bump connector the second connecting process involving a layer connector
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101100127A TWI463585B (zh) | 2012-01-03 | 2012-01-03 | 半導體封裝方法及其結構 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG191463A1 true SG191463A1 (en) | 2013-07-31 |
Family
ID=48992266
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG2012069548A SG191463A1 (en) | 2012-01-03 | 2012-09-19 | Semiconductor packaging method and structure thereof |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2013140936A (ko) |
| KR (1) | KR101419329B1 (ko) |
| SG (1) | SG191463A1 (ko) |
| TW (1) | TWI463585B (ko) |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3633422B2 (ja) * | 2000-02-22 | 2005-03-30 | ソニーケミカル株式会社 | 接続材料 |
| TWI248221B (en) * | 2005-05-05 | 2006-01-21 | Po-Chien Li | Bump structure of LED flip chip |
| JP4993880B2 (ja) * | 2005-07-06 | 2012-08-08 | 旭化成イーマテリアルズ株式会社 | 異方導電性接着シート及び微細接続構造体 |
| TW200812027A (en) * | 2006-08-22 | 2008-03-01 | Int Semiconductor Tech Ltd | Flip-chip attach structure and method |
| KR101116167B1 (ko) * | 2007-10-29 | 2012-03-06 | 한양대학교 산학협력단 | 금속 복합 범프 형성 및 이를 이용한 접합 방법 |
| JPWO2009122867A1 (ja) * | 2008-03-31 | 2011-07-28 | 日本電気株式会社 | 半導体装置、複合回路装置及びそれらの製造方法 |
| WO2009139153A1 (ja) * | 2008-05-16 | 2009-11-19 | 住友ベークライト株式会社 | 半導体部品の製造方法および半導体部品 |
| WO2010013728A1 (ja) * | 2008-07-31 | 2010-02-04 | 日本電気株式会社 | 半導体装置及びその製造方法 |
| JP5296116B2 (ja) * | 2011-02-16 | 2013-09-25 | シャープ株式会社 | 半導体装置 |
| JP2012212864A (ja) * | 2011-03-18 | 2012-11-01 | Sekisui Chem Co Ltd | 接続構造体の製造方法及び接続構造体 |
| TWM428492U (en) * | 2012-01-03 | 2012-05-01 | Chipbond Technology Corp | Semiconductor packaging structure |
-
2012
- 2012-01-03 TW TW101100127A patent/TWI463585B/zh active
- 2012-06-19 JP JP2012138154A patent/JP2013140936A/ja active Pending
- 2012-07-31 KR KR1020120083792A patent/KR101419329B1/ko active IP Right Grant
- 2012-09-19 SG SG2012069548A patent/SG191463A1/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW201330125A (zh) | 2013-07-16 |
| TWI463585B (zh) | 2014-12-01 |
| KR101419329B1 (ko) | 2014-07-14 |
| KR20130079980A (ko) | 2013-07-11 |
| JP2013140936A (ja) | 2013-07-18 |
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