SG186203A1 - A splicing technique for fixed abrasives used in chemical mechanical planarization - Google Patents

A splicing technique for fixed abrasives used in chemical mechanical planarization Download PDF

Info

Publication number
SG186203A1
SG186203A1 SG2012089686A SG2012089686A SG186203A1 SG 186203 A1 SG186203 A1 SG 186203A1 SG 2012089686 A SG2012089686 A SG 2012089686A SG 2012089686 A SG2012089686 A SG 2012089686A SG 186203 A1 SG186203 A1 SG 186203A1
Authority
SG
Singapore
Prior art keywords
abrasive
edge
support pad
edges
channel
Prior art date
Application number
SG2012089686A
Other languages
English (en)
Inventor
John J Gagliardi
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of SG186203A1 publication Critical patent/SG186203A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/14—Zonally-graded wheels; Composite wheels comprising different abrasives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
SG2012089686A 2010-06-15 2011-06-08 A splicing technique for fixed abrasives used in chemical mechanical planarization SG186203A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/815,764 US8360823B2 (en) 2010-06-15 2010-06-15 Splicing technique for fixed abrasives used in chemical mechanical planarization
PCT/US2011/039618 WO2011159536A2 (en) 2010-06-15 2011-06-08 A splicing technique for fixed abrasives used in chemical mechanical planarization

Publications (1)

Publication Number Publication Date
SG186203A1 true SG186203A1 (en) 2013-01-30

Family

ID=45096602

Family Applications (1)

Application Number Title Priority Date Filing Date
SG2012089686A SG186203A1 (en) 2010-06-15 2011-06-08 A splicing technique for fixed abrasives used in chemical mechanical planarization

Country Status (7)

Country Link
US (1) US8360823B2 (https=)
JP (1) JP2013533125A (https=)
KR (1) KR20130079480A (https=)
CN (1) CN102939644B (https=)
SG (1) SG186203A1 (https=)
TW (1) TWI535526B (https=)
WO (1) WO2011159536A2 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI544064B (zh) 2010-09-03 2016-08-01 聖高拜磨料有限公司 粘結的磨料物品及形成方法
WO2014106156A1 (en) 2012-12-31 2014-07-03 Saint-Gobain Abrasives, Inc. Bonded abrasive article and method of grinding
US9102039B2 (en) 2012-12-31 2015-08-11 Saint-Gobain Abrasives, Inc. Bonded abrasive article and method of grinding
WO2014106157A1 (en) 2012-12-31 2014-07-03 Saint-Gobain Abrasives, Inc. Bonded abrasive article and method of grinding
US20140227945A1 (en) * 2013-02-08 2014-08-14 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical planarization platen
US9833877B2 (en) 2013-03-31 2017-12-05 Saint-Gobain Abrasives, Inc. Bonded abrasive article and method of grinding
CN106363528A (zh) * 2016-08-30 2017-02-01 天通银厦新材料有限公司 一种针对蓝宝石的固结磨料及研磨工艺
CN119556530A (zh) * 2018-05-22 2025-03-04 Asml控股股份有限公司 用于原位夹具表面粗糙化的装置和方法
JP6653514B1 (ja) * 2018-11-29 2020-02-26 株式会社大輝 ポリッシングパッドの製造方法
WO2021141904A1 (en) * 2020-01-06 2021-07-15 Saint-Gobain Abrasives, Inc. Abrasive article and method of use

Family Cites Families (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1924773A (en) * 1932-03-11 1933-08-29 Titan Abrasives Company Abrasive disk
US2242877A (en) * 1939-03-15 1941-05-20 Albertson & Co Inc Abrasive disk and method of making the same
US2685155A (en) * 1951-04-28 1954-08-03 Minnesota Mining & Mfg Multiple center hole abrasive disk
US3568371A (en) * 1969-03-12 1971-03-09 Spitfire Tool & Machine Co Inc Lapping and polishing machine
US3763604A (en) * 1969-05-08 1973-10-09 Norton Co Coated abrasive belt joint
SE338933B (https=) * 1970-01-20 1971-09-20 Fab Ab Eka
US4215516A (en) * 1979-04-18 1980-08-05 Sheldahl, Inc. Unidirectional tape
US4314827A (en) 1979-06-29 1982-02-09 Minnesota Mining And Manufacturing Company Non-fused aluminum oxide-based abrasive mineral
US4623364A (en) 1984-03-23 1986-11-18 Norton Company Abrasive material and method for preparing the same
CA1254238A (en) 1985-04-30 1989-05-16 Alvin P. Gerk Process for durable sol-gel produced alumina-based ceramics, abrasive grain and abrasive products
US4770671A (en) 1985-12-30 1988-09-13 Minnesota Mining And Manufacturing Company Abrasive grits formed of ceramic containing oxides of aluminum and yttrium, method of making and using the same and products made therewith
US4881951A (en) 1987-05-27 1989-11-21 Minnesota Mining And Manufacturing Co. Abrasive grits formed of ceramic containing oxides of aluminum and rare earth metal, method of making and products made therewith
US5152917B1 (en) 1991-02-06 1998-01-13 Minnesota Mining & Mfg Structured abrasive article
US5256227A (en) * 1991-05-09 1993-10-26 Minnesota Mining And Manufacturing Company Method of splicing endless abrasive belts and cones
AU1735295A (en) * 1994-02-22 1995-09-04 Minnesota Mining And Manufacturing Company Method for making an endless coated abrasive article and the product thereof
US5534106A (en) * 1994-07-26 1996-07-09 Kabushiki Kaisha Toshiba Apparatus for processing semiconductor wafers
US5595804A (en) * 1994-08-22 1997-01-21 Minnesota Mining And Manufacturing Company Splice means, a method of splicing an abrasive article with same and the spliced abrasive article formed thereby
US6453899B1 (en) * 1995-06-07 2002-09-24 Ultimate Abrasive Systems, L.L.C. Method for making a sintered article and products produced thereby
EP0874717B1 (en) * 1995-12-08 2005-08-31 Norton Company Backing plates for abrasive disks
JPH09277163A (ja) * 1996-04-16 1997-10-28 Sony Corp 研磨方法と研磨装置
US6149506A (en) * 1998-10-07 2000-11-21 Keltech Engineering Lapping apparatus and method for high speed lapping with a rotatable abrasive platen
US6062958A (en) * 1997-04-04 2000-05-16 Micron Technology, Inc. Variable abrasive polishing pad for mechanical and chemical-mechanical planarization
US5920769A (en) * 1997-12-12 1999-07-06 Micron Technology, Inc. Method and apparatus for processing a planar structure
JPH11333703A (ja) * 1998-05-28 1999-12-07 Speedfam-Ipec Co Ltd ポリッシング加工機
US6261168B1 (en) * 1999-05-21 2001-07-17 Lam Research Corporation Chemical mechanical planarization or polishing pad with sections having varied groove patterns
US6419554B2 (en) 1999-06-24 2002-07-16 Micron Technology, Inc. Fixed abrasive chemical-mechanical planarization of titanium nitride
US6569004B1 (en) * 1999-12-30 2003-05-27 Lam Research Polishing pad and method of manufacture
US20020058468A1 (en) * 2000-05-03 2002-05-16 Eppert Stanley E. Semiconductor polishing pad
EP1292428B1 (en) * 2000-06-19 2005-04-20 Struers A/S A multi-zone grinding and/or polishing sheet
CN101607381B (zh) * 2000-08-31 2014-04-16 株式会社荏原制作所 化学机械抛光头、设备和方法以及平面化半导体晶片
US20020072296A1 (en) * 2000-11-29 2002-06-13 Muilenburg Michael J. Abrasive article having a window system for polishing wafers, and methods
JP2002252191A (ja) * 2001-02-26 2002-09-06 Mitsubishi Materials Silicon Corp 半導体ウェーハの研磨装置
US6835118B2 (en) * 2001-12-14 2004-12-28 Oriol, Inc. Rigid plate assembly with polishing pad and method of using
US6602123B1 (en) * 2002-09-13 2003-08-05 Infineon Technologies Ag Finishing pad design for multidirectional use
JP2006513573A (ja) 2003-01-10 2006-04-20 スリーエム イノベイティブ プロパティズ カンパニー 化学的機械的平坦化用途向けのパッド構成体
JP4456335B2 (ja) * 2003-04-22 2010-04-28 ニッタ・ハース株式会社 研磨装置
TWI254354B (en) * 2004-06-29 2006-05-01 Iv Technologies Co Ltd An inlaid polishing pad and a method of producing the same
US7029375B2 (en) * 2004-08-31 2006-04-18 Tech Semiconductor Pte. Ltd. Retaining ring structure for edge control during chemical-mechanical polishing
TWI284584B (en) * 2005-05-09 2007-08-01 Nat Univ Chung Cheng Method for detecting the using condition and lifetime of the polish pad by sensing the temperature of the grinding interface during the chemical-mechanical polishing process
US7494519B2 (en) 2005-07-28 2009-02-24 3M Innovative Properties Company Abrasive agglomerate polishing method
US20070128991A1 (en) 2005-12-07 2007-06-07 Yoon Il-Young Fixed abrasive polishing pad, method of preparing the same, and chemical mechanical polishing apparatus including the same
KR100882045B1 (ko) * 2006-02-15 2009-02-09 어플라이드 머티어리얼스, 인코포레이티드 그루브형 서브패드를 구비한 폴리싱 장치

Also Published As

Publication number Publication date
CN102939644A (zh) 2013-02-20
JP2013533125A (ja) 2013-08-22
CN102939644B (zh) 2015-12-16
US8360823B2 (en) 2013-01-29
TW201208810A (en) 2012-03-01
TWI535526B (zh) 2016-06-01
WO2011159536A2 (en) 2011-12-22
US20110306276A1 (en) 2011-12-15
WO2011159536A3 (en) 2012-04-05
KR20130079480A (ko) 2013-07-10

Similar Documents

Publication Publication Date Title
US8360823B2 (en) Splicing technique for fixed abrasives used in chemical mechanical planarization
JP7535499B2 (ja) 構造化研磨物品及びそれを製造する方法
US5692950A (en) Abrasive construction for semiconductor wafer modification
US6746311B1 (en) Polishing pad with release layer
US7329171B2 (en) Fixed abrasive article for use in modifying a semiconductor wafer
JP2020075357A (ja) 複数の研磨要素の異なるセットを有する研磨材
US5383309A (en) Abrasive tool
JP5739891B2 (ja) 構造化研磨物品並びにその使用方法
TWI417168B (zh) 在有機基質中結合超研磨顆粒的方法
CN100445091C (zh) 控制渗透子垫
CN103846780A (zh) 抛光半导体晶片的方法
US6616519B2 (en) Sanding system
US7014550B2 (en) Sanding system
TWI821561B (zh) 具有紋理化之平板黏著劑之化學機械研磨墊及貼附彼之方法
WO2025144860A1 (en) Structured abrasive article with improved backing
JP2005014135A (ja) 研磨シート
JP2003326452A (ja) 研磨パッド
JPH0639736A (ja) 研磨布紙
JP2002001650A (ja) 研磨パッドおよび板状材の研磨方法