SG186203A1 - A splicing technique for fixed abrasives used in chemical mechanical planarization - Google Patents

A splicing technique for fixed abrasives used in chemical mechanical planarization Download PDF

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Publication number
SG186203A1
SG186203A1 SG2012089686A SG2012089686A SG186203A1 SG 186203 A1 SG186203 A1 SG 186203A1 SG 2012089686 A SG2012089686 A SG 2012089686A SG 2012089686 A SG2012089686 A SG 2012089686A SG 186203 A1 SG186203 A1 SG 186203A1
Authority
SG
Singapore
Prior art keywords
abrasive
edge
support pad
edges
channel
Prior art date
Application number
SG2012089686A
Other languages
English (en)
Inventor
John J Gagliardi
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of SG186203A1 publication Critical patent/SG186203A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/14—Zonally-graded wheels; Composite wheels comprising different abrasives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
SG2012089686A 2010-06-15 2011-06-08 A splicing technique for fixed abrasives used in chemical mechanical planarization SG186203A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/815,764 US8360823B2 (en) 2010-06-15 2010-06-15 Splicing technique for fixed abrasives used in chemical mechanical planarization
PCT/US2011/039618 WO2011159536A2 (en) 2010-06-15 2011-06-08 A splicing technique for fixed abrasives used in chemical mechanical planarization

Publications (1)

Publication Number Publication Date
SG186203A1 true SG186203A1 (en) 2013-01-30

Family

ID=45096602

Family Applications (1)

Application Number Title Priority Date Filing Date
SG2012089686A SG186203A1 (en) 2010-06-15 2011-06-08 A splicing technique for fixed abrasives used in chemical mechanical planarization

Country Status (7)

Country Link
US (1) US8360823B2 (https=)
JP (1) JP2013533125A (https=)
KR (1) KR20130079480A (https=)
CN (1) CN102939644B (https=)
SG (1) SG186203A1 (https=)
TW (1) TWI535526B (https=)
WO (1) WO2011159536A2 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI544064B (zh) 2010-09-03 2016-08-01 聖高拜磨料有限公司 粘結的磨料物品及形成方法
US9278431B2 (en) 2012-12-31 2016-03-08 Saint-Gobain Abrasives, Inc. Bonded abrasive article and method of grinding
US9102039B2 (en) 2012-12-31 2015-08-11 Saint-Gobain Abrasives, Inc. Bonded abrasive article and method of grinding
JP6064058B2 (ja) 2012-12-31 2017-01-18 サンーゴバン アブレイシブズ，インコーポレイティド 結合研磨物品および研削方法
US20140227945A1 (en) * 2013-02-08 2014-08-14 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical planarization platen
DE112014001102T5 (de) 2013-03-31 2015-11-19 Saint-Gobain Abrasifs Gebundener Schleifartikel und Schleifverfahren
CN106363528A (zh) * 2016-08-30 2017-02-01 天通银厦新材料有限公司 一种针对蓝宝石的固结磨料及研磨工艺
WO2019224040A1 (en) * 2018-05-22 2019-11-28 Asml Holding N.V. Apparatus for and method of in situ clamp surface roughening
WO2020110258A1 (ja) * 2018-11-29 2020-06-04 株式会社大輝 ポリッシングパッドおよびその製造方法
KR102843434B1 (ko) * 2020-01-06 2025-08-08 생-고뱅 어브레이시브즈, 인코포레이티드 연마 용품 및 사용 방법

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US7494519B2 (en) 2005-07-28 2009-02-24 3M Innovative Properties Company Abrasive agglomerate polishing method
US20070128991A1 (en) 2005-12-07 2007-06-07 Yoon Il-Young Fixed abrasive polishing pad, method of preparing the same, and chemical mechanical polishing apparatus including the same
CN101244535B (zh) * 2006-02-15 2012-06-13 应用材料公司 抛光仓

Also Published As

Publication number Publication date
JP2013533125A (ja) 2013-08-22
US8360823B2 (en) 2013-01-29
WO2011159536A3 (en) 2012-04-05
US20110306276A1 (en) 2011-12-15
KR20130079480A (ko) 2013-07-10
CN102939644A (zh) 2013-02-20
CN102939644B (zh) 2015-12-16
WO2011159536A2 (en) 2011-12-22
TWI535526B (zh) 2016-06-01
TW201208810A (en) 2012-03-01

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