KR20130079480A - 화학 기계적 평탄화에 사용되는 고정 연마재를 위한 스플라이싱 기술 - Google Patents

화학 기계적 평탄화에 사용되는 고정 연마재를 위한 스플라이싱 기술 Download PDF

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Publication number
KR20130079480A
KR20130079480A KR1020137000932A KR20137000932A KR20130079480A KR 20130079480 A KR20130079480 A KR 20130079480A KR 1020137000932 A KR1020137000932 A KR 1020137000932A KR 20137000932 A KR20137000932 A KR 20137000932A KR 20130079480 A KR20130079480 A KR 20130079480A
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KR
South Korea
Prior art keywords
abrasive
edge
support pad
edges
major surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020137000932A
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English (en)
Korean (ko)
Inventor
존 제이 가글리아르디
Original Assignee
쓰리엠 이노베이티브 프로퍼티즈 컴파니
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Publication date
Application filed by 쓰리엠 이노베이티브 프로퍼티즈 컴파니 filed Critical 쓰리엠 이노베이티브 프로퍼티즈 컴파니
Publication of KR20130079480A publication Critical patent/KR20130079480A/ko
Withdrawn legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/14—Zonally-graded wheels; Composite wheels comprising different abrasives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020137000932A 2010-06-15 2011-06-08 화학 기계적 평탄화에 사용되는 고정 연마재를 위한 스플라이싱 기술 Withdrawn KR20130079480A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/815,764 US8360823B2 (en) 2010-06-15 2010-06-15 Splicing technique for fixed abrasives used in chemical mechanical planarization
US12/815,764 2010-06-15
PCT/US2011/039618 WO2011159536A2 (en) 2010-06-15 2011-06-08 A splicing technique for fixed abrasives used in chemical mechanical planarization

Publications (1)

Publication Number Publication Date
KR20130079480A true KR20130079480A (ko) 2013-07-10

Family

ID=45096602

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020137000932A Withdrawn KR20130079480A (ko) 2010-06-15 2011-06-08 화학 기계적 평탄화에 사용되는 고정 연마재를 위한 스플라이싱 기술

Country Status (7)

Country Link
US (1) US8360823B2 (https=)
JP (1) JP2013533125A (https=)
KR (1) KR20130079480A (https=)
CN (1) CN102939644B (https=)
SG (1) SG186203A1 (https=)
TW (1) TWI535526B (https=)
WO (1) WO2011159536A2 (https=)

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* Cited by examiner, † Cited by third party
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TWI544064B (zh) 2010-09-03 2016-08-01 聖高拜磨料有限公司 粘結的磨料物品及形成方法
WO2014106156A1 (en) 2012-12-31 2014-07-03 Saint-Gobain Abrasives, Inc. Bonded abrasive article and method of grinding
US9102039B2 (en) 2012-12-31 2015-08-11 Saint-Gobain Abrasives, Inc. Bonded abrasive article and method of grinding
WO2014106157A1 (en) 2012-12-31 2014-07-03 Saint-Gobain Abrasives, Inc. Bonded abrasive article and method of grinding
US20140227945A1 (en) * 2013-02-08 2014-08-14 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical planarization platen
US9833877B2 (en) 2013-03-31 2017-12-05 Saint-Gobain Abrasives, Inc. Bonded abrasive article and method of grinding
CN106363528A (zh) * 2016-08-30 2017-02-01 天通银厦新材料有限公司 一种针对蓝宝石的固结磨料及研磨工艺
CN119556530A (zh) * 2018-05-22 2025-03-04 Asml控股股份有限公司 用于原位夹具表面粗糙化的装置和方法
JP6653514B1 (ja) * 2018-11-29 2020-02-26 株式会社大輝 ポリッシングパッドの製造方法
WO2021141904A1 (en) * 2020-01-06 2021-07-15 Saint-Gobain Abrasives, Inc. Abrasive article and method of use

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US4770671A (en) 1985-12-30 1988-09-13 Minnesota Mining And Manufacturing Company Abrasive grits formed of ceramic containing oxides of aluminum and yttrium, method of making and using the same and products made therewith
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US6453899B1 (en) * 1995-06-07 2002-09-24 Ultimate Abrasive Systems, L.L.C. Method for making a sintered article and products produced thereby
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US6149506A (en) * 1998-10-07 2000-11-21 Keltech Engineering Lapping apparatus and method for high speed lapping with a rotatable abrasive platen
US6062958A (en) * 1997-04-04 2000-05-16 Micron Technology, Inc. Variable abrasive polishing pad for mechanical and chemical-mechanical planarization
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US6261168B1 (en) * 1999-05-21 2001-07-17 Lam Research Corporation Chemical mechanical planarization or polishing pad with sections having varied groove patterns
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JP2006513573A (ja) 2003-01-10 2006-04-20 スリーエム イノベイティブ プロパティズ カンパニー 化学的機械的平坦化用途向けのパッド構成体
JP4456335B2 (ja) * 2003-04-22 2010-04-28 ニッタ・ハース株式会社 研磨装置
TWI254354B (en) * 2004-06-29 2006-05-01 Iv Technologies Co Ltd An inlaid polishing pad and a method of producing the same
US7029375B2 (en) * 2004-08-31 2006-04-18 Tech Semiconductor Pte. Ltd. Retaining ring structure for edge control during chemical-mechanical polishing
TWI284584B (en) * 2005-05-09 2007-08-01 Nat Univ Chung Cheng Method for detecting the using condition and lifetime of the polish pad by sensing the temperature of the grinding interface during the chemical-mechanical polishing process
US7494519B2 (en) 2005-07-28 2009-02-24 3M Innovative Properties Company Abrasive agglomerate polishing method
US20070128991A1 (en) 2005-12-07 2007-06-07 Yoon Il-Young Fixed abrasive polishing pad, method of preparing the same, and chemical mechanical polishing apparatus including the same
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Also Published As

Publication number Publication date
CN102939644A (zh) 2013-02-20
JP2013533125A (ja) 2013-08-22
CN102939644B (zh) 2015-12-16
US8360823B2 (en) 2013-01-29
TW201208810A (en) 2012-03-01
TWI535526B (zh) 2016-06-01
SG186203A1 (en) 2013-01-30
WO2011159536A2 (en) 2011-12-22
US20110306276A1 (en) 2011-12-15
WO2011159536A3 (en) 2012-04-05

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St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

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PC1203 Withdrawal of no request for examination

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P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000