SG181046A1 - Method of electrostatic deposition of particles, abrasive grain and articles - Google Patents
Method of electrostatic deposition of particles, abrasive grain and articles Download PDFInfo
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- SG181046A1 SG181046A1 SG2012038360A SG2012038360A SG181046A1 SG 181046 A1 SG181046 A1 SG 181046A1 SG 2012038360 A SG2012038360 A SG 2012038360A SG 2012038360 A SG2012038360 A SG 2012038360A SG 181046 A1 SG181046 A1 SG 181046A1
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- SG
- Singapore
- Prior art keywords
- particles
- abrasive
- nanoparticles
- particle size
- abrasive grain
- Prior art date
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- 239000002245 particle Substances 0.000 title claims abstract description 138
- 239000006061 abrasive grain Substances 0.000 title claims abstract description 54
- 238000000034 method Methods 0.000 title claims abstract description 50
- 238000004924 electrostatic deposition Methods 0.000 title abstract description 17
- 239000002105 nanoparticle Substances 0.000 claims abstract description 98
- 230000002209 hydrophobic effect Effects 0.000 claims abstract description 24
- 239000011164 primary particle Substances 0.000 claims abstract description 13
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 29
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 27
- 239000000463 material Substances 0.000 claims description 21
- 239000000203 mixture Substances 0.000 claims description 21
- 239000000758 substrate Substances 0.000 claims description 21
- 238000004381 surface treatment Methods 0.000 claims description 21
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 18
- 229910044991 metal oxide Inorganic materials 0.000 claims description 10
- 150000004706 metal oxides Chemical class 0.000 claims description 10
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 10
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- 239000000377 silicon dioxide Substances 0.000 claims description 10
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- 238000010899 nucleation Methods 0.000 description 1
- SLYCYWCVSGPDFR-UHFFFAOYSA-N octadecyltrimethoxysilane Chemical compound CCCCCCCCCCCCCCCCCC[Si](OC)(OC)OC SLYCYWCVSGPDFR-UHFFFAOYSA-N 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- MSRJTTSHWYDFIU-UHFFFAOYSA-N octyltriethoxysilane Chemical compound CCCCCCCC[Si](OCC)(OCC)OCC MSRJTTSHWYDFIU-UHFFFAOYSA-N 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 239000011146 organic particle Substances 0.000 description 1
- 239000011242 organic-inorganic particle Substances 0.000 description 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 1
- XYJRXVWERLGGKC-UHFFFAOYSA-D pentacalcium;hydroxide;triphosphate Chemical compound [OH-].[Ca+2].[Ca+2].[Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O XYJRXVWERLGGKC-UHFFFAOYSA-D 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 150000003009 phosphonic acids Chemical class 0.000 description 1
- 238000004375 physisorption Methods 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001610 polycaprolactone Polymers 0.000 description 1
- 239000004632 polycaprolactone Substances 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- ODGAOXROABLFNM-UHFFFAOYSA-N polynoxylin Chemical compound O=C.NC(N)=O ODGAOXROABLFNM-UHFFFAOYSA-N 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 238000001878 scanning electron micrograph Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000007613 slurry method Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-L succinate(2-) Chemical compound [O-]C(=O)CCC([O-])=O KDYFGRWQOYBRFD-UHFFFAOYSA-L 0.000 description 1
- 229940014800 succinic anhydride Drugs 0.000 description 1
- 150000003871 sulfonates Chemical class 0.000 description 1
- 150000003460 sulfonic acids Chemical class 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004634 thermosetting polymer Substances 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- QORWJWZARLRLPR-UHFFFAOYSA-H tricalcium bis(phosphate) Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O QORWJWZARLRLPR-UHFFFAOYSA-H 0.000 description 1
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 description 1
- PADYPAQRESYCQZ-UHFFFAOYSA-N triethoxy-(4-methylphenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=C(C)C=C1 PADYPAQRESYCQZ-UHFFFAOYSA-N 0.000 description 1
- NMEPHPOFYLLFTK-UHFFFAOYSA-N trimethoxy(octyl)silane Chemical compound CCCCCCCC[Si](OC)(OC)OC NMEPHPOFYLLFTK-UHFFFAOYSA-N 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 1
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical class [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1436—Composite particles, e.g. coated particles
Landscapes
- Chemical & Material Sciences (AREA)
- Composite Materials (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US26628609P | 2009-12-03 | 2009-12-03 | |
| PCT/US2010/056973 WO2011068678A1 (en) | 2009-12-03 | 2010-11-17 | Method of electrostatic deposition of particles, abrasive grain and articles |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG181046A1 true SG181046A1 (en) | 2012-07-30 |
Family
ID=43535863
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG2012038360A SG181046A1 (en) | 2009-12-03 | 2010-11-17 | Method of electrostatic deposition of particles, abrasive grain and articles |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8894466B2 (enExample) |
| EP (1) | EP2507336B1 (enExample) |
| JP (1) | JP5658761B2 (enExample) |
| CN (1) | CN102639665B (enExample) |
| BR (1) | BR112012013350A2 (enExample) |
| SG (1) | SG181046A1 (enExample) |
| WO (1) | WO2011068678A1 (enExample) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8834618B2 (en) | 2009-12-03 | 2014-09-16 | 3M Innovative Properties Company | Method of inhibiting water adsorption of powder by addition of hydrophobic nanoparticles |
| EP2915859A4 (en) * | 2012-10-31 | 2015-10-28 | Fujimi Inc | POLISHING COMPOSITION |
| KR20160023851A (ko) * | 2013-06-28 | 2016-03-03 | 생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드 | 니켈 코팅된 다이아몬드 입자들 및 상기 입자들 제조 방법 |
| CN105636746B (zh) * | 2013-10-18 | 2017-10-13 | 3M创新有限公司 | 涂覆磨料制品及其制备方法 |
| JP2015147276A (ja) * | 2014-02-07 | 2015-08-20 | 株式会社中村超硬 | ワイヤソー |
| CN104785349B (zh) * | 2015-04-29 | 2017-05-03 | 浙江冠旗纳米科技有限公司 | 纳米级固体粉末高效制备方法 |
| CN104947169B (zh) * | 2015-06-19 | 2017-05-17 | 浙江大学 | 一种超疏水二氧化硅薄膜的制备方法 |
| EP3515662B1 (en) | 2016-09-26 | 2024-01-10 | 3M Innovative Properties Company | Nonwoven abrasive articles having electrostatically-oriented abrasive particles and methods of making same |
| WO2018191865A1 (en) | 2017-04-18 | 2018-10-25 | 3M Innovative Properties Company | Air filter media with post-pleat-deposited sorbent particles |
| EP3768655A1 (en) * | 2018-03-22 | 2021-01-27 | 3M Innovative Properties Company | Modified aluminum nitride particles and methods of making the same |
| EP3768794B1 (en) | 2018-03-22 | 2021-04-28 | 3M Innovative Properties Company | Charge-modified particles and methods of making the same |
| WO2021046150A1 (en) * | 2019-09-05 | 2021-03-11 | Saint-Gobain Abrasives, Inc. | Coated abrasives having an improved supersize coating |
| US11685849B2 (en) | 2019-10-11 | 2023-06-27 | Saint-Gobain Abrasives, Inc. | Abrasive particle including coating, abrasive article including the abrasive particles, and method of forming |
| WO2021214576A1 (en) * | 2020-04-21 | 2021-10-28 | 3M Innovative Properties Company | Surface-modified nanoparticle additives in printable particle-containing compositions |
| KR20220130544A (ko) * | 2021-03-18 | 2022-09-27 | 삼성에스디아이 주식회사 | 텅스텐 패턴 웨이퍼 연마용 cmp 슬러리 조성물 및 이를 이용한 텅스텐 패턴 웨이퍼의 연마 방법 |
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-
2010
- 2010-11-17 CN CN201080053959.1A patent/CN102639665B/zh active Active
- 2010-11-17 BR BR112012013350A patent/BR112012013350A2/pt not_active Application Discontinuation
- 2010-11-17 EP EP10785552.0A patent/EP2507336B1/en active Active
- 2010-11-17 JP JP2012542069A patent/JP5658761B2/ja not_active Expired - Fee Related
- 2010-11-17 US US13/513,207 patent/US8894466B2/en active Active
- 2010-11-17 WO PCT/US2010/056973 patent/WO2011068678A1/en not_active Ceased
- 2010-11-17 SG SG2012038360A patent/SG181046A1/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2011068678A1 (en) | 2011-06-09 |
| JP5658761B2 (ja) | 2015-01-28 |
| US8894466B2 (en) | 2014-11-25 |
| BR112012013350A2 (pt) | 2017-12-12 |
| CN102639665B (zh) | 2015-04-01 |
| EP2507336A1 (en) | 2012-10-10 |
| JP2013512786A (ja) | 2013-04-18 |
| CN102639665A (zh) | 2012-08-15 |
| EP2507336B1 (en) | 2017-08-09 |
| US20120252321A1 (en) | 2012-10-04 |
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