SG173501A1 - Polishing composition for nickel-phosphorous memory disks - Google Patents
Polishing composition for nickel-phosphorous memory disks Download PDFInfo
- Publication number
- SG173501A1 SG173501A1 SG2011055548A SG2011055548A SG173501A1 SG 173501 A1 SG173501 A1 SG 173501A1 SG 2011055548 A SG2011055548 A SG 2011055548A SG 2011055548 A SG2011055548 A SG 2011055548A SG 173501 A1 SG173501 A1 SG 173501A1
- Authority
- SG
- Singapore
- Prior art keywords
- polishing composition
- polishing
- substrate
- average particle
- alumina
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 182
- 239000000203 mixture Substances 0.000 title claims abstract description 156
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims abstract description 163
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 70
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 56
- 235000006408 oxalic acid Nutrition 0.000 claims abstract description 54
- 239000000758 substrate Substances 0.000 claims abstract description 46
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 claims abstract description 39
- 239000011975 tartaric acid Substances 0.000 claims abstract description 39
- 235000002906 tartaric acid Nutrition 0.000 claims abstract description 39
- 238000000034 method Methods 0.000 claims abstract description 37
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 33
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 27
- 239000007800 oxidant agent Substances 0.000 claims abstract description 22
- 230000003115 biocidal effect Effects 0.000 claims abstract description 19
- 239000003139 biocide Substances 0.000 claims abstract description 19
- 239000002736 nonionic surfactant Substances 0.000 claims abstract description 15
- 239000002245 particle Substances 0.000 claims description 41
- 239000004094 surface-active agent Substances 0.000 claims description 12
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical group OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 8
- 229910052739 hydrogen Inorganic materials 0.000 claims 1
- 239000001257 hydrogen Substances 0.000 claims 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 1
- -1 optionally Chemical compound 0.000 abstract description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 4
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052759 nickel Inorganic materials 0.000 abstract description 2
- 239000012141 concentrate Substances 0.000 description 15
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 14
- 229910052760 oxygen Inorganic materials 0.000 description 14
- 239000001301 oxygen Substances 0.000 description 14
- 239000000126 substance Substances 0.000 description 13
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 10
- 239000002253 acid Substances 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- 239000002243 precursor Substances 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 229910044991 metal oxide Inorganic materials 0.000 description 5
- 150000004706 metal oxides Chemical class 0.000 description 5
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000011368 organic material Substances 0.000 description 4
- 238000007517 polishing process Methods 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 230000003746 surface roughness Effects 0.000 description 4
- 239000002699 waste material Substances 0.000 description 4
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 3
- 238000005305 interferometry Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000006179 pH buffering agent Substances 0.000 description 3
- KFSLWBXXFJQRDL-UHFFFAOYSA-N Peracetic acid Chemical compound CC(=O)OO KFSLWBXXFJQRDL-UHFFFAOYSA-N 0.000 description 2
- 239000006172 buffering agent Substances 0.000 description 2
- 239000001569 carbon dioxide Substances 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- 229910021485 fumed silica Inorganic materials 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000000725 suspension Substances 0.000 description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 241000282326 Felis catus Species 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 235000005505 Ziziphus oenoplia Nutrition 0.000 description 1
- 244000104547 Ziziphus oenoplia Species 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 150000001242 acetic acid derivatives Chemical class 0.000 description 1
- 239000000908 ammonium hydroxide Substances 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- LIMQQADUEULBSO-UHFFFAOYSA-N butyl isothiocyanate Chemical compound CCCCN=C=S LIMQQADUEULBSO-UHFFFAOYSA-N 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- PEYVWSJAZONVQK-UHFFFAOYSA-N hydroperoxy(oxo)borane Chemical compound OOB=O PEYVWSJAZONVQK-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000001050 lubricating effect Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910001510 metal chloride Inorganic materials 0.000 description 1
- 238000000386 microscopy Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- FHHJDRFHHWUPDG-UHFFFAOYSA-N peroxysulfuric acid Chemical compound OOS(O)(=O)=O FHHJDRFHHWUPDG-UHFFFAOYSA-N 0.000 description 1
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 description 1
- 235000021317 phosphate Nutrition 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- AQLJVWUFPCUVLO-UHFFFAOYSA-N urea hydrogen peroxide Chemical compound OO.NC(N)=O AQLJVWUFPCUVLO-UHFFFAOYSA-N 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/364,937 US8226841B2 (en) | 2009-02-03 | 2009-02-03 | Polishing composition for nickel-phosphorous memory disks |
| PCT/US2010/022312 WO2010090928A2 (en) | 2009-02-03 | 2010-01-28 | Polishing composition for nickel-phosphorous memory disks |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG173501A1 true SG173501A1 (en) | 2011-09-29 |
Family
ID=42396842
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG2011055548A SG173501A1 (en) | 2009-02-03 | 2010-01-28 | Polishing composition for nickel-phosphorous memory disks |
| SG2012082673A SG185977A1 (en) | 2009-02-03 | 2010-01-28 | Polishing composition for nickel-phosphorous memory disks |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG2012082673A SG185977A1 (en) | 2009-02-03 | 2010-01-28 | Polishing composition for nickel-phosphorous memory disks |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US8226841B2 (enExample) |
| JP (1) | JP5491530B2 (enExample) |
| CN (1) | CN102361950B (enExample) |
| MY (2) | MY159259A (enExample) |
| SG (2) | SG173501A1 (enExample) |
| TW (1) | TWI433903B (enExample) |
| WO (1) | WO2010090928A2 (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9039914B2 (en) | 2012-05-23 | 2015-05-26 | Cabot Microelectronics Corporation | Polishing composition for nickel-phosphorous-coated memory disks |
| US8518135B1 (en) * | 2012-08-27 | 2013-08-27 | Cabot Microelectronics Corporation | Polishing composition containing hybrid abrasive for nickel-phosphorous coated memory disks |
| US9196283B1 (en) * | 2013-03-13 | 2015-11-24 | Western Digital (Fremont), Llc | Method for providing a magnetic recording transducer using a chemical buffer |
| US8896964B1 (en) | 2013-05-16 | 2014-11-25 | Seagate Technology Llc | Enlarged substrate for magnetic recording medium |
| WO2015057433A1 (en) | 2013-10-18 | 2015-04-23 | Cabot Microelectronics Corporation | Polishing composition and method for nickel-phosphorous coated memory disks |
| US10358579B2 (en) * | 2013-12-03 | 2019-07-23 | Cabot Microelectronics Corporation | CMP compositions and methods for polishing nickel phosphorous surfaces |
| US9401104B2 (en) * | 2014-05-05 | 2016-07-26 | Cabot Microelectronics Corporation | Polishing composition for edge roll-off improvement |
| MY187526A (en) * | 2016-06-07 | 2021-09-27 | Cmc Mat Inc | Chemical-mechanical processing slurry and methods for processing a nickel substrate surface |
| WO2018191485A1 (en) * | 2017-04-14 | 2018-10-18 | Cabot Microelectronics Corporation | Chemical-mechanical processing slurry and methods for processing a nickel substrate surface |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0284485A (ja) | 1988-09-20 | 1990-03-26 | Showa Denko Kk | アルミニウム磁気ディスク研磨用組成物 |
| US5693239A (en) * | 1995-10-10 | 1997-12-02 | Rodel, Inc. | Polishing slurries comprising two abrasive components and methods for their use |
| JPH09316430A (ja) | 1996-03-29 | 1997-12-09 | Showa Denko Kk | 磁気ディスク基板研磨用組成物 |
| JP2000160139A (ja) * | 1998-12-01 | 2000-06-13 | Fujimi Inc | 研磨用組成物およびそれを用いた研磨方法 |
| US6471884B1 (en) * | 2000-04-04 | 2002-10-29 | Cabot Microelectronics Corporation | Method for polishing a memory or rigid disk with an amino acid-containing composition |
| US6569215B2 (en) * | 2000-04-17 | 2003-05-27 | Showa Denko Kabushiki Kaisha | Composition for polishing magnetic disk substrate |
| US6976905B1 (en) * | 2000-06-16 | 2005-12-20 | Cabot Microelectronics Corporation | Method for polishing a memory or rigid disk with a phosphate ion-containing polishing system |
| US6468137B1 (en) * | 2000-09-07 | 2002-10-22 | Cabot Microelectronics Corporation | Method for polishing a memory or rigid disk with an oxidized halide-containing polishing system |
| US6461227B1 (en) * | 2000-10-17 | 2002-10-08 | Cabot Microelectronics Corporation | Method of polishing a memory or rigid disk with an ammonia-and/or halide-containing composition |
| JP3894535B2 (ja) * | 2001-07-13 | 2007-03-22 | 松下電器産業株式会社 | 不要輻射解析方法および不要輻射解析装置 |
| JP3680022B2 (ja) * | 2001-12-07 | 2005-08-10 | 東洋鋼鈑株式会社 | 磁気ディスク基板研磨液 |
| US6755721B2 (en) * | 2002-02-22 | 2004-06-29 | Saint-Gobain Ceramics And Plastics, Inc. | Chemical mechanical polishing of nickel phosphorous alloys |
| US20050282387A1 (en) * | 2002-06-07 | 2005-12-22 | Takashi Sato | Metal polish composition, polishing method using the composition and method for producing wafer using the polishing method |
| US6896591B2 (en) * | 2003-02-11 | 2005-05-24 | Cabot Microelectronics Corporation | Mixed-abrasive polishing composition and method for using the same |
| JP4339034B2 (ja) * | 2003-07-01 | 2009-10-07 | 花王株式会社 | 研磨液組成物 |
| JP4202201B2 (ja) * | 2003-07-03 | 2008-12-24 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| JP4707311B2 (ja) * | 2003-08-08 | 2011-06-22 | 花王株式会社 | 磁気ディスク用基板 |
| US20050090104A1 (en) * | 2003-10-27 | 2005-04-28 | Kai Yang | Slurry compositions for chemical mechanical polishing of copper and barrier films |
| US7419911B2 (en) * | 2003-11-10 | 2008-09-02 | Ekc Technology, Inc. | Compositions and methods for rapidly removing overfilled substrates |
| JP4644434B2 (ja) * | 2004-03-24 | 2011-03-02 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| US7524347B2 (en) * | 2004-10-28 | 2009-04-28 | Cabot Microelectronics Corporation | CMP composition comprising surfactant |
| US7897061B2 (en) * | 2006-02-01 | 2011-03-01 | Cabot Microelectronics Corporation | Compositions and methods for CMP of phase change alloys |
-
2009
- 2009-02-03 US US12/364,937 patent/US8226841B2/en active Active
-
2010
- 2010-01-22 TW TW099101818A patent/TWI433903B/zh active
- 2010-01-28 WO PCT/US2010/022312 patent/WO2010090928A2/en not_active Ceased
- 2010-01-28 SG SG2011055548A patent/SG173501A1/en unknown
- 2010-01-28 CN CN201080012745.XA patent/CN102361950B/zh not_active Expired - Fee Related
- 2010-01-28 MY MYPI2013000774A patent/MY159259A/en unknown
- 2010-01-28 JP JP2011548272A patent/JP5491530B2/ja active Active
- 2010-01-28 SG SG2012082673A patent/SG185977A1/en unknown
- 2010-01-28 MY MYPI2011003604A patent/MY149451A/en unknown
-
2012
- 2012-07-11 US US13/546,128 patent/US8557137B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| WO2010090928A2 (en) | 2010-08-12 |
| CN102361950B (zh) | 2014-05-28 |
| JP5491530B2 (ja) | 2014-05-14 |
| JP2012516911A (ja) | 2012-07-26 |
| TW201038691A (en) | 2010-11-01 |
| MY149451A (en) | 2013-08-30 |
| US20120273715A1 (en) | 2012-11-01 |
| TWI433903B (zh) | 2014-04-11 |
| SG185977A1 (en) | 2012-12-28 |
| CN102361950A (zh) | 2012-02-22 |
| WO2010090928A3 (en) | 2010-11-18 |
| US8557137B2 (en) | 2013-10-15 |
| MY159259A (en) | 2016-12-30 |
| US8226841B2 (en) | 2012-07-24 |
| US20100193470A1 (en) | 2010-08-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| SG173501A1 (en) | Polishing composition for nickel-phosphorous memory disks | |
| EP2311074B1 (en) | Method of polishing nickel-phosphorous | |
| US7666238B2 (en) | Polishing composition | |
| US9330703B2 (en) | Polishing composition for nickel-phosphorous memory disks | |
| CN102337080B (zh) | 包含表面活性剂的化学机械抛光组合物 | |
| US6454821B1 (en) | Polishing composition and method | |
| JP5503065B2 (ja) | ニッケル−リン被覆メモリーディスクのためのハイブリッド研磨材を含む研磨組成物 | |
| CN100497509C (zh) | 抛光组合物和抛光方法 | |
| WO2009089026A2 (en) | Composition and method for polishing nickel-phosphorous-coated aluminum hard disks | |
| JP2018172505A (ja) | マグネシウム又はマグネシウム合金の研磨用組成物及びそれを用いた研磨方法 | |
| WO2015108729A1 (en) | Composition and method for polishing memory hard disks | |
| JP2005063531A (ja) | 磁気ディスク用研磨液組成物 | |
| WO2018191454A1 (en) | Chemical-mechanical processing slurry and methods | |
| JP2023051383A (ja) | 研磨用組成物および磁気ディスク基板の製造方法 | |
| JP2005063532A (ja) | 磁気ディスク用研磨液組成物 |