JP5491530B2 - ニッケル−リンメモリーディスク用の研磨組成物 - Google Patents

ニッケル−リンメモリーディスク用の研磨組成物 Download PDF

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Publication number
JP5491530B2
JP5491530B2 JP2011548272A JP2011548272A JP5491530B2 JP 5491530 B2 JP5491530 B2 JP 5491530B2 JP 2011548272 A JP2011548272 A JP 2011548272A JP 2011548272 A JP2011548272 A JP 2011548272A JP 5491530 B2 JP5491530 B2 JP 5491530B2
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Japan
Prior art keywords
polishing composition
polishing
silica
alumina
average particle
Prior art date
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JP2011548272A
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English (en)
Japanese (ja)
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JP2012516911A (ja
JP2012516911A5 (enExample
Inventor
パラニサミー チナタンビ セルバライ
シリワーダン ハレシュ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CMC Materials LLC
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Cabot Microelectronics Corp
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Publication date
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Publication of JP2012516911A publication Critical patent/JP2012516911A/ja
Publication of JP2012516911A5 publication Critical patent/JP2012516911A5/ja
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
JP2011548272A 2009-02-03 2010-01-28 ニッケル−リンメモリーディスク用の研磨組成物 Active JP5491530B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/364,937 2009-02-03
US12/364,937 US8226841B2 (en) 2009-02-03 2009-02-03 Polishing composition for nickel-phosphorous memory disks
PCT/US2010/022312 WO2010090928A2 (en) 2009-02-03 2010-01-28 Polishing composition for nickel-phosphorous memory disks

Publications (3)

Publication Number Publication Date
JP2012516911A JP2012516911A (ja) 2012-07-26
JP2012516911A5 JP2012516911A5 (enExample) 2013-02-28
JP5491530B2 true JP5491530B2 (ja) 2014-05-14

Family

ID=42396842

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011548272A Active JP5491530B2 (ja) 2009-02-03 2010-01-28 ニッケル−リンメモリーディスク用の研磨組成物

Country Status (7)

Country Link
US (2) US8226841B2 (enExample)
JP (1) JP5491530B2 (enExample)
CN (1) CN102361950B (enExample)
MY (2) MY159259A (enExample)
SG (2) SG173501A1 (enExample)
TW (1) TWI433903B (enExample)
WO (1) WO2010090928A2 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9039914B2 (en) 2012-05-23 2015-05-26 Cabot Microelectronics Corporation Polishing composition for nickel-phosphorous-coated memory disks
US8518135B1 (en) * 2012-08-27 2013-08-27 Cabot Microelectronics Corporation Polishing composition containing hybrid abrasive for nickel-phosphorous coated memory disks
US9196283B1 (en) * 2013-03-13 2015-11-24 Western Digital (Fremont), Llc Method for providing a magnetic recording transducer using a chemical buffer
US8896964B1 (en) 2013-05-16 2014-11-25 Seagate Technology Llc Enlarged substrate for magnetic recording medium
WO2015057433A1 (en) 2013-10-18 2015-04-23 Cabot Microelectronics Corporation Polishing composition and method for nickel-phosphorous coated memory disks
US10358579B2 (en) * 2013-12-03 2019-07-23 Cabot Microelectronics Corporation CMP compositions and methods for polishing nickel phosphorous surfaces
US9401104B2 (en) * 2014-05-05 2016-07-26 Cabot Microelectronics Corporation Polishing composition for edge roll-off improvement
MY187526A (en) * 2016-06-07 2021-09-27 Cmc Mat Inc Chemical-mechanical processing slurry and methods for processing a nickel substrate surface
WO2018191485A1 (en) * 2017-04-14 2018-10-18 Cabot Microelectronics Corporation Chemical-mechanical processing slurry and methods for processing a nickel substrate surface

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0284485A (ja) 1988-09-20 1990-03-26 Showa Denko Kk アルミニウム磁気ディスク研磨用組成物
US5693239A (en) * 1995-10-10 1997-12-02 Rodel, Inc. Polishing slurries comprising two abrasive components and methods for their use
JPH09316430A (ja) 1996-03-29 1997-12-09 Showa Denko Kk 磁気ディスク基板研磨用組成物
JP2000160139A (ja) * 1998-12-01 2000-06-13 Fujimi Inc 研磨用組成物およびそれを用いた研磨方法
US6471884B1 (en) * 2000-04-04 2002-10-29 Cabot Microelectronics Corporation Method for polishing a memory or rigid disk with an amino acid-containing composition
US6569215B2 (en) * 2000-04-17 2003-05-27 Showa Denko Kabushiki Kaisha Composition for polishing magnetic disk substrate
US6976905B1 (en) * 2000-06-16 2005-12-20 Cabot Microelectronics Corporation Method for polishing a memory or rigid disk with a phosphate ion-containing polishing system
US6468137B1 (en) * 2000-09-07 2002-10-22 Cabot Microelectronics Corporation Method for polishing a memory or rigid disk with an oxidized halide-containing polishing system
US6461227B1 (en) * 2000-10-17 2002-10-08 Cabot Microelectronics Corporation Method of polishing a memory or rigid disk with an ammonia-and/or halide-containing composition
JP3894535B2 (ja) * 2001-07-13 2007-03-22 松下電器産業株式会社 不要輻射解析方法および不要輻射解析装置
JP3680022B2 (ja) * 2001-12-07 2005-08-10 東洋鋼鈑株式会社 磁気ディスク基板研磨液
US6755721B2 (en) * 2002-02-22 2004-06-29 Saint-Gobain Ceramics And Plastics, Inc. Chemical mechanical polishing of nickel phosphorous alloys
US20050282387A1 (en) * 2002-06-07 2005-12-22 Takashi Sato Metal polish composition, polishing method using the composition and method for producing wafer using the polishing method
US6896591B2 (en) * 2003-02-11 2005-05-24 Cabot Microelectronics Corporation Mixed-abrasive polishing composition and method for using the same
JP4339034B2 (ja) * 2003-07-01 2009-10-07 花王株式会社 研磨液組成物
JP4202201B2 (ja) * 2003-07-03 2008-12-24 株式会社フジミインコーポレーテッド 研磨用組成物
JP4707311B2 (ja) * 2003-08-08 2011-06-22 花王株式会社 磁気ディスク用基板
US20050090104A1 (en) * 2003-10-27 2005-04-28 Kai Yang Slurry compositions for chemical mechanical polishing of copper and barrier films
US7419911B2 (en) * 2003-11-10 2008-09-02 Ekc Technology, Inc. Compositions and methods for rapidly removing overfilled substrates
JP4644434B2 (ja) * 2004-03-24 2011-03-02 株式会社フジミインコーポレーテッド 研磨用組成物
US7524347B2 (en) * 2004-10-28 2009-04-28 Cabot Microelectronics Corporation CMP composition comprising surfactant
US7897061B2 (en) * 2006-02-01 2011-03-01 Cabot Microelectronics Corporation Compositions and methods for CMP of phase change alloys

Also Published As

Publication number Publication date
WO2010090928A2 (en) 2010-08-12
CN102361950B (zh) 2014-05-28
SG173501A1 (en) 2011-09-29
JP2012516911A (ja) 2012-07-26
TW201038691A (en) 2010-11-01
MY149451A (en) 2013-08-30
US20120273715A1 (en) 2012-11-01
TWI433903B (zh) 2014-04-11
SG185977A1 (en) 2012-12-28
CN102361950A (zh) 2012-02-22
WO2010090928A3 (en) 2010-11-18
US8557137B2 (en) 2013-10-15
MY159259A (en) 2016-12-30
US8226841B2 (en) 2012-07-24
US20100193470A1 (en) 2010-08-05

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