SG171350A1 - Device and method for at least partially encapsulating a closed flat carrier with electronic components - Google Patents
Device and method for at least partially encapsulating a closed flat carrier with electronic components Download PDFInfo
- Publication number
- SG171350A1 SG171350A1 SG2011036100A SG2011036100A SG171350A1 SG 171350 A1 SG171350 A1 SG 171350A1 SG 2011036100 A SG2011036100 A SG 2011036100A SG 2011036100 A SG2011036100 A SG 2011036100A SG 171350 A1 SG171350 A1 SG 171350A1
- Authority
- SG
- Singapore
- Prior art keywords
- carrier
- encapsulating material
- mould
- encapsulating
- electronic components
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 29
- 239000000463 material Substances 0.000 claims abstract description 110
- 239000004065 semiconductor Substances 0.000 claims description 26
- 239000000969 carrier Substances 0.000 claims description 20
- 238000005538 encapsulation Methods 0.000 claims description 16
- 239000012858 resilient material Substances 0.000 claims description 6
- 241000724291 Tobacco streak virus Species 0.000 claims 1
- 239000010410 layer Substances 0.000 description 29
- 239000011324 bead Substances 0.000 description 17
- 235000012431 wafers Nutrition 0.000 description 16
- 229910000679 solder Inorganic materials 0.000 description 8
- 239000007788 liquid Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000006399 behavior Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000003698 laser cutting Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 238000013022 venting Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Casings For Electric Apparatus (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL2002240A NL2002240C2 (nl) | 2008-11-21 | 2008-11-21 | Inrichting en werkwijze voor het tenminste gedeeltelijk omhullen van een gesloten vlakke drager met elektronische componenten. |
| PCT/NL2009/050687 WO2010059042A1 (en) | 2008-11-21 | 2009-11-17 | Device and method for at least partially encapsulating a closed flat carrier with electronic components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG171350A1 true SG171350A1 (en) | 2011-07-28 |
Family
ID=40602956
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG2011036100A SG171350A1 (en) | 2008-11-21 | 2009-11-17 | Device and method for at least partially encapsulating a closed flat carrier with electronic components |
Country Status (7)
| Country | Link |
|---|---|
| KR (2) | KR20160121607A (zh) |
| CN (1) | CN102224582B (zh) |
| MY (1) | MY172851A (zh) |
| NL (1) | NL2002240C2 (zh) |
| SG (1) | SG171350A1 (zh) |
| TW (1) | TWI581379B (zh) |
| WO (1) | WO2010059042A1 (zh) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104916549B (zh) * | 2014-10-31 | 2018-08-14 | 深圳市东方聚成科技有限公司 | 一种具有弧边的指纹识别芯片的封装设备及封装和切割方法 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1060559A (zh) * | 1990-10-10 | 1992-04-22 | 三星电子株式会社 | 用带有倾斜浇口的设备将半导体器件密封在模制物料中 |
| US6881611B1 (en) * | 1996-07-12 | 2005-04-19 | Fujitsu Limited | Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the device |
| KR100484962B1 (ko) * | 1996-07-12 | 2005-04-25 | 후지쯔 가부시끼가이샤 | 반도체 장치의 제조 방법 및 반도체 장치 |
| US6117382A (en) * | 1998-02-05 | 2000-09-12 | Micron Technology, Inc. | Method for encasing array packages |
| US6469399B2 (en) * | 1999-02-08 | 2002-10-22 | Advanced Semiconductor Engineering, Inc. | Semiconductor package |
| US6294825B1 (en) * | 1999-02-22 | 2001-09-25 | Micron Technology, Inc. | Asymmetrical mold of multiple-part matrixes |
| JP3494586B2 (ja) * | 1999-03-26 | 2004-02-09 | アピックヤマダ株式会社 | 樹脂封止装置及び樹脂封止方法 |
| JP2001212848A (ja) * | 2000-02-04 | 2001-08-07 | Towa Corp | 樹脂成形用金型 |
| US6838319B1 (en) * | 2000-08-31 | 2005-01-04 | Micron Technology, Inc. | Transfer molding and underfilling method and apparatus including orienting the active surface of a semiconductor substrate substantially vertically |
| US7132311B2 (en) * | 2002-07-26 | 2006-11-07 | Intel Corporation | Encapsulation of a stack of semiconductor dice |
| US6869824B2 (en) * | 2002-10-29 | 2005-03-22 | Ultratera Corporation | Fabrication method of window-type ball grid array semiconductor package |
| US20040158978A1 (en) * | 2003-02-14 | 2004-08-19 | Lee Sang-Hyeop | Molding method and mold for encapsulating both sides of PCB module with wafer level package mounted PCB |
| US20040178514A1 (en) * | 2003-03-12 | 2004-09-16 | Lee Sang-Hyeop | Method of encapsulating semiconductor devices on a printed circuit board, and a printed circuit board for use in the method |
| TWI234211B (en) * | 2003-12-26 | 2005-06-11 | Advanced Semiconductor Eng | Method for forming an underfilling layer on a bumped wafer |
| DE112004002527T5 (de) * | 2004-01-06 | 2008-03-06 | Infineon Technologies Ag | Verfahren zum Verkapseln von Schaltkreischips |
| TWI265613B (en) * | 2005-08-24 | 2006-11-01 | Advanced Semiconductor Eng | Heat sink |
| TWI300613B (en) * | 2006-03-15 | 2008-09-01 | Advanced Semiconductor Eng | Molding apparatus for encapsulating semiconductor devices |
| JP4155999B2 (ja) * | 2006-06-02 | 2008-09-24 | 株式会社ソニー・コンピュータエンタテインメント | 半導体装置および半導体装置の製造方法 |
-
2008
- 2008-11-21 NL NL2002240A patent/NL2002240C2/nl active
-
2009
- 2009-11-17 KR KR1020167028115A patent/KR20160121607A/ko not_active Application Discontinuation
- 2009-11-17 SG SG2011036100A patent/SG171350A1/en unknown
- 2009-11-17 WO PCT/NL2009/050687 patent/WO2010059042A1/en active Application Filing
- 2009-11-17 CN CN200980146706.6A patent/CN102224582B/zh active Active
- 2009-11-17 KR KR1020117014008A patent/KR101947610B1/ko active IP Right Grant
- 2009-11-17 MY MYPI2011002236A patent/MY172851A/en unknown
- 2009-11-19 TW TW098139281A patent/TWI581379B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| MY172851A (en) | 2019-12-12 |
| NL2002240C2 (nl) | 2010-05-25 |
| CN102224582A (zh) | 2011-10-19 |
| KR101947610B1 (ko) | 2019-02-14 |
| TW201029120A (en) | 2010-08-01 |
| TWI581379B (zh) | 2017-05-01 |
| KR20110095375A (ko) | 2011-08-24 |
| CN102224582B (zh) | 2015-04-22 |
| WO2010059042A1 (en) | 2010-05-27 |
| KR20160121607A (ko) | 2016-10-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI634627B (zh) | 樹脂成型裝置、樹脂成型方法以及樹脂成型模具 | |
| JP6491508B2 (ja) | 樹脂封止装置及び樹脂成形品の製造方法 | |
| TWI641471B (zh) | Resin molding die and resin molding method | |
| KR101257518B1 (ko) | 컨디셔닝 가스를 이용한 전자 소자의 캡슐화 방법 및 장치 | |
| KR20130066654A (ko) | Ｆｌｉｐ 칩 패키징 내에 몰딩된 언더필을 위한 장치 및 방법 | |
| KR102182269B1 (ko) | 적어도 2개의 개별적인 제어가능 액추에이터를 이용하여 전자 컴포넌트를 봉지하기 위한 프레스, 액추에이터 세트, 및 방법 | |
| US20160151946A1 (en) | Molded article production system and molded article production method | |
| JP2004216558A (ja) | 電子部品の樹脂封止成形方法及び装置 | |
| KR101964034B1 (ko) | 기판상에 균일한 클램핑 압력을 가하기 위한 몰딩 시스템 | |
| JP6804409B2 (ja) | 樹脂成形装置及び樹脂成形品製造方法 | |
| JP2002036270A (ja) | 樹脂封止方法及び樹脂封止装置 | |
| CN110731006B (zh) | 用于晶片阶层封装的方法及装置 | |
| SG171350A1 (en) | Device and method for at least partially encapsulating a closed flat carrier with electronic components | |
| KR20090067791A (ko) | 템플릿의 캐버티들에 용융된 솔더를 주입하는 방법 및 이를수행하기 위한 장치 | |
| KR20170095211A (ko) | 전자 컴포넌트들을 갖는 캐리어 및 몰딩된 제품의 제어된 오버몰딩을 위한 몰드, 몰딩 장치 및 방법 | |
| WO2005120799A1 (en) | Method and device for controllable encapsulation of electronic components | |
| JP2003007951A (ja) | リードフレームおよび樹脂封止型半導体装置の製造方法 | |
| TWI648140B (zh) | 使用微柱封裝位於載體上的電子元件的模具、模壓機以及方法 | |
| CN106653655A (zh) | 实现多芯片引脚再布线的塑封模具和工艺方法 | |
| KR20170022310A (ko) | Ｌｅｄ 패키지 공정용 보이드 제거 및 플라즈마 세정 복합 장치 | |
| JP7203926B1 (ja) | 樹脂成形用成形型、樹脂成形装置、及び樹脂成形品の製造方法 | |
| US7723165B2 (en) | Method of forming component package | |
| KR102125263B1 (ko) | 전자 부품의 몰딩 및 표면 처리 방법, 및 이 방법에 의해 제조된 전자 부품 | |
| WO2005043612A1 (en) | Method and device for encapsulating electronic components using a flexible pressure element | |
| KR20070031331A (ko) | 전자 부품들의 조절 가능한 캡슐화를 위한 방법 및 장치 |