SG164293A1 - System and method for inspecting a wafer - Google Patents

System and method for inspecting a wafer

Info

Publication number
SG164293A1
SG164293A1 SG200901110-7A SG2009011107A SG164293A1 SG 164293 A1 SG164293 A1 SG 164293A1 SG 2009011107 A SG2009011107 A SG 2009011107A SG 164293 A1 SG164293 A1 SG 164293A1
Authority
SG
Singapore
Prior art keywords
wafer
images
inspecting
pixels
image
Prior art date
Application number
SG200901110-7A
Other languages
English (en)
Inventor
Ajharali Amanullah
Albert Archwamety
Guo Hongfu
Original Assignee
Semiconductor Technologies & Instruments Pte
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from SG200900229-6A external-priority patent/SG163442A1/en
Application filed by Semiconductor Technologies & Instruments Pte filed Critical Semiconductor Technologies & Instruments Pte
Priority to SG200901110-7A priority Critical patent/SG164293A1/en
Priority to MYPI2010000165A priority patent/MY188165A/en
Priority to CN201010004240.0A priority patent/CN101853797B/zh
Priority to US12/657,076 priority patent/US8885918B2/en
Priority to PCT/SG2010/000006 priority patent/WO2010082902A2/en
Priority to EP10731446.0A priority patent/EP2387796B1/en
Priority to PT107314460T priority patent/PT2387796T/pt
Priority to KR1020100003273A priority patent/KR101646743B1/ko
Priority to TW099100877A priority patent/TWI551855B/zh
Priority to JP2011545327A priority patent/JP5934874B2/ja
Publication of SG164293A1 publication Critical patent/SG164293A1/en
Priority to HK11103452.2A priority patent/HK1149367B/xx
Priority to IL213946A priority patent/IL213946A/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/40—Analysis of texture
    • G06T7/41—Analysis of texture based on statistical description of texture
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8822—Dark field detection
    • G01N2021/8825—Separate detection of dark field and bright field
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10141—Special mode during image acquisition
    • G06T2207/10152—Varying illumination
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20212—Image combination
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Theoretical Computer Science (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Pathology (AREA)
  • Analytical Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Probability & Statistics with Applications (AREA)
  • Quality & Reliability (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
SG200901110-7A 2009-01-13 2009-02-16 System and method for inspecting a wafer SG164293A1 (en)

Priority Applications (12)

Application Number Priority Date Filing Date Title
SG200901110-7A SG164293A1 (en) 2009-01-13 2009-02-16 System and method for inspecting a wafer
JP2011545327A JP5934874B2 (ja) 2009-01-13 2010-01-13 ウェーハを検査するためのシステム及び方法
PCT/SG2010/000006 WO2010082902A2 (en) 2009-01-13 2010-01-13 System and method for inspecting a wafer
CN201010004240.0A CN101853797B (zh) 2009-01-13 2010-01-13 用于检测晶片的系统和方法
US12/657,076 US8885918B2 (en) 2009-01-13 2010-01-13 System and method for inspecting a wafer
MYPI2010000165A MY188165A (en) 2009-01-13 2010-01-13 System and method for inspecting a wafer
EP10731446.0A EP2387796B1 (en) 2009-01-13 2010-01-13 System and method for inspecting a wafer
PT107314460T PT2387796T (pt) 2009-01-13 2010-01-13 Sistema e método para inspecionar uma pastilha de semicondutor
KR1020100003273A KR101646743B1 (ko) 2009-01-13 2010-01-13 웨이퍼 검사 시스템 및 방법
TW099100877A TWI551855B (zh) 2009-01-13 2010-01-13 檢測晶圓之系統與方法以及由該系統讀取的程式儲存裝置
HK11103452.2A HK1149367B (en) 2009-01-13 2011-04-06 System and method for inspecting a wafer
IL213946A IL213946A (en) 2009-01-13 2011-07-05 System and method for inspecting a wafer

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SG200900229-6A SG163442A1 (en) 2009-01-13 2009-01-13 System and method for inspecting a wafer
SG200901110-7A SG164293A1 (en) 2009-01-13 2009-02-16 System and method for inspecting a wafer

Publications (1)

Publication Number Publication Date
SG164293A1 true SG164293A1 (en) 2010-09-29

Family

ID=54601546

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200901110-7A SG164293A1 (en) 2009-01-13 2009-02-16 System and method for inspecting a wafer

Country Status (11)

Country Link
US (1) US8885918B2 (https=)
EP (1) EP2387796B1 (https=)
JP (1) JP5934874B2 (https=)
KR (1) KR101646743B1 (https=)
CN (1) CN101853797B (https=)
IL (1) IL213946A (https=)
MY (1) MY188165A (https=)
PT (1) PT2387796T (https=)
SG (1) SG164293A1 (https=)
TW (1) TWI551855B (https=)
WO (1) WO2010082902A2 (https=)

Families Citing this family (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9768082B2 (en) 2009-02-13 2017-09-19 Hermes Microvision Inc. Method and machine for examining wafers
CN102378909B (zh) * 2009-04-30 2014-07-02 威尔科克斯联营公司 检查方法和检查装置
JP5500871B2 (ja) * 2009-05-29 2014-05-21 株式会社日立ハイテクノロジーズ テンプレートマッチング用テンプレート作成方法、及びテンプレート作成装置
KR101199619B1 (ko) * 2011-01-21 2012-11-08 세크론 주식회사 웨이퍼 맵 생성 방법
TW201234464A (en) * 2011-02-14 2012-08-16 Horng Terng Automation Co Ltd Breaking point height detection method of wafer breaking
EP2676224B1 (en) * 2011-02-18 2021-05-26 iOmniscient Pty Ltd Image quality assessment
US9595091B2 (en) * 2012-04-19 2017-03-14 Applied Materials Israel, Ltd. Defect classification using topographical attributes
US9858658B2 (en) 2012-04-19 2018-01-02 Applied Materials Israel Ltd Defect classification using CAD-based context attributes
US8896827B2 (en) 2012-06-26 2014-11-25 Kla-Tencor Corporation Diode laser based broad band light sources for wafer inspection tools
JP6025489B2 (ja) 2012-10-11 2016-11-16 株式会社ニューフレアテクノロジー 検査装置および検査装置システム
US9189844B2 (en) * 2012-10-15 2015-11-17 Kla-Tencor Corp. Detecting defects on a wafer using defect-specific information
TWI490482B (zh) * 2013-06-06 2015-07-01 Chroma Ate Inc 半導體元件之瑕疵檢測方法
US10079183B2 (en) * 2013-06-26 2018-09-18 Kla-Tenor Corporation Calculated electrical performance metrics for process monitoring and yield management
JP6002112B2 (ja) * 2013-11-07 2016-10-05 東京エレクトロン株式会社 基板の欠陥分析装置、基板処理システム、基板の欠陥分析方法、プログラム及びコンピュータ記憶媒体
US9772297B2 (en) 2014-02-12 2017-09-26 Kla-Tencor Corporation Apparatus and methods for combined brightfield, darkfield, and photothermal inspection
CN103871921A (zh) * 2014-02-21 2014-06-18 上海华力微电子有限公司 一种基于服务器的晶圆缺陷监测分析方法
TWI489098B (zh) * 2014-03-11 2015-06-21 Utechzone Co Ltd Defect detection method and defect detection device
CN104198495A (zh) * 2014-09-02 2014-12-10 上海华力微电子有限公司 检测半导体衬底出现阶梯演变异常的方法
US9734422B2 (en) * 2014-11-12 2017-08-15 Kla-Tencor Corporation System and method for enhanced defect detection with a digital matched filter
US9816940B2 (en) * 2015-01-21 2017-11-14 Kla-Tencor Corporation Wafer inspection with focus volumetric method
TWI627588B (zh) * 2015-04-23 2018-06-21 Screen Holdings Co,. Ltd. 檢查裝置及基板處理裝置
WO2017056930A1 (ja) * 2015-09-30 2017-04-06 富士フイルム株式会社 画像登録装置及び画像登録方法及び画像登録システム及び撮像端末
DE102016107900B4 (de) * 2016-04-28 2020-10-08 Carl Zeiss Industrielle Messtechnik Gmbh Verfahren und Vorrichtung zur Kantenermittlung eines Messobjekts in der optischen Messtechnik
CA2956230C (en) * 2016-04-29 2020-01-14 Synaptive Medical (Barbados) Inc. Multi-modal optical imaging system for tissue analysis
US10192302B2 (en) * 2016-05-25 2019-01-29 Kla-Tencor Corporation Combined patch and design-based defect detection
CN108878307B (zh) * 2017-05-11 2020-12-08 北京北方华创微电子装备有限公司 晶片检测系统和晶片检测方法
WO2018227031A1 (en) 2017-06-08 2018-12-13 Rudolph Technologies, Inc. Wafer inspection system including a laser triangulation sensor
CN109387518B (zh) 2017-08-02 2022-06-17 上海微电子装备（集团）股份有限公司 自动光学检测方法
US10402963B2 (en) 2017-08-24 2019-09-03 Kla-Tencor Corporation Defect detection on transparent or translucent wafers
KR102464279B1 (ko) * 2017-11-15 2022-11-09 삼성디스플레이 주식회사 결함 검출장치 및 그의 동작방법
WO2019130537A1 (ja) * 2017-12-28 2019-07-04 株式会社Ｆｕｊｉ トレース装置
US10854486B2 (en) 2018-09-19 2020-12-01 Kla Corporation System and method for characterization of buried defects
CN109285933B (zh) * 2018-09-27 2019-09-17 先进光电器材（深圳）有限公司 一种固晶方法及终端
WO2020083612A1 (en) * 2018-10-23 2020-04-30 Asml Netherlands B.V. Method and apparatus for adaptive alignment
IL263097B2 (en) * 2018-11-18 2024-01-01 Inspekto A M V Ltd Optimizing a set-up stage in an automatic visual inspection process
CN109596639A (zh) * 2018-11-30 2019-04-09 德淮半导体有限公司 缺陷检测系统及缺陷检测方法
TWI699465B (zh) * 2019-05-16 2020-07-21 亞亞科技股份有限公司 晶圓內外層取像裝置
US12387956B2 (en) * 2019-11-12 2025-08-12 Applied Materials, Inc. Systems and methods for controlling non-uniformity
KR102342827B1 (ko) * 2019-11-18 2021-12-24 그린정보통신(주) 반도체 포토리소그래피 공정의 웨이퍼 결함 검출 시스템
EP4050560B1 (en) * 2021-01-08 2023-07-12 Changxin Memory Technologies, Inc. Wafer testing method and apparatus, and device and storage medium
CN113034474A (zh) * 2021-03-30 2021-06-25 无锡美科微电子技术有限公司 一种oled显示器晶圆图的测试方法
JP7639559B2 (ja) * 2021-06-04 2025-03-05 株式会社Sumco ウェーハの外観検査装置及びウェーハの外観検査方法
TWI782589B (zh) 2021-06-23 2022-11-01 力晶積成電子製造股份有限公司 晶圓搜尋方法及裝置
JP7531775B2 (ja) * 2021-08-27 2024-08-13 京セラ株式会社 画像処理装置及び画像処理方法
KR102877633B1 (ko) 2021-09-01 2025-10-28 에스케이하이닉스 주식회사 반도체 웨이퍼의 불량 분석 방법 및 그 시스템
TWI783667B (zh) * 2021-09-03 2022-11-11 由田新技股份有限公司 自動影像檢測方法、設備、內儲程式之電腦可讀取記錄媒體、以及電腦程式產品
US12412292B2 (en) 2022-01-19 2025-09-09 Samsung Electronics Co., Ltd. System and method for brightfield inspection of circular rotating wafers

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4222804A1 (de) * 1991-07-10 1993-04-01 Raytheon Co Einrichtung und verfahren zur automatischen visuellen pruefung elektrischer und elektronischer baueinheiten
WO1996039619A1 (en) * 1995-06-06 1996-12-12 Kla Instruments Corporation Optical inspection of a specimen using multi-channel responses from the specimen
JPH1173513A (ja) * 1997-06-25 1999-03-16 Matsushita Electric Works Ltd パターン検査方法及びその装置
US6324298B1 (en) * 1998-07-15 2001-11-27 August Technology Corp. Automated wafer defect inspection system and a process of performing such inspection
US6946394B2 (en) * 2000-09-20 2005-09-20 Kla-Tencor Technologies Methods and systems for determining a characteristic of a layer formed on a specimen by a deposition process
JP2002267615A (ja) * 2001-03-12 2002-09-18 Olympus Optical Co Ltd 欠陥検出方法及びその装置
KR100425447B1 (ko) * 2001-05-10 2004-03-30 삼성전자주식회사 명도 보정 및 선택적 결함 검출 방법 및 이를 기록한 기록매체
US20070258085A1 (en) * 2006-05-02 2007-11-08 Robbins Michael D Substrate illumination and inspection system
US7525659B2 (en) * 2003-01-15 2009-04-28 Negevtech Ltd. System for detection of water defects
JP3913715B2 (ja) * 2003-06-18 2007-05-09 株式会社東芝 不良検出方法
JP2005077109A (ja) 2003-08-29 2005-03-24 Olympus Corp 欠陥検査装置
DE102004004761A1 (de) * 2004-01-30 2005-09-08 Leica Microsystems Semiconductor Gmbh Vorrichtung und Verfahren zur Inspektion eines Wafers
KR20050117710A (ko) * 2004-06-11 2005-12-15 삼성전자주식회사 웨이퍼 결함 검출 방법
KR20060070003A (ko) * 2004-12-20 2006-06-23 삼성전자주식회사 반도체 기판의 결함 검출 방법
CN100380621C (zh) * 2005-04-08 2008-04-09 力晶半导体股份有限公司 晶片缺陷检测方法与系统以及存储媒体
JP2006308372A (ja) * 2005-04-27 2006-11-09 Tokyo Seimitsu Co Ltd 外観検査装置及び外観検査方法
US7554656B2 (en) * 2005-10-06 2009-06-30 Kla-Tencor Technologies Corp. Methods and systems for inspection of a wafer
JP2007156262A (ja) * 2005-12-07 2007-06-21 Seiko Epson Corp フォトマスク検査方法およびフォトマスク検査装置
JP4908925B2 (ja) * 2006-02-08 2012-04-04 株式会社日立ハイテクノロジーズ ウェハ表面欠陥検査装置およびその方法
DE102006059190B4 (de) * 2006-12-15 2009-09-10 Vistec Semiconductor Systems Gmbh Vorrichtung zur Wafer-Inspektion

Also Published As

Publication number Publication date
EP2387796B1 (en) 2021-09-22
CN101853797B (zh) 2015-11-25
IL213946A (en) 2017-01-31
IL213946A0 (en) 2011-08-31
KR20100083745A (ko) 2010-07-22
CN101853797A (zh) 2010-10-06
US8885918B2 (en) 2014-11-11
WO2010082902A2 (en) 2010-07-22
JP2012515332A (ja) 2012-07-05
KR101646743B1 (ko) 2016-08-08
TW201100779A (en) 2011-01-01
WO2010082902A3 (en) 2010-10-28
PT2387796T (pt) 2021-11-16
US20100189339A1 (en) 2010-07-29
HK1149367A1 (zh) 2011-09-30
TWI551855B (zh) 2016-10-01
JP5934874B2 (ja) 2016-06-15
EP2387796A4 (en) 2017-10-18
MY188165A (en) 2021-11-24
EP2387796A2 (en) 2011-11-23

Similar Documents

Publication Publication Date Title
SG164293A1 (en) System and method for inspecting a wafer
TW200716969A (en) Defect detecting method and defect detecting device
TW200723170A (en) Defect detecting device, image sensor device, image sensor module, image processing device, digital image quality tester, and defect detecting method
TW200834059A (en) Defect inspection apparatus and method therefor
TW200722740A (en) Image defect inspection apparatus, image defect inspection system, and image defect inspection method
WO2021118463A9 (en) Defect detection in image space
TWI264793B (en) Defect detection apparatus and defect detection method
TW201612504A (en) Inspection apparatus and inspection method
WO2009044148A8 (en) Apparatus and method of image analysis
TW201614586A (en) Repeater detection
EP1696227A3 (en) Method and apparatus for detecting defects in wafers
TW200604515A (en) Technique for detecting a defect of an object by area segmentation of a color image of the object
EP4254330A3 (en) Flaw detection device and flaw detection method
EP4231639A3 (en) Method and apparatus for intra prediction of video
WO2011070320A3 (en) A testing apparatus and method
MY171250A (en) Defect inspection method
WO2012091494A3 (ko) 기판 검사방법
EP2209316A3 (en) Deblocking method and image processing apparatus
WO2012019700A3 (de) Verfahren und vorrichtung zum erkennen von lichtquellen
EP2134076A3 (en) Defective pixel processing device and defective pixel processing method
JP2013546083A5 (https=)
WO2011119478A3 (en) Transient pixel defect detection and correction
WO2007105107A3 (en) Methods, apparatus and computer-readable media for image segmentation
JP2011095061A5 (https=)
EP2101487A3 (en) Imaging apparatus and pixel defect compensation method implemented therein