JP5934874B2 - ウェーハを検査するためのシステム及び方法 - Google Patents

ウェーハを検査するためのシステム及び方法 Download PDF

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Publication number
JP5934874B2
JP5934874B2 JP2011545327A JP2011545327A JP5934874B2 JP 5934874 B2 JP5934874 B2 JP 5934874B2 JP 2011545327 A JP2011545327 A JP 2011545327A JP 2011545327 A JP2011545327 A JP 2011545327A JP 5934874 B2 JP5934874 B2 JP 5934874B2
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Prior art keywords
image
wafer
illumination
inspection
images
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Japanese (ja)
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JP2012515332A (ja
JP2012515332A5 (https=
Inventor
アマヌッラー，アジハラリ
アルバート アーキワメティ
アルバート アーキワメティ
ホントゥ グオ
ホントゥ グオ
Original Assignee
セミコンダクター テクノロジーズ アンド インストゥルメンツ ピーティーイー リミテッド
セミコンダクター テクノロジーズ アンド インストゥルメンツ ピーティーイー リミテッド
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Priority claimed from SG200900229-6A external-priority patent/SG163442A1/en
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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/40—Analysis of texture
    • G06T7/41—Analysis of texture based on statistical description of texture
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8822—Dark field detection
    • G01N2021/8825—Separate detection of dark field and bright field
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10141—Special mode during image acquisition
    • G06T2207/10152—Varying illumination
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20212—Image combination
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Theoretical Computer Science (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Pathology (AREA)
  • Analytical Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Probability & Statistics with Applications (AREA)
  • Quality & Reliability (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
JP2011545327A 2009-01-13 2010-01-13 ウェーハを検査するためのシステム及び方法 Active JP5934874B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
SG200900229-6 2009-01-13
SG200900229-6A SG163442A1 (en) 2009-01-13 2009-01-13 System and method for inspecting a wafer
SG200901110-7A SG164293A1 (en) 2009-01-13 2009-02-16 System and method for inspecting a wafer
SG200901110-7 2009-02-16
PCT/SG2010/000006 WO2010082902A2 (en) 2009-01-13 2010-01-13 System and method for inspecting a wafer

Publications (3)

Publication Number Publication Date
JP2012515332A JP2012515332A (ja) 2012-07-05
JP2012515332A5 JP2012515332A5 (https=) 2015-06-18
JP5934874B2 true JP5934874B2 (ja) 2016-06-15

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JP2011545327A Active JP5934874B2 (ja) 2009-01-13 2010-01-13 ウェーハを検査するためのシステム及び方法

Country Status (11)

Country Link
US (1) US8885918B2 (https=)
EP (1) EP2387796B1 (https=)
JP (1) JP5934874B2 (https=)
KR (1) KR101646743B1 (https=)
CN (1) CN101853797B (https=)
IL (1) IL213946A (https=)
MY (1) MY188165A (https=)
PT (1) PT2387796T (https=)
SG (1) SG164293A1 (https=)
TW (1) TWI551855B (https=)
WO (1) WO2010082902A2 (https=)

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Also Published As

Publication number Publication date
EP2387796B1 (en) 2021-09-22
CN101853797B (zh) 2015-11-25
IL213946A (en) 2017-01-31
IL213946A0 (en) 2011-08-31
SG164293A1 (en) 2010-09-29
KR20100083745A (ko) 2010-07-22
CN101853797A (zh) 2010-10-06
US8885918B2 (en) 2014-11-11
WO2010082902A2 (en) 2010-07-22
JP2012515332A (ja) 2012-07-05
KR101646743B1 (ko) 2016-08-08
TW201100779A (en) 2011-01-01
WO2010082902A3 (en) 2010-10-28
PT2387796T (pt) 2021-11-16
US20100189339A1 (en) 2010-07-29
HK1149367A1 (zh) 2011-09-30
TWI551855B (zh) 2016-10-01
EP2387796A4 (en) 2017-10-18
MY188165A (en) 2021-11-24
EP2387796A2 (en) 2011-11-23

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