SG162718A1 - Transfer apparatus for handling electronic components - Google Patents

Transfer apparatus for handling electronic components

Info

Publication number
SG162718A1
SG162718A1 SG200908703-2A SG2009087032A SG162718A1 SG 162718 A1 SG162718 A1 SG 162718A1 SG 2009087032 A SG2009087032 A SG 2009087032A SG 162718 A1 SG162718 A1 SG 162718A1
Authority
SG
Singapore
Prior art keywords
electronic components
transfer apparatus
pick
handling electronic
pick heads
Prior art date
Application number
SG200908703-2A
Other languages
English (en)
Inventor
Cheng Chi Wah
Tse Wang Lung
Leung Chi Hang
Original Assignee
Asm Assembly Automation Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asm Assembly Automation Ltd filed Critical Asm Assembly Automation Ltd
Publication of SG162718A1 publication Critical patent/SG162718A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
    • B65G47/918—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers with at least two picking-up heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Supply And Installment Of Electrical Components (AREA)
SG200908703-2A 2009-01-05 2009-12-30 Transfer apparatus for handling electronic components SG162718A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/348,508 US8037996B2 (en) 2009-01-05 2009-01-05 Transfer apparatus for handling electronic components

Publications (1)

Publication Number Publication Date
SG162718A1 true SG162718A1 (en) 2010-07-29

Family

ID=42311814

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200908703-2A SG162718A1 (en) 2009-01-05 2009-12-30 Transfer apparatus for handling electronic components

Country Status (6)

Country Link
US (1) US8037996B2 (ko)
KR (2) KR20100081277A (ko)
CN (1) CN101800186B (ko)
MY (1) MY147624A (ko)
SG (1) SG162718A1 (ko)
TW (1) TWI398393B (ko)

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JP2012104565A (ja) * 2010-11-08 2012-05-31 Fuji Mach Mfg Co Ltd 部品実装装置における部品分別廃棄装置
WO2012080468A1 (en) * 2010-12-16 2012-06-21 Novartis Ag Method and apparatus for transferring objects between two consecutive processing stations being operated with different cycle speeds
FR2974573A1 (fr) * 2011-04-29 2012-11-02 Sidel Participations Outil de manipulation et de regroupement de produits.
JP5320434B2 (ja) * 2011-05-11 2013-10-23 シャープ株式会社 半導体検査装置
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US9365366B2 (en) * 2013-06-24 2016-06-14 Intelligrated Headquarters Llc Robotic container reorganizer
KR101566714B1 (ko) * 2013-07-25 2015-11-13 한미반도체 주식회사 플립칩 본딩장치
TWI485409B (zh) * 2013-08-14 2015-05-21 Utechzone Co Ltd 物品檢測方法及實現該方法的物品檢測設備
KR101754628B1 (ko) * 2016-01-06 2017-07-06 (주)제이티 이송툴
KR102615166B1 (ko) * 2016-01-07 2023-12-18 (주)제이티 이송툴
WO2017142531A1 (en) * 2016-02-17 2017-08-24 Wheelabrator Group, Inc. Turnover mechanism of a conveyor system of a blast wheel machine
CN106115260A (zh) * 2016-08-17 2016-11-16 华天科技（昆山）电子有限公司 器件高速取放装置
CN107010404A (zh) * 2017-04-28 2017-08-04 苏州巨智能装备有限公司 一种电池模组部件的中转对中放置机构
TWI811276B (zh) * 2017-12-19 2023-08-11 美商波士頓半導體設備有限公司 無套組之取放式分類機
KR102486822B1 (ko) 2018-03-29 2023-01-10 삼성전자주식회사 칩 이송 장치 및 이를 이용한 칩 이송 방법
JP7355816B2 (ja) * 2018-12-11 2023-10-03 イスメカ・セミコンダクター・ホールディング・ソシエテ・アノニム 部品処理組立体
JP7240869B2 (ja) * 2018-12-14 2023-03-16 株式会社アドバンテスト センサ試験システム
JPWO2021144865A1 (ko) * 2020-01-14 2021-07-22

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US6971838B2 (en) * 2002-10-28 2005-12-06 Mitek Holdings, Inc. Battery plate feeder having low vacuum, high flow rate pick-up head
KR20040096409A (ko) * 2003-05-09 2004-11-16 디엔씨엔지니어링 주식회사 피치가변 이송장치
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KR100934029B1 (ko) * 2007-06-18 2009-12-28 (주)테크윙 테스트핸들러의 로딩방법

Also Published As

Publication number Publication date
KR20130007677A (ko) 2013-01-18
TWI398393B (zh) 2013-06-11
US8037996B2 (en) 2011-10-18
MY147624A (en) 2012-12-31
KR101378326B1 (ko) 2014-03-27
KR20100081277A (ko) 2010-07-14
US20100172734A1 (en) 2010-07-08
CN101800186A (zh) 2010-08-11
CN101800186B (zh) 2011-12-07
TW201026584A (en) 2010-07-16

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