SG156590A1 - Storage device including a memory cell having multiple memory layers - Google Patents
Storage device including a memory cell having multiple memory layersInfo
- Publication number
- SG156590A1 SG156590A1 SG200902591-7A SG2009025917A SG156590A1 SG 156590 A1 SG156590 A1 SG 156590A1 SG 2009025917 A SG2009025917 A SG 2009025917A SG 156590 A1 SG156590 A1 SG 156590A1
- Authority
- SG
- Singapore
- Prior art keywords
- storage device
- device including
- memory cell
- layers
- controller
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/56—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency
- G11C11/5657—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency using ferroelectric storage elements
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/22—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using ferroelectric elements
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/22—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using ferroelectric elements
- G11C11/225—Auxiliary circuits
- G11C11/2273—Reading or sensing circuits or methods
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/56—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/56—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency
- G11C11/5671—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency using charge trapping in an insulator
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/56—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency
- G11C11/5678—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency using amorphous/crystalline phase transition storage elements
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0004—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements comprising amorphous/crystalline phase transition cells
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0021—Auxiliary circuits
- G11C13/004—Reading or sensing circuits or methods
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/50—Resistive cell structure aspects
- G11C2213/54—Structure including a tunneling barrier layer, the memory effect implying the modification of tunnel barrier conductivity
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/50—Resistive cell structure aspects
- G11C2213/56—Structure including two electrodes, a memory active layer and a so called passive or source or reservoir layer which is NOT an electrode, wherein the passive or source or reservoir layer is a source of ions which migrate afterwards in the memory active layer to be only trapped there, to form conductive filaments there or to react with the material of the memory active layer in redox way
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Semiconductor Memories (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/110,099 US8098520B2 (en) | 2008-04-25 | 2008-04-25 | Storage device including a memory cell having multiple memory layers |
Publications (1)
Publication Number | Publication Date |
---|---|
SG156590A1 true SG156590A1 (en) | 2009-11-26 |
Family
ID=41214868
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200902591-7A SG156590A1 (en) | 2008-04-25 | 2009-04-17 | Storage device including a memory cell having multiple memory layers |
Country Status (3)
Country | Link |
---|---|
US (1) | US8098520B2 (ja) |
JP (1) | JP5429738B2 (ja) |
SG (1) | SG156590A1 (ja) |
Families Citing this family (36)
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US7768812B2 (en) | 2008-01-15 | 2010-08-03 | Micron Technology, Inc. | Memory cells, memory cell programming methods, memory cell reading methods, memory cell operating methods, and memory devices |
US7936597B2 (en) * | 2008-03-25 | 2011-05-03 | Seagate Technology Llc | Multilevel magnetic storage device |
US8211743B2 (en) | 2008-05-02 | 2012-07-03 | Micron Technology, Inc. | Methods of forming non-volatile memory cells having multi-resistive state material between conductive electrodes |
US8134137B2 (en) | 2008-06-18 | 2012-03-13 | Micron Technology, Inc. | Memory device constructions, memory cell forming methods, and semiconductor construction forming methods |
US9343665B2 (en) | 2008-07-02 | 2016-05-17 | Micron Technology, Inc. | Methods of forming a non-volatile resistive oxide memory cell and methods of forming a non-volatile resistive oxide memory array |
US8427859B2 (en) | 2010-04-22 | 2013-04-23 | Micron Technology, Inc. | Arrays of vertically stacked tiers of non-volatile cross point memory cells, methods of forming arrays of vertically stacked tiers of non-volatile cross point memory cells, and methods of reading a data value stored by an array of vertically stacked tiers of non-volatile cross point memory cells |
US8289763B2 (en) | 2010-06-07 | 2012-10-16 | Micron Technology, Inc. | Memory arrays |
US8351242B2 (en) | 2010-09-29 | 2013-01-08 | Micron Technology, Inc. | Electronic devices, memory devices and memory arrays |
US8759809B2 (en) | 2010-10-21 | 2014-06-24 | Micron Technology, Inc. | Integrated circuitry comprising nonvolatile memory cells having platelike electrode and ion conductive material layer |
US8796661B2 (en) | 2010-11-01 | 2014-08-05 | Micron Technology, Inc. | Nonvolatile memory cells and methods of forming nonvolatile memory cell |
US8526213B2 (en) | 2010-11-01 | 2013-09-03 | Micron Technology, Inc. | Memory cells, methods of programming memory cells, and methods of forming memory cells |
US9454997B2 (en) | 2010-12-02 | 2016-09-27 | Micron Technology, Inc. | Array of nonvolatile memory cells having at least five memory cells per unit cell, having a plurality of the unit cells which individually comprise three elevational regions of programmable material, and/or having a continuous volume having a combination of a plurality of vertically oriented memory cells and a plurality of horizontally oriented memory cells; array of vertically stacked tiers of nonvolatile memory cells |
US8446761B2 (en) * | 2010-12-31 | 2013-05-21 | Grandis, Inc. | Method and system for providing multiple logic cells in a single stack |
US8791447B2 (en) | 2011-01-20 | 2014-07-29 | Micron Technology, Inc. | Arrays of nonvolatile memory cells and methods of forming arrays of nonvolatile memory cells |
US8488365B2 (en) | 2011-02-24 | 2013-07-16 | Micron Technology, Inc. | Memory cells |
FR2973553B1 (fr) * | 2011-03-31 | 2013-03-29 | Thales Sa | Procédé de mise en oeuvre d'une jonction tunnel ferroelectrique, dispositif comprenant une jonction tunnel ferroelectrique et utilisation d'un tel dispositif |
US8537592B2 (en) | 2011-04-15 | 2013-09-17 | Micron Technology, Inc. | Arrays of nonvolatile memory cells and methods of forming arrays of nonvolatile memory cells |
US8860117B2 (en) | 2011-04-28 | 2014-10-14 | Micron Technology, Inc. | Semiconductor apparatus with multiple tiers of memory cells with peripheral transistors, and methods |
US9236561B2 (en) | 2011-09-12 | 2016-01-12 | Samsung Electronics Co., Ltd. | Method and system for providing multiple self-aligned logic cells in a single stack |
TWI469408B (zh) * | 2012-05-07 | 2015-01-11 | Univ Feng Chia | 超薄與多層結構相變化記憶體元件 |
US8964474B2 (en) | 2012-06-15 | 2015-02-24 | Micron Technology, Inc. | Architecture for 3-D NAND memory |
US8890267B2 (en) * | 2012-12-03 | 2014-11-18 | Samsung Electronics Co., Ltd. | Method and system for providing magnetic junctions having a graded magnetic free layer |
US8995166B2 (en) * | 2012-12-20 | 2015-03-31 | Intermolecular, Inc. | Multi-level memory array having resistive elements for multi-bit data storage |
US9705151B2 (en) * | 2014-03-28 | 2017-07-11 | Infineon Technologies Ag | Battery, a battery element and a method for forming a battery |
US9362300B2 (en) | 2014-10-08 | 2016-06-07 | Micron Technology, Inc. | Apparatuses and methods for forming multiple decks of memory cells |
US9502642B2 (en) | 2015-04-10 | 2016-11-22 | Micron Technology, Inc. | Magnetic tunnel junctions, methods used while forming magnetic tunnel junctions, and methods of forming magnetic tunnel junctions |
US9530959B2 (en) | 2015-04-15 | 2016-12-27 | Micron Technology, Inc. | Magnetic tunnel junctions |
US9520553B2 (en) | 2015-04-15 | 2016-12-13 | Micron Technology, Inc. | Methods of forming a magnetic electrode of a magnetic tunnel junction and methods of forming a magnetic tunnel junction |
US9257136B1 (en) | 2015-05-05 | 2016-02-09 | Micron Technology, Inc. | Magnetic tunnel junctions |
US9960346B2 (en) | 2015-05-07 | 2018-05-01 | Micron Technology, Inc. | Magnetic tunnel junctions |
WO2017023245A1 (en) * | 2015-07-31 | 2017-02-09 | Hewlett Packard Enterprise Development Lp | Data sensing in crosspoint memory structures |
US9679650B1 (en) | 2016-05-06 | 2017-06-13 | Micron Technology, Inc. | 3D NAND memory Z-decoder |
US9680089B1 (en) | 2016-05-13 | 2017-06-13 | Micron Technology, Inc. | Magnetic tunnel junctions |
US10074430B2 (en) * | 2016-08-08 | 2018-09-11 | Micron Technology, Inc. | Multi-deck memory device with access line and data line segregation between decks and method of operation thereof |
SG10201911258WA (en) * | 2019-06-27 | 2021-01-28 | Sk Hynix Inc | Electronic device |
US11450381B2 (en) | 2019-08-21 | 2022-09-20 | Micron Technology, Inc. | Multi-deck memory device including buffer circuitry under array |
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JPH07122661A (ja) * | 1993-10-27 | 1995-05-12 | Olympus Optical Co Ltd | 強誘電体メモリ装置 |
JPH08180673A (ja) * | 1994-12-27 | 1996-07-12 | Nec Corp | 強誘電体メモリセル及びそのアクセス装置 |
JPH10312691A (ja) * | 1997-05-12 | 1998-11-24 | Sony Corp | 強誘電体記憶装置 |
US6541375B1 (en) * | 1998-06-30 | 2003-04-01 | Matsushita Electric Industrial Co., Ltd. | DC sputtering process for making smooth electrodes and thin film ferroelectric capacitors having improved memory retention |
DE19830569C1 (de) * | 1998-07-08 | 1999-11-18 | Siemens Ag | FeRAM-Anordnung |
CN1191635C (zh) * | 1999-02-17 | 2005-03-02 | 国际商业机器公司 | 用于存储信息的微电子器件及其方法 |
US6589367B2 (en) * | 1999-06-14 | 2003-07-08 | Shin-Etsu Chemical Co., Ltd. | Anisotropic rare earth-based permanent magnet material |
JP2002269973A (ja) * | 2000-12-28 | 2002-09-20 | Seiko Epson Corp | 強誘電体メモリ装置およびその駆動方法 |
US6744086B2 (en) * | 2001-05-15 | 2004-06-01 | Nve Corporation | Current switched magnetoresistive memory cell |
KR100487417B1 (ko) * | 2001-12-13 | 2005-05-03 | 주식회사 하이닉스반도체 | 불휘발성 강유전체 메모리 장치 및 그를 이용한멀티플-비트 데이타의 라이트 및 리드 방법 |
US6704218B2 (en) * | 2002-04-02 | 2004-03-09 | Agilent Technologies, Inc. | FeRAM with a single access/multiple-comparison operation |
US6753561B1 (en) * | 2002-08-02 | 2004-06-22 | Unity Semiconductor Corporation | Cross point memory array using multiple thin films |
US6859382B2 (en) * | 2002-08-02 | 2005-02-22 | Unity Semiconductor Corporation | Memory array of a non-volatile ram |
US6920060B2 (en) * | 2002-08-14 | 2005-07-19 | Intel Corporation | Memory device, circuits and methods for operating a memory device |
US6856534B2 (en) * | 2002-09-30 | 2005-02-15 | Texas Instruments Incorporated | Ferroelectric memory with wide operating voltage and multi-bit storage per cell |
US7190611B2 (en) * | 2003-01-07 | 2007-03-13 | Grandis, Inc. | Spin-transfer multilayer stack containing magnetic layers with resettable magnetization |
JP2004311512A (ja) * | 2003-04-02 | 2004-11-04 | Mitsubishi Electric Corp | 多値情報記憶素子、その使用方法およびその製造方法 |
US6898132B2 (en) * | 2003-06-10 | 2005-05-24 | International Business Machines Corporation | System and method for writing to a magnetic shift register |
US6834005B1 (en) * | 2003-06-10 | 2004-12-21 | International Business Machines Corporation | Shiftable magnetic shift register and method of using the same |
US7108797B2 (en) * | 2003-06-10 | 2006-09-19 | International Business Machines Corporation | Method of fabricating a shiftable magnetic shift register |
US6985385B2 (en) * | 2003-08-26 | 2006-01-10 | Grandis, Inc. | Magnetic memory element utilizing spin transfer switching and storing multiple bits |
US6920062B2 (en) * | 2003-10-14 | 2005-07-19 | International Business Machines Corporation | System and method for reading data stored on a magnetic shift register |
US20060171200A1 (en) * | 2004-02-06 | 2006-08-03 | Unity Semiconductor Corporation | Memory using mixed valence conductive oxides |
US7196924B2 (en) * | 2004-04-06 | 2007-03-27 | Macronix International Co., Ltd. | Method of multi-level cell FeRAM |
KR100558012B1 (ko) * | 2004-07-16 | 2006-03-06 | 삼성전자주식회사 | 반도체 메모리 소자 |
WO2006044244A2 (en) * | 2004-10-12 | 2006-04-27 | Nve Corporataion | Thermomagnetically assisted spin-momentum-transfer switching memory |
US7170775B2 (en) * | 2005-01-06 | 2007-01-30 | Taiwan Semiconductor Manufacturing Company, Ltd. | MRAM cell with reduced write current |
KR100657956B1 (ko) | 2005-04-06 | 2006-12-14 | 삼성전자주식회사 | 다치 저항체 메모리 소자와 그 제조 및 동작 방법 |
JP5143415B2 (ja) * | 2006-01-02 | 2013-02-13 | 三星電子株式会社 | マルチビットセル及び直径が調節できるコンタクトを具備する相変化記憶素子、その製造方法及びそのプログラム方法 |
JP4383523B2 (ja) * | 2007-09-28 | 2009-12-16 | パナソニック株式会社 | 不揮発性記憶素子及び不揮発性半導体記憶装置、並びにそれらの読み出し方法及び書き込み方法 |
JP5253784B2 (ja) * | 2007-10-17 | 2013-07-31 | 株式会社東芝 | 不揮発性半導体記憶装置 |
JP4724196B2 (ja) * | 2008-03-25 | 2011-07-13 | 株式会社東芝 | 磁気抵抗効果素子及び磁気ランダムアクセスメモリ |
US7936597B2 (en) * | 2008-03-25 | 2011-05-03 | Seagate Technology Llc | Multilevel magnetic storage device |
US7804710B2 (en) * | 2008-03-31 | 2010-09-28 | International Business Machines Corporation | Multi-layer magnetic random access memory using spin-torque magnetic tunnel junctions and method for write state of the multi-layer magnetic random access memory |
-
2008
- 2008-04-25 US US12/110,099 patent/US8098520B2/en not_active Expired - Fee Related
-
2009
- 2009-04-17 SG SG200902591-7A patent/SG156590A1/en unknown
- 2009-04-24 JP JP2009106010A patent/JP5429738B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP5429738B2 (ja) | 2014-02-26 |
US20090268506A1 (en) | 2009-10-29 |
JP2009267411A (ja) | 2009-11-12 |
US8098520B2 (en) | 2012-01-17 |
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