SG150492A1 - Ceramic cover wafers of aluminum nitride or beryllium oxide - Google Patents
Ceramic cover wafers of aluminum nitride or beryllium oxideInfo
- Publication number
- SG150492A1 SG150492A1 SG200806483-4A SG2008064834A SG150492A1 SG 150492 A1 SG150492 A1 SG 150492A1 SG 2008064834 A SG2008064834 A SG 2008064834A SG 150492 A1 SG150492 A1 SG 150492A1
- Authority
- SG
- Singapore
- Prior art keywords
- inches
- aluminum nitride
- ceramic cover
- beryllium oxide
- range
- Prior art date
Links
- 239000000919 ceramic Substances 0.000 title abstract 5
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 title abstract 5
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 title abstract 3
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 title abstract 3
- 235000012431 wafers Nutrition 0.000 title abstract 3
- 239000000758 substrate Substances 0.000 abstract 2
- 238000004140 cleaning Methods 0.000 abstract 1
- 239000012459 cleaning agent Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
Classifications
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- C—CHEMISTRY; METALLURGY
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
- C04B35/58—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
- C04B35/581—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on aluminium nitride
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/08—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on beryllium oxide
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
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- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3205—Alkaline earth oxides or oxide forming salts thereof, e.g. beryllium oxide
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- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3217—Aluminum oxide or oxide forming salts thereof, e.g. bauxite, alpha-alumina
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- C04B2235/3225—Yttrium oxide or oxide-forming salts thereof
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- C04B2235/95—Products characterised by their size, e.g. microceramics
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- C04B2235/96—Properties of ceramic products, e.g. mechanical properties such as strength, toughness, wear resistance
- C04B2235/9607—Thermal properties, e.g. thermal expansion coefficient
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- C04B2235/963—Surface properties, e.g. surface roughness
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
- Y10T428/264—Up to 3 mils
- Y10T428/265—1 mil or less
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Drying Of Semiconductors (AREA)
- Chemical Vapour Deposition (AREA)
- Ceramic Products (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US97025007P | 2007-09-05 | 2007-09-05 | |
| US97075707P | 2007-09-07 | 2007-09-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG150492A1 true SG150492A1 (en) | 2009-03-30 |
Family
ID=40432168
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG200806483-4A SG150492A1 (en) | 2007-09-05 | 2008-09-05 | Ceramic cover wafers of aluminum nitride or beryllium oxide |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US8252410B2 (enExample) |
| JP (1) | JP5683063B2 (enExample) |
| KR (1) | KR101099892B1 (enExample) |
| CN (1) | CN104674183A (enExample) |
| SG (1) | SG150492A1 (enExample) |
| TW (1) | TWI447791B (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7371467B2 (en) * | 2002-01-08 | 2008-05-13 | Applied Materials, Inc. | Process chamber component having electroplated yttrium containing coating |
| US7297247B2 (en) * | 2003-05-06 | 2007-11-20 | Applied Materials, Inc. | Electroformed sputtering target |
| US8968537B2 (en) | 2011-02-09 | 2015-03-03 | Applied Materials, Inc. | PVD sputtering target with a protected backing plate |
| CN102553867A (zh) * | 2012-02-17 | 2012-07-11 | 上海先进半导体制造股份有限公司 | 等离子刻蚀设备反应腔室的干法清洗方法 |
| US9850573B1 (en) | 2016-06-23 | 2017-12-26 | Applied Materials, Inc. | Non-line of sight deposition of erbium based plasma resistant ceramic coating |
| US10600624B2 (en) | 2017-03-10 | 2020-03-24 | Applied Materials, Inc. | System and method for substrate processing chambers |
| US10636628B2 (en) | 2017-09-11 | 2020-04-28 | Applied Materials, Inc. | Method for cleaning a process chamber |
| US10312076B2 (en) | 2017-03-10 | 2019-06-04 | Applied Materials, Inc. | Application of bottom purge to increase clean efficiency |
| US10975469B2 (en) | 2017-03-17 | 2021-04-13 | Applied Materials, Inc. | Plasma resistant coating of porous body by atomic layer deposition |
| JP6914170B2 (ja) * | 2017-11-07 | 2021-08-04 | 日本特殊陶業株式会社 | セラミックス基材の保護方法 |
| US10766057B2 (en) * | 2017-12-28 | 2020-09-08 | Micron Technology, Inc. | Components and systems for cleaning a tool for forming a semiconductor device, and related methods |
| CN113924387A (zh) * | 2019-05-22 | 2022-01-11 | 应用材料公司 | 用于高温腐蚀环境的基板支承件盖 |
| JP7654636B2 (ja) * | 2019-08-15 | 2025-04-01 | マテリオン コーポレイション | 酸化ベリリウムペデスタル |
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| JPH0555184A (ja) * | 1991-08-27 | 1993-03-05 | Fujitsu Ltd | クリーニング方法 |
| US5240555A (en) * | 1992-04-16 | 1993-08-31 | Eastman Kodak Company | Method and apparatus for cleaning semiconductor etching machines |
| US5366585A (en) * | 1993-01-28 | 1994-11-22 | Applied Materials, Inc. | Method and apparatus for protection of conductive surfaces in a plasma processing reactor |
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| JP2002160974A (ja) * | 2000-11-22 | 2002-06-04 | Ibiden Co Ltd | 窒化アルミニウム焼結体、窒化アルミニウム焼結体の製造方法、セラミック基板およびセラミック基板の製造方法 |
| ES2717849T3 (es) * | 2001-03-08 | 2019-06-25 | Alstom Transp Tech | Sustrato para circuito electrónico de potencia y módulo electrónico de potencia que utiliza dicho sustrato |
| JP2003023239A (ja) * | 2001-07-05 | 2003-01-24 | Sumitomo Electric Ind Ltd | 回路基板とその製造方法及び高出力モジュール |
| US7060622B2 (en) * | 2002-09-27 | 2006-06-13 | Oki Electric Industry Co., Ltd. | Method of forming dummy wafer |
| JP2005197391A (ja) * | 2004-01-06 | 2005-07-21 | Ibiden Co Ltd | プラズマ発生装置用電極埋設部材 |
-
2008
- 2008-09-04 JP JP2008227210A patent/JP5683063B2/ja active Active
- 2008-09-04 US US12/204,240 patent/US8252410B2/en active Active
- 2008-09-05 SG SG200806483-4A patent/SG150492A1/en unknown
- 2008-09-05 CN CN201510086873.3A patent/CN104674183A/zh active Pending
- 2008-09-05 KR KR1020080087845A patent/KR101099892B1/ko not_active Expired - Fee Related
- 2008-09-05 TW TW097134232A patent/TWI447791B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TW200924038A (en) | 2009-06-01 |
| KR101099892B1 (ko) | 2011-12-28 |
| TWI447791B (zh) | 2014-08-01 |
| KR20090025178A (ko) | 2009-03-10 |
| CN104674183A (zh) | 2015-06-03 |
| JP2009132991A (ja) | 2009-06-18 |
| JP5683063B2 (ja) | 2015-03-11 |
| US8252410B2 (en) | 2012-08-28 |
| US20090068433A1 (en) | 2009-03-12 |
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