TW200622027A - Epitaxial equipment and susceptor - Google Patents

Epitaxial equipment and susceptor

Info

Publication number
TW200622027A
TW200622027A TW094106726A TW94106726A TW200622027A TW 200622027 A TW200622027 A TW 200622027A TW 094106726 A TW094106726 A TW 094106726A TW 94106726 A TW94106726 A TW 94106726A TW 200622027 A TW200622027 A TW 200622027A
Authority
TW
Taiwan
Prior art keywords
susceptor
wafer
epitaxial equipment
indentation
epitaxial
Prior art date
Application number
TW094106726A
Other languages
Chinese (zh)
Inventor
Toshiyuki Nishina
Original Assignee
Steady Design Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Steady Design Ltd filed Critical Steady Design Ltd
Publication of TW200622027A publication Critical patent/TW200622027A/en

Links

Abstract

The present invention is aimed to provide a susceptor used for the epitaxial equipment, which can reduce the local thermal stress exerted toward the wafer such that very few crystal defects will be generated on the wafer. The disclosed susceptor 10 used for the epitaxial equipment 1 contains an indentation 15 able to carry the planar portion 16 containing wafer 14, wherein the planar shape of the indentation 15 is similar to that of the wafer 14.
TW094106726A 2004-12-27 2005-03-04 Epitaxial equipment and susceptor TW200622027A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004378199A JP2006186105A (en) 2004-12-27 2004-12-27 Epitaxial growth device and susceptor used therefor

Publications (1)

Publication Number Publication Date
TW200622027A true TW200622027A (en) 2006-07-01

Family

ID=36739000

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094106726A TW200622027A (en) 2004-12-27 2005-03-04 Epitaxial equipment and susceptor

Country Status (2)

Country Link
JP (1) JP2006186105A (en)
TW (1) TW200622027A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102862396A (en) * 2012-08-04 2013-01-09 江苏吉星新材料有限公司 Chip marking positioning die

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013225571A (en) * 2012-04-20 2013-10-31 Taiyo Nippon Sanso Corp Vapor growth device
CN102856240A (en) * 2012-09-27 2013-01-02 光达光电设备科技（嘉兴）有限公司 Substrate bearing device
JP6149576B2 (en) 2013-07-29 2017-06-21 住友電気工業株式会社 Susceptor and manufacturing equipment
JP2015195259A (en) * 2014-03-31 2015-11-05 豊田合成株式会社 Susceptor and vapor phase growth device
JP6468291B2 (en) * 2015-09-11 2019-02-13 住友電気工業株式会社 Silicon carbide epitaxial substrate, silicon carbide epitaxial substrate manufacturing method, and silicon carbide semiconductor device manufacturing method
DE102015220924B4 (en) * 2015-10-27 2018-09-27 Siltronic Ag Susceptor for holding a semiconductor wafer with orientation notch, method for depositing a layer on a semiconductor wafer and semiconductor wafer
DE102017206671A1 (en) * 2017-04-20 2018-10-25 Siltronic Ag A susceptor for holding a wafer having an orientation notch during deposition of a film on a front side of the wafer and methods for depositing the film using the susceptor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102862396A (en) * 2012-08-04 2013-01-09 江苏吉星新材料有限公司 Chip marking positioning die

Also Published As

Publication number Publication date
JP2006186105A (en) 2006-07-13

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