SG146590A1 - Wafer transfer blade - Google Patents

Wafer transfer blade

Info

Publication number
SG146590A1
SG146590A1 SG200802468-9A SG2008024689A SG146590A1 SG 146590 A1 SG146590 A1 SG 146590A1 SG 2008024689 A SG2008024689 A SG 2008024689A SG 146590 A1 SG146590 A1 SG 146590A1
Authority
SG
Singapore
Prior art keywords
wafer
blade
projections
wafer transfer
transfer blade
Prior art date
Application number
SG200802468-9A
Other languages
English (en)
Inventor
Yuji Aoki
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of SG146590A1 publication Critical patent/SG146590A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
SG200802468-9A 2007-03-30 2008-03-28 Wafer transfer blade SG146590A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007094552A JP4516089B2 (ja) 2007-03-30 2007-03-30 ウェハ搬送用ブレード

Publications (1)

Publication Number Publication Date
SG146590A1 true SG146590A1 (en) 2008-10-30

Family

ID=39472606

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200802468-9A SG146590A1 (en) 2007-03-30 2008-03-28 Wafer transfer blade

Country Status (6)

Country Link
EP (1) EP1975997A3 (ko)
JP (1) JP4516089B2 (ko)
KR (1) KR100989752B1 (ko)
CN (1) CN101320704A (ko)
SG (1) SG146590A1 (ko)
TW (1) TWI455237B (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5846917B2 (ja) * 2009-01-11 2016-01-20 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 基板を移動させるシステム、装置、および方法
JP2012009720A (ja) * 2010-06-28 2012-01-12 Nikon Corp ウェハホルダおよび露光装置
CN108695213B (zh) * 2013-09-26 2022-03-18 应用材料公司 用于基板处理的混合平台式设备、系统以及方法
CN105097623A (zh) * 2014-05-07 2015-11-25 盛美半导体设备（上海）有限公司 晶圆装载端口结构
US10580681B2 (en) 2016-07-10 2020-03-03 Yaskawa America Inc. Robotic apparatus and method for transport of a workpiece

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08327959A (ja) * 1994-06-30 1996-12-13 Seiko Epson Corp ウエハ及び基板の処理装置及び処理方法、ウエハ及び基板の移載装置
JPH0295244U (ko) * 1989-01-13 1990-07-30
JPH0474439U (ko) * 1990-11-13 1992-06-30
JPH0661331A (ja) * 1992-08-06 1994-03-04 Tokyo Electron Tohoku Ltd 基板搬送装置
JP3138554B2 (ja) 1992-12-11 2001-02-26 株式会社荏原製作所 ウエハ支持装置
JP2961480B2 (ja) * 1993-07-13 1999-10-12 東芝セラミックス株式会社 半導体ウエハ移載用フォーク
JPH0729959A (ja) * 1993-07-15 1995-01-31 Kyocera Corp ウェハ搬送装置
JP2513261Y2 (ja) * 1994-02-07 1996-10-02 東京エレクトロン株式会社 搬入搬出装置
JPH09246353A (ja) * 1996-03-08 1997-09-19 Yaskawa Electric Corp 搬送フォーク
JPH10247680A (ja) * 1997-03-04 1998-09-14 Tokyo Electron Ltd 高温炉への搬送用フォークおよび熱処理装置
US6187103B1 (en) * 1998-08-27 2001-02-13 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus and method for transporting wafers
TW543079B (en) 1999-06-03 2003-07-21 Applied Materials Inc Robot blade for semiconductor processing equipment
JP2001223252A (ja) * 2000-02-07 2001-08-17 Assist Japan Kk ロボットの吸着レスハンド
JP2002057209A (ja) * 2000-06-01 2002-02-22 Tokyo Electron Ltd 枚葉式処理装置および枚葉式処理方法
JP4038653B2 (ja) * 2001-12-03 2008-01-30 株式会社安川電機 ウェハ搬送フォーク
JP4144000B2 (ja) * 2002-11-11 2008-09-03 和夫 田▲邉▼ ウエーハセンタリング装置
JP2005019700A (ja) 2003-06-26 2005-01-20 Sumitomo Osaka Cement Co Ltd 吸着固定装置の製造方法
JP2005101226A (ja) * 2003-09-24 2005-04-14 Hoya Corp 基板保持装置，基板処理装置，基板検査装置及び基板保持方法
JP2005183784A (ja) * 2003-12-22 2005-07-07 Optrex Corp 基板搬送装置
JP4417197B2 (ja) * 2004-07-30 2010-02-17 住友大阪セメント株式会社 サセプタ装置
KR20060023735A (ko) * 2004-09-10 2006-03-15 삼성전자주식회사 웨이퍼 이송 아암
US20060113806A1 (en) * 2004-11-29 2006-06-01 Asm Japan K.K. Wafer transfer mechanism
JP4570037B2 (ja) * 2005-03-17 2010-10-27 株式会社アルバック 基板搬送システム
JP4680657B2 (ja) * 2005-04-08 2011-05-11 株式会社アルバック 基板搬送システム
JP4657824B2 (ja) * 2005-06-17 2011-03-23 東京エレクトロン株式会社 基板載置台、基板処理装置および基板載置台の製造方法

Also Published As

Publication number Publication date
KR20080089207A (ko) 2008-10-06
EP1975997A3 (en) 2009-10-07
CN101320704A (zh) 2008-12-10
JP4516089B2 (ja) 2010-08-04
EP1975997A2 (en) 2008-10-01
KR100989752B1 (ko) 2010-10-26
JP2008252012A (ja) 2008-10-16
TWI455237B (zh) 2014-10-01
TW200849458A (en) 2008-12-16

Similar Documents

Publication Publication Date Title
SG146590A1 (en) Wafer transfer blade
USD587445S1 (en) Footwear
USD611241S1 (en) Shoe decoration
TW200741043A (en) GaN crystal substrate and method of manufacturing the same, and method of manufacturing semiconductor device
USD609446S1 (en) Footwear
SG131023A1 (en) Semiconductor heterostructure and method for forming a semiconductor heterostructure
USD638187S1 (en) Iron soleplate
WO2009020024A1 (ja) サセプタ及びシリコンエピタキシャルウェーハの製造方法
TW200801445A (en) Method of measuring warpage of rear surface of substrate
TW200730671A (en) Methods and apparatuses for manufacturing monocrystalline cast silicon and monocrystaline cast silicon bodies for photovoltaics
TW200637091A (en) Semiconductor light-emitting device
TW200711171A (en) Gallium nitride based semiconductor device and method of manufacturing same
SG169962A1 (en) Texturing semiconductor substrates
TW200746455A (en) Group III nitride semiconductor light-emitting device
USD611805S1 (en) Cellphone accessories holder
TW200717869A (en) Gallium nitride-based compound semiconductor light-emitting device
EP2463410A3 (en) Electrochemical etching of semiconductors
TW200614411A (en) Substrate carrier having reduced height
EP2214206A3 (en) Semiconductor device
EP2415909A4 (en) SUPPORT SUBSTRATE, BINDING SUBSTRATE, METHOD FOR PRODUCING THE SUPPORTING SUBSTRATE AND METHOD FOR PRODUCING THE BINDING SUBSTRATE
USD628170S1 (en) Semiconductor wafer processing tape
MX2010001654A (es) Articulos portadores de computadora portatil y metodos para manufacturarlos.
RU2010104566A (ru) Пластырь и лекарственное средство в форме пластыря
USD611714S1 (en) Backsheet design for a substrate
WO2009001924A1 (ja) 樹脂基板