SG143929A1 - Method and mold for producing thermoplastic resin container - Google Patents

Method and mold for producing thermoplastic resin container

Info

Publication number
SG143929A1
SG143929A1 SG200007203-3A SG2000072033A SG143929A1 SG 143929 A1 SG143929 A1 SG 143929A1 SG 2000072033 A SG2000072033 A SG 2000072033A SG 143929 A1 SG143929 A1 SG 143929A1
Authority
SG
Singapore
Prior art keywords
thermoplastic resin
mold
resin container
producing thermoplastic
recess
Prior art date
Application number
SG200007203-3A
Other languages
English (en)
Inventor
Tung Teck Hong
Hideto Aoki
Original Assignee
Sumitomo Bakelite Co
Sumicarrier Singapore Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co, Sumicarrier Singapore Pte Ltd filed Critical Sumitomo Bakelite Co
Priority to SG200007203-3A priority Critical patent/SG143929A1/en
Priority to JP2001361946A priority patent/JP4197866B2/ja
Priority to MYPI20015560A priority patent/MY138943A/en
Priority to KR1020010076609A priority patent/KR100772273B1/ko
Priority to US10/007,623 priority patent/US6835344B2/en
Priority to EP01129014A priority patent/EP1213126B1/de
Priority to DE60137901T priority patent/DE60137901D1/de
Priority to CNB011431121A priority patent/CN1278842C/zh
Priority to TW090130432A priority patent/TW537961B/zh
Publication of SG143929A1 publication Critical patent/SG143929A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333—Trays for chips
    • H01L21/67336—Trays for chips characterized by a material, a roughness, a coating or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C51/00—Shaping by thermoforming, i.e. shaping sheets or sheet like preforms after heating, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor
    • B29C51/26—Component parts, details or accessories; Auxiliary operations
    • B29C51/30—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2791/00—Shaping characteristics in general
    • B29C2791/004—Shaping under special conditions
    • B29C2791/006—Using vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2791/00—Shaping characteristics in general
    • B29C2791/004—Shaping under special conditions
    • B29C2791/007—Using fluid under pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C51/00—Shaping by thermoforming, i.e. shaping sheets or sheet like preforms after heating, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor
    • B29C51/10—Forming by pressure difference, e.g. vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3406—Components, e.g. resistors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/712—Containers; Packaging elements or accessories, Packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68313—Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Packaging Frangible Articles (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Containers And Plastic Fillers For Packaging (AREA)
  • Packages (AREA)
  • Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)
SG200007203-3A 2000-12-07 2000-12-07 Method and mold for producing thermoplastic resin container SG143929A1 (en)

Priority Applications (9)

Application Number Priority Date Filing Date Title
SG200007203-3A SG143929A1 (en) 2000-12-07 2000-12-07 Method and mold for producing thermoplastic resin container
JP2001361946A JP4197866B2 (ja) 2000-12-07 2001-11-28 熱可塑性樹脂容器を製造するための方法と成形型
MYPI20015560A MY138943A (en) 2000-12-07 2001-12-05 Process of making a thermoplastic container
KR1020010076609A KR100772273B1 (ko) 2000-12-07 2001-12-05 열가소성수지 용기를 제조하는 방법 및 주형
US10/007,623 US6835344B2 (en) 2000-12-07 2001-12-05 Process of making a thermoplastic container
EP01129014A EP1213126B1 (de) 2000-12-07 2001-12-06 Verfahren und Formvorrichtung zum Herstellen von Kunststoffbehältern
DE60137901T DE60137901D1 (de) 2000-12-07 2001-12-06 Verfahren und Formvorrichtung zum Herstellen von Kunststoffbehältern
CNB011431121A CN1278842C (zh) 2000-12-07 2001-12-07 制造热塑性树脂容器的方法与模具
TW090130432A TW537961B (en) 2000-12-07 2001-12-07 Method and mold for producing thermoplastic resin container

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200007203-3A SG143929A1 (en) 2000-12-07 2000-12-07 Method and mold for producing thermoplastic resin container

Publications (1)

Publication Number Publication Date
SG143929A1 true SG143929A1 (en) 2008-07-29

Family

ID=20430701

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200007203-3A SG143929A1 (en) 2000-12-07 2000-12-07 Method and mold for producing thermoplastic resin container

Country Status (9)

Country Link
US (1) US6835344B2 (de)
EP (1) EP1213126B1 (de)
JP (1) JP4197866B2 (de)
KR (1) KR100772273B1 (de)
CN (1) CN1278842C (de)
DE (1) DE60137901D1 (de)
MY (1) MY138943A (de)
SG (1) SG143929A1 (de)
TW (1) TW537961B (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6914771B2 (en) * 2002-05-29 2005-07-05 Hirokazu Ono Tray for electronic components
US7643274B2 (en) * 2006-04-21 2010-01-05 Tech Shell Inc. Protective cover for laptop computer
ITMC20080214A1 (it) * 2008-12-03 2010-06-04 Futura Stampi Srl Sistema di fabbricazione di plafoniere stampate in poliestere.
CN102059792A (zh) * 2010-08-27 2011-05-18 昆山裕达塑胶包装有限公司 具有微型真空眼的吸塑模具以及使用该模具的吸塑装置
CN104576465A (zh) * 2013-10-17 2015-04-29 中国科学院苏州纳米技术与纳米仿生研究所 芯片盛放装置
KR102222115B1 (ko) * 2014-08-26 2021-03-03 삼성에스디아이 주식회사 금형 장치 및 이에 의해 제조되는 배터리용 트레이

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5234104A (en) 1991-02-04 1993-08-10 Illinois Tool Works Inc. Carrier tape system
JP2933130B2 (ja) 1996-10-18 1999-08-09 信越ポリマー株式会社 キャリアテープおよびキャリアテープ成形用金型装置
JP3360551B2 (ja) 1996-11-08 2002-12-24 ソニー株式会社 角形チップ部品の搬送容器
JP3181843B2 (ja) 1996-11-18 2001-07-03 信越ポリマー株式会社 電子部品収納容器の製造方法
US5979660A (en) * 1997-06-05 1999-11-09 Advanced Micro Devices, Inc. Tube for flash miniature card
DE69827927T2 (de) * 1997-09-10 2006-03-02 Yayoi Corp. Verpackung für bandförmige Artikel, Verpackungsvorrichtung für Artikel und Verschlüsse

Also Published As

Publication number Publication date
JP4197866B2 (ja) 2008-12-17
MY138943A (en) 2009-08-28
CN1357443A (zh) 2002-07-10
JP2002240140A (ja) 2002-08-28
US20020074695A1 (en) 2002-06-20
KR100772273B1 (ko) 2007-11-01
CN1278842C (zh) 2006-10-11
KR20020045546A (ko) 2002-06-19
EP1213126A3 (de) 2004-02-18
US6835344B2 (en) 2004-12-28
EP1213126A2 (de) 2002-06-12
EP1213126B1 (de) 2009-03-11
TW537961B (en) 2003-06-21
DE60137901D1 (de) 2009-04-23

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