SG143238A1 - Structure and process for wl-csp with metal cover - Google Patents
Structure and process for wl-csp with metal coverInfo
- Publication number
- SG143238A1 SG143238A1 SG200718437-7A SG2007184377A SG143238A1 SG 143238 A1 SG143238 A1 SG 143238A1 SG 2007184377 A SG2007184377 A SG 2007184377A SG 143238 A1 SG143238 A1 SG 143238A1
- Authority
- SG
- Singapore
- Prior art keywords
- metal cover
- csp
- wafer
- package
- cavity
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
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- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
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- H01L23/00—Details of semiconductor or other solid state devices
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- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
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- H01L23/00—Details of semiconductor or other solid state devices
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- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3135—Double encapsulation or coating and encapsulation
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- H01L24/93—Batch processes
- H01L24/94—Batch processes at wafer-level, i.e. with connecting carried out on a wafer comprising a plurality of undiced individual devices
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- H01L2224/023—Redistribution layers [RDL] for bonding areas
- H01L2224/0237—Disposition of the redistribution layers
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- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
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- H01L2224/13001—Core members of the bump connector
- H01L2224/13099—Material
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- H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
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- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
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- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19043—Component type being a resistor
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- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Dicing (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/567,795 US7468544B2 (en) | 2006-12-07 | 2006-12-07 | Structure and process for WL-CSP with metal cover |
Publications (1)
Publication Number | Publication Date |
---|---|
SG143238A1 true SG143238A1 (en) | 2008-06-27 |
Family
ID=39363415
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200718437-7A SG143238A1 (en) | 2006-12-07 | 2007-12-07 | Structure and process for wl-csp with metal cover |
Country Status (7)
Country | Link |
---|---|
US (1) | US7468544B2 (ko) |
JP (1) | JP2008177548A (ko) |
KR (1) | KR20080052496A (ko) |
CN (1) | CN101197336A (ko) |
DE (1) | DE102007059181A1 (ko) |
SG (1) | SG143238A1 (ko) |
TW (1) | TWI358803B (ko) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8629532B2 (en) * | 2007-05-08 | 2014-01-14 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor wafer with assisting dicing structure and dicing method thereof |
US7932179B2 (en) * | 2007-07-27 | 2011-04-26 | Micron Technology, Inc. | Method for fabricating semiconductor device having backside redistribution layers |
CN101807511B (zh) * | 2009-02-13 | 2012-03-28 | 万国半导体股份有限公司 | 激光标识晶片水平芯片级封装的方法 |
CN102097404B (zh) * | 2009-12-10 | 2013-09-11 | 万国半导体有限公司 | 低衬底电阻的晶圆级芯片尺寸封装及其制造方法 |
CN102034721B (zh) * | 2010-11-05 | 2013-07-10 | 南通富士通微电子股份有限公司 | 芯片封装方法 |
CN102034720B (zh) * | 2010-11-05 | 2013-05-15 | 南通富士通微电子股份有限公司 | 芯片封装方法 |
CN102130026B (zh) * | 2010-12-23 | 2012-06-27 | 中国科学院半导体研究所 | 基于金锡合金键合的圆片级低温封装方法 |
WO2012100720A1 (zh) * | 2011-01-30 | 2012-08-02 | 南通富士通微电子股份有限公司 | 封装方法 |
CN102683226A (zh) * | 2011-03-14 | 2012-09-19 | SKLink株式会社 | 晶圆级封装结构及其制造方法 |
TWI505413B (zh) * | 2011-07-20 | 2015-10-21 | Xintec Inc | 晶片封裝體及其製造方法 |
US8963282B2 (en) * | 2011-09-14 | 2015-02-24 | Nanya Technology Corp. | Crack stop structure and method for forming the same |
US9257392B2 (en) * | 2012-04-11 | 2016-02-09 | Mediatek Inc. | Semiconductor package with through silicon via interconnect |
US20150001713A1 (en) * | 2013-06-29 | 2015-01-01 | Edmund Goetz | Multiple level redistribution layer for multiple chip integration |
US9418877B2 (en) * | 2014-05-05 | 2016-08-16 | Qualcomm Incorporated | Integrated device comprising high density interconnects in inorganic layers and redistribution layers in organic layers |
CN105374773A (zh) * | 2014-08-25 | 2016-03-02 | 万国半导体股份有限公司 | Mcsp功率半导体器件及制备方法 |
CN104362102A (zh) * | 2014-09-28 | 2015-02-18 | 南通富士通微电子股份有限公司 | 晶圆级芯片规模封装工艺 |
CN104299949A (zh) * | 2014-09-28 | 2015-01-21 | 南通富士通微电子股份有限公司 | 晶圆级芯片封装结构 |
CN105778644B (zh) * | 2014-12-15 | 2019-01-29 | 碁達科技股份有限公司 | 雷射切割用保护膜组成物及应用 |
JP2017162876A (ja) * | 2016-03-07 | 2017-09-14 | 株式会社ジェイデバイス | 半導体パッケージの製造方法 |
US20190131247A1 (en) * | 2017-10-31 | 2019-05-02 | Microchip Technology Incorporated | Semiconductor Wafer Cutting Using A Polymer Coating To Reduce Physical Damage |
TWI683415B (zh) * | 2018-09-28 | 2020-01-21 | 典琦科技股份有限公司 | 晶片封裝體的製造方法 |
CN110970362B (zh) * | 2018-09-28 | 2022-06-07 | 典琦科技股份有限公司 | 芯片封装体的制造方法 |
CN111653528A (zh) * | 2020-07-22 | 2020-09-11 | 江苏长晶科技有限公司 | 芯片封装结构、方法和半导体器件 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10135270A (ja) * | 1996-10-31 | 1998-05-22 | Casio Comput Co Ltd | 半導体装置及びその製造方法 |
US6184573B1 (en) * | 1999-05-13 | 2001-02-06 | Siliconware Precision Industries Co., Ltd. | Chip packaging |
US6607941B2 (en) * | 2002-01-11 | 2003-08-19 | National Semiconductor Corporation | Process and structure improvements to shellcase style packaging technology |
TWI227550B (en) * | 2002-10-30 | 2005-02-01 | Sanyo Electric Co | Semiconductor device manufacturing method |
TWI229890B (en) * | 2003-04-24 | 2005-03-21 | Sanyo Electric Co | Semiconductor device and method of manufacturing same |
JP4222092B2 (ja) * | 2003-05-07 | 2009-02-12 | 富士電機デバイステクノロジー株式会社 | 半導体ウェハ、半導体装置および半導体装置の製造方法 |
-
2006
- 2006-12-07 US US11/567,795 patent/US7468544B2/en active Active
-
2007
- 2007-11-27 TW TW096145019A patent/TWI358803B/zh active
- 2007-12-06 JP JP2007316244A patent/JP2008177548A/ja not_active Withdrawn
- 2007-12-06 DE DE102007059181A patent/DE102007059181A1/de not_active Withdrawn
- 2007-12-07 CN CNA2007101969968A patent/CN101197336A/zh active Pending
- 2007-12-07 KR KR1020070126846A patent/KR20080052496A/ko not_active Application Discontinuation
- 2007-12-07 SG SG200718437-7A patent/SG143238A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
US20080136026A1 (en) | 2008-06-12 |
JP2008177548A (ja) | 2008-07-31 |
DE102007059181A1 (de) | 2008-06-12 |
CN101197336A (zh) | 2008-06-11 |
TW200828544A (en) | 2008-07-01 |
US7468544B2 (en) | 2008-12-23 |
KR20080052496A (ko) | 2008-06-11 |
TWI358803B (en) | 2012-02-21 |
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