SG143191A1 - Flexible membrane for carrier head - Google Patents

Flexible membrane for carrier head

Info

Publication number
SG143191A1
SG143191A1 SG200717957-5A SG2007179575A SG143191A1 SG 143191 A1 SG143191 A1 SG 143191A1 SG 2007179575 A SG2007179575 A SG 2007179575A SG 143191 A1 SG143191 A1 SG 143191A1
Authority
SG
Singapore
Prior art keywords
flexible membrane
carrier head
outer annular
annular portion
carrier
Prior art date
Application number
SG200717957-5A
Other languages
English (en)
Inventor
Steven M Zuniga
Andrew J Nagengast
Jeonghoon Oh
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of SG143191A1 publication Critical patent/SG143191A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24174—Structurally defined web or sheet [e.g., overall dimension, etc.] including sheet or component perpendicular to plane of web or sheet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24174—Structurally defined web or sheet [e.g., overall dimension, etc.] including sheet or component perpendicular to plane of web or sheet
    • Y10T428/24182—Inward from edge of web or sheet

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Packages (AREA)
  • Separation Using Semi-Permeable Membranes (AREA)
SG200717957-5A 2006-11-22 2007-11-21 Flexible membrane for carrier head SG143191A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US86709006P 2006-11-22 2006-11-22
US89170507P 2007-02-26 2007-02-26
US11/741,692 US7727055B2 (en) 2006-11-22 2007-04-27 Flexible membrane for carrier head

Publications (1)

Publication Number Publication Date
SG143191A1 true SG143191A1 (en) 2008-06-27

Family

ID=38996609

Family Applications (2)

Application Number Title Priority Date Filing Date
SG200717957-5A SG143191A1 (en) 2006-11-22 2007-11-21 Flexible membrane for carrier head
SG2011068582A SG175554A1 (en) 2006-11-22 2007-11-21 Flexible membrane for carrier head

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG2011068582A SG175554A1 (en) 2006-11-22 2007-11-21 Flexible membrane for carrier head

Country Status (8)

Country Link
US (3) US7727055B2 (zh)
EP (1) EP1925399B1 (zh)
JP (2) JP5250243B2 (zh)
KR (1) KR100942620B1 (zh)
CN (1) CN101293334B (zh)
AT (1) ATE529220T1 (zh)
SG (2) SG143191A1 (zh)
TW (2) TWI552829B (zh)

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DE112007003710T5 (de) * 2007-11-20 2010-12-02 Shin-Etsu Handotai Co., Ltd. Polierkopf und Poliervorrichtung
US8475231B2 (en) * 2008-12-12 2013-07-02 Applied Materials, Inc. Carrier head membrane
US10160093B2 (en) 2008-12-12 2018-12-25 Applied Materials, Inc. Carrier head membrane roughness to control polishing rate
JP5392483B2 (ja) * 2009-08-31 2014-01-22 不二越機械工業株式会社 研磨装置
EP3406402B1 (en) * 2010-08-06 2021-06-30 Applied Materials, Inc. Substrate edge tuning with retaining ring
US8591286B2 (en) 2010-08-11 2013-11-26 Applied Materials, Inc. Apparatus and method for temperature control during polishing
US9050700B2 (en) * 2012-01-27 2015-06-09 Applied Materials, Inc. Methods and apparatus for an improved polishing head retaining ring
JP5807580B2 (ja) * 2012-02-15 2015-11-10 信越半導体株式会社 研磨ヘッド及び研磨装置
US9233452B2 (en) 2012-10-29 2016-01-12 Wayne O. Duescher Vacuum-grooved membrane abrasive polishing wafer workholder
US8998678B2 (en) 2012-10-29 2015-04-07 Wayne O. Duescher Spider arm driven flexible chamber abrading workholder
US8998677B2 (en) 2012-10-29 2015-04-07 Wayne O. Duescher Bellows driven floatation-type abrading workholder
US9011207B2 (en) 2012-10-29 2015-04-21 Wayne O. Duescher Flexible diaphragm combination floating and rigid abrading workholder
US9039488B2 (en) 2012-10-29 2015-05-26 Wayne O. Duescher Pin driven flexible chamber abrading workholder
US9199354B2 (en) 2012-10-29 2015-12-01 Wayne O. Duescher Flexible diaphragm post-type floating and rigid abrading workholder
US9604339B2 (en) 2012-10-29 2017-03-28 Wayne O. Duescher Vacuum-grooved membrane wafer polishing workholder
US8845394B2 (en) 2012-10-29 2014-09-30 Wayne O. Duescher Bellows driven air floatation abrading workholder
US10532441B2 (en) * 2012-11-30 2020-01-14 Applied Materials, Inc. Three-zone carrier head and flexible membrane
US9381613B2 (en) * 2013-03-13 2016-07-05 Applied Materials, Inc. Reinforcement ring for carrier head
USD769200S1 (en) * 2013-05-15 2016-10-18 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
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US9731399B2 (en) * 2013-10-04 2017-08-15 Applied Materials, Inc. Coated retaining ring
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CN104308736A (zh) * 2014-08-27 2015-01-28 上海华力微电子有限公司 研磨头膜片的缺陷检测方法
KR101673140B1 (ko) * 2014-12-22 2016-11-08 주식회사 케이씨텍 화학 기계적 연마 장치의 캐리어 헤드의 멤브레인 및 이를 구비한 캐리어 헤드
KR102264785B1 (ko) * 2015-02-16 2021-06-14 삼성전자주식회사 연마 헤드 및 이를 갖는 연마 캐리어 장치
USD839224S1 (en) 2016-12-12 2019-01-29 Ebara Corporation Elastic membrane for semiconductor wafer polishing
JP7021863B2 (ja) * 2017-03-30 2022-02-17 富士紡ホールディングス株式会社 保持具
JP7141222B2 (ja) * 2017-04-12 2022-09-22 株式会社荏原製作所 弾性膜、基板保持装置、及び研磨装置
US11088011B2 (en) * 2017-04-12 2021-08-10 Ebara Corporation Elastic membrane, substrate holding device, and polishing apparatus
USD859332S1 (en) * 2017-06-29 2019-09-10 Ebara Corporation Elastic membrane for semiconductor wafer polishing
US10926378B2 (en) 2017-07-08 2021-02-23 Wayne O. Duescher Abrasive coated disk islands using magnetic font sheet
US11267099B2 (en) * 2017-09-27 2022-03-08 Taiwan Semiconductor Manufacturing Company, Ltd. Chemical mechanical planarization membrane
USD918161S1 (en) * 2017-12-19 2021-05-04 Ebara Corporation Elastic membrane
EP3746264A1 (de) * 2018-01-29 2020-12-09 Menzer Gmbh Gleitring für schleifgerät und verfahren zur herstellung des gleitrings
KR102637832B1 (ko) * 2018-11-09 2024-02-19 주식회사 케이씨텍 연마 장치용 캐리어 헤드 및 이에 사용되는 멤브레인
CN109202697A (zh) * 2018-11-20 2019-01-15 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 抛光头、抛光设备以及抛光头的使用方法
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Also Published As

Publication number Publication date
US7950985B2 (en) 2011-05-31
TW201422364A (zh) 2014-06-16
ATE529220T1 (de) 2011-11-15
CN101293334B (zh) 2016-03-23
JP2013116555A (ja) 2013-06-13
US7727055B2 (en) 2010-06-01
EP1925399B1 (en) 2011-10-19
US20110212672A1 (en) 2011-09-01
US20100240287A1 (en) 2010-09-23
JP5568654B2 (ja) 2014-08-06
US8469776B2 (en) 2013-06-25
SG175554A1 (en) 2011-11-28
EP1925399A3 (en) 2008-07-02
KR20080046557A (ko) 2008-05-27
KR100942620B1 (ko) 2010-02-17
EP1925399A2 (en) 2008-05-28
CN101293334A (zh) 2008-10-29
TW200902227A (en) 2009-01-16
US20080119122A1 (en) 2008-05-22
JP5250243B2 (ja) 2013-07-31
TWI552829B (zh) 2016-10-11
JP2008142884A (ja) 2008-06-26
TWI433753B (zh) 2014-04-11

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