SG132657A1 - Configurable die attachment apparatus - Google Patents

Configurable die attachment apparatus

Info

Publication number
SG132657A1
SG132657A1 SG200608338-0A SG2006083380A SG132657A1 SG 132657 A1 SG132657 A1 SG 132657A1 SG 2006083380 A SG2006083380 A SG 2006083380A SG 132657 A1 SG132657 A1 SG 132657A1
Authority
SG
Singapore
Prior art keywords
pin
ejector pins
mounting assembly
die
attachment apparatus
Prior art date
Application number
SG200608338-0A
Other languages
English (en)
Inventor
Cheung Yiu Ming
Original Assignee
Asm Assembly Automation Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asm Assembly Automation Ltd filed Critical Asm Assembly Automation Ltd
Publication of SG132657A1 publication Critical patent/SG132657A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Automatic Tool Replacement In Machine Tools (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
SG200608338-0A 2005-12-01 2006-11-29 Configurable die attachment apparatus SG132657A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/292,901 US7470120B2 (en) 2005-12-01 2005-12-01 Configurable die detachment apparatus

Publications (1)

Publication Number Publication Date
SG132657A1 true SG132657A1 (en) 2007-06-28

Family

ID=37891311

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200608338-0A SG132657A1 (en) 2005-12-01 2006-11-29 Configurable die attachment apparatus

Country Status (8)

Country Link
US (1) US7470120B2 (zh)
EP (1) EP1793414B1 (zh)
JP (1) JP4486077B2 (zh)
KR (1) KR100864195B1 (zh)
CN (1) CN100501917C (zh)
AT (1) ATE442662T1 (zh)
SG (1) SG132657A1 (zh)
TW (1) TWI331782B (zh)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4693805B2 (ja) * 2007-03-16 2011-06-01 株式会社東芝 半導体装置の製造装置及び製造方法
DE102007041911A1 (de) * 2007-09-04 2009-03-05 Siemens Ag Vorrichtung zum Ablösen von elektronischen Bauelementen von eienr Montagefolie
KR100864590B1 (ko) * 2007-09-20 2008-10-22 주식회사 케이엔제이 반도체 패키지의 소팅테이블
US20090181119A1 (en) * 2008-01-15 2009-07-16 Chih-Yu Chen Lateral core-pulling mechanism of mold
CN102044404B (zh) 2009-10-12 2015-12-09 桑迪士克科技公司 用于使经切分的半导体裸片与裸片贴胶带分离的系统
US8470130B2 (en) * 2009-10-20 2013-06-25 Asm Assembly Automation Ltd Universal die detachment apparatus
CN102376613B (zh) * 2010-08-20 2013-04-03 吴华 集成电路装片机顶针模块
JP6049221B2 (ja) * 2012-11-27 2016-12-21 富士機械製造株式会社 ダイ供給装置
CN104752296B (zh) * 2013-12-31 2017-12-19 北京北方华创微电子装备有限公司 一种顶针机构的定位装置及反应腔室
JP6000322B2 (ja) * 2014-12-02 2016-09-28 富士機械製造株式会社 ダイ供給装置
US9633883B2 (en) 2015-03-20 2017-04-25 Rohinni, LLC Apparatus for transfer of semiconductor devices
KR101688989B1 (ko) * 2015-10-30 2016-12-22 스테코 주식회사 칩 분리 장치
KR102430473B1 (ko) * 2016-03-03 2022-08-09 세메스 주식회사 이젝터 핀 및 이를 포함하는 다이 이젝팅 장치
TWI588928B (zh) * 2016-05-31 2017-06-21 致茂電子股份有限公司 晶粒拾取方法
US10340173B2 (en) 2016-10-11 2019-07-02 Micron Technology, Inc. System for handling semiconductor dies
US10424553B2 (en) 2016-10-31 2019-09-24 Micron Technology, Inc. Semiconductor devices with underfill control features, and associated systems and methods
US10141215B2 (en) 2016-11-03 2018-11-27 Rohinni, LLC Compliant needle for direct transfer of semiconductor devices
US10504767B2 (en) 2016-11-23 2019-12-10 Rohinni, LLC Direct transfer apparatus for a pattern array of semiconductor device die
KR102344110B1 (ko) * 2017-05-15 2021-12-29 세메스 주식회사 이젝터 핀 검사 방법
RU2669207C1 (ru) * 2017-07-13 2018-10-09 Публичное акционерное общество завод "Красное знамя" Штамп для одновременной отрезки контактов
TWI682492B (zh) * 2018-03-23 2020-01-11 旺矽科技股份有限公司 晶粒挑揀總成及晶粒移動方法
US11094571B2 (en) 2018-09-28 2021-08-17 Rohinni, LLC Apparatus to increase transferspeed of semiconductor devices with micro-adjustment
CN109935545B (zh) * 2019-01-22 2022-03-18 厦门市三安集成电路有限公司 一种挑起不同尺寸晶片的顶针模组
CN113594079B (zh) * 2020-04-30 2024-01-16 先进科技新加坡有限公司 用于将电子元件从粘性载体分离的顶出器单元
KR20230037210A (ko) * 2021-09-09 2023-03-16 에스케이온 주식회사 이차 전지용 테이프 공급 장치
CN116525529B (zh) * 2023-05-15 2024-02-02 深圳德芯微电技术有限公司 一种用于半导体芯片封装的顶针装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3900183A (en) * 1974-03-05 1975-08-19 Maynard Wallace Die attachment for forming split type fasteners on molded parts
US4911632A (en) * 1988-12-09 1990-03-27 Dana Corporation Quick change holder for mold inserts
JP3079502B2 (ja) 1995-08-18 2000-08-21 株式会社新川 ダイ突き上げ装置
JP3498877B2 (ja) 1995-12-05 2004-02-23 株式会社東芝 半導体製造装置および半導体装置の製造方法
US6047623A (en) * 1996-03-05 2000-04-11 Performance Design, Inc. Hole punch quick-change die assembly with pin strap and positioning system
JPH10189690A (ja) 1996-12-26 1998-07-21 Hitachi Ltd 半導体チップのピックアップ方法及びピックアップ装置
JP2002050670A (ja) 2000-08-04 2002-02-15 Toshiba Corp ピックアップ装置及びピックアップ方法
JP4021614B2 (ja) 2000-12-11 2007-12-12 株式会社東芝 半導体素子のピックアップ用治具、半導体素子のピックアップ装置、半導体素子のピックアップ方法、半導体装置の製造方法及び半導体装置の製造装置
US8026126B2 (en) 2002-11-27 2011-09-27 Asm Assembly Automation Ltd Apparatus and method for thin die detachment

Also Published As

Publication number Publication date
CN100501917C (zh) 2009-06-17
TWI331782B (en) 2010-10-11
ATE442662T1 (de) 2009-09-15
US7470120B2 (en) 2008-12-30
JP2007173797A (ja) 2007-07-05
JP4486077B2 (ja) 2010-06-23
EP1793414B1 (en) 2009-09-09
TW200807578A (en) 2008-02-01
EP1793414A1 (en) 2007-06-06
US20070128306A1 (en) 2007-06-07
CN1975984A (zh) 2007-06-06
KR100864195B1 (ko) 2008-10-20
KR20070057687A (ko) 2007-06-07

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