SG131059A1 - Method of resin-seal-molding electronic component and apparatus therefor - Google Patents

Method of resin-seal-molding electronic component and apparatus therefor

Info

Publication number
SG131059A1
SG131059A1 SG200606305-1A SG2006063051A SG131059A1 SG 131059 A1 SG131059 A1 SG 131059A1 SG 2006063051 A SG2006063051 A SG 2006063051A SG 131059 A1 SG131059 A1 SG 131059A1
Authority
SG
Singapore
Prior art keywords
resin
mold
seal
electronic component
molding
Prior art date
Application number
SG200606305-1A
Other languages
English (en)
Inventor
Kazuhiko Bandoh
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Publication of SG131059A1 publication Critical patent/SG131059A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/32—Moulds having several axially spaced mould cavities, i.e. for making several separated articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/64—Mould opening, closing or clamping devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B29C2045/14147—Positioning or centering articles in the mould using pins or needles penetrating through the insert
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/64—Mould opening, closing or clamping devices
    • B29C2045/648—Rack and pinion means for mould opening and closing a pair of mould halves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
SG200606305-1A 2005-09-27 2006-09-12 Method of resin-seal-molding electronic component and apparatus therefor SG131059A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005280294A JP2007095804A (ja) 2005-09-27 2005-09-27 電子部品の樹脂封止成形方法及び装置

Publications (1)

Publication Number Publication Date
SG131059A1 true SG131059A1 (en) 2007-04-26

Family

ID=37663389

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200606305-1A SG131059A1 (en) 2005-09-27 2006-09-12 Method of resin-seal-molding electronic component and apparatus therefor

Country Status (6)

Country Link
US (1) US20070069422A1 (zh)
EP (1) EP1768166A3 (zh)
JP (1) JP2007095804A (zh)
CN (1) CN100511609C (zh)
SG (1) SG131059A1 (zh)
TW (1) TW200715429A (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100897132B1 (ko) 2007-09-12 2009-05-14 삼성모바일디스플레이주식회사 표시패널 봉지장치 및 이를 이용한 유기전계발광표시장치의 제조방법
US20110233821A1 (en) * 2008-09-30 2011-09-29 Towa Corporation Compression resin sealing and molding method for electronic component and apparatus therefor
JP5385886B2 (ja) * 2010-11-02 2014-01-08 Ｔｏｗａ株式会社 電気回路部品の樹脂封止成形方法及び装置
JP6218549B2 (ja) * 2013-10-17 2017-10-25 Ｔｏｗａ株式会社 半導体封止型への半導体基板供給方法及び半導体基板供給装置
JP6320448B2 (ja) * 2016-04-28 2018-05-09 Ｔｏｗａ株式会社 樹脂封止装置および樹脂封止方法
WO2023194649A1 (en) * 2022-04-05 2023-10-12 Ledil Oy A system and a method for injection moulding

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5775435A (en) * 1980-10-29 1982-05-12 Mitsubishi Electric Corp Liquid transfer molding
JPH0350841A (ja) * 1989-07-19 1991-03-05 Toshiba Corp 半導体樹脂封止用金型装置
JPH05147062A (ja) * 1991-11-28 1993-06-15 Yamada Seisakusho Co Ltd トランスフアモールド装置
KR970002295B1 (ko) * 1993-02-23 1997-02-27 미쯔비시 덴끼 가부시끼가이샤 성형방법
TW257745B (zh) * 1993-07-22 1995-09-21 Towa Kk
JP2738361B2 (ja) * 1995-09-13 1998-04-08 日本電気株式会社 樹脂モールド装置および樹脂モールド方法
JPH11176852A (ja) * 1997-12-12 1999-07-02 Sony Corp 半導体樹脂封止装置
JP3450223B2 (ja) * 1999-05-27 2003-09-22 Ｎｅｃエレクトロニクス株式会社 半導体装置封入用金型、及び、半導体装置封入方法
US6564447B1 (en) * 2000-11-15 2003-05-20 National Semiconductor Corporation Non lead frame clamping for matrix leadless leadframe package molding
JP3711333B2 (ja) * 2001-07-27 2005-11-02 沖電気工業株式会社 半導体装置の製造方法および樹脂封止装置
WO2003082543A1 (en) * 2002-03-27 2003-10-09 Kirchmer Bryan R Continuous pallet production apparatus
JP2004014823A (ja) * 2002-06-07 2004-01-15 Renesas Technology Corp 半導体装置及びその製造方法
JP4162474B2 (ja) * 2002-11-26 2008-10-08 Ｔｏｗａ株式会社 樹脂成形用金型への供給方法、樹脂成形用金型からの取出方法、供給機構、及び、取出機構
NL1022323C2 (nl) * 2003-01-08 2004-07-09 Fico Bv Inrichting en werkwijze voor het met omhulmateriaal omhullen van een op een drager bevestigde elektronische component.
JP4607429B2 (ja) * 2003-03-25 2011-01-05 東レ・ダウコーニング株式会社 半導体装置の製造方法および半導体装置
JP4153862B2 (ja) * 2003-10-24 2008-09-24 第一精工株式会社 半導体樹脂封止用金型
JP4084844B2 (ja) * 2005-09-27 2008-04-30 Ｔｏｗａ株式会社 電子部品の樹脂封止成形方法及び装置

Also Published As

Publication number Publication date
EP1768166A3 (en) 2008-10-08
US20070069422A1 (en) 2007-03-29
CN1941306A (zh) 2007-04-04
EP1768166A2 (en) 2007-03-28
CN100511609C (zh) 2009-07-08
JP2007095804A (ja) 2007-04-12
TW200715429A (en) 2007-04-16

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