SG128581A1 - Method of characterization, method of characterizing a process operation, and device manufacturing method - Google Patents

Method of characterization, method of characterizing a process operation, and device manufacturing method

Info

Publication number
SG128581A1
SG128581A1 SG200603843A SG200603843A SG128581A1 SG 128581 A1 SG128581 A1 SG 128581A1 SG 200603843 A SG200603843 A SG 200603843A SG 200603843 A SG200603843 A SG 200603843A SG 128581 A1 SG128581 A1 SG 128581A1
Authority
SG
Singapore
Prior art keywords
characterizing
characterization
device manufacturing
process operation
wafer
Prior art date
Application number
SG200603843A
Other languages
English (en)
Inventor
De Christianus Gerardus Ma Mol
Original Assignee
Asml Netherlands Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asml Netherlands Bv filed Critical Asml Netherlands Bv
Publication of SG128581A1 publication Critical patent/SG128581A1/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70508—Data handling in all parts of the microlithographic apparatus, e.g. handling pattern data for addressable masks or data transfer to or from different components within the exposure apparatus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
SG200603843A 2005-06-10 2006-06-06 Method of characterization, method of characterizing a process operation, and device manufacturing method SG128581A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US14943405A 2005-06-10 2005-06-10

Publications (1)

Publication Number Publication Date
SG128581A1 true SG128581A1 (en) 2007-01-30

Family

ID=37054549

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200603843A SG128581A1 (en) 2005-06-10 2006-06-06 Method of characterization, method of characterizing a process operation, and device manufacturing method

Country Status (8)

Country Link
US (1) US7649614B2 (zh)
EP (1) EP1731968B1 (zh)
JP (1) JP4578435B2 (zh)
KR (1) KR100801272B1 (zh)
CN (1) CN1892431B (zh)
DE (1) DE602006000256T2 (zh)
SG (1) SG128581A1 (zh)
TW (1) TWI335493B (zh)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008055589A2 (en) * 2006-11-09 2008-05-15 Carl Zeiss Sms Gmbh Method for determination of residual errors
US20080182344A1 (en) * 2007-01-30 2008-07-31 Steffen Mueller Method and system for determining deformations on a substrate
KR101286240B1 (ko) 2007-10-23 2013-07-15 삼성전자주식회사 반도체 구조물의 형상을 예정하는 공정 파라 메타의 예측시스템, 상기 공정 파라 메타의 예측 시스템을 가지는반도체 제조 장비 및 그 장비의 사용방법
JP4962864B2 (ja) * 2007-12-07 2012-06-27 富士電機株式会社 二乗平均平方根傾斜角の算出方法
US8655624B2 (en) * 2008-06-11 2014-02-18 Fluke Corporation System and method for objective self-diagnosis of measurement device calibration condition
US8260449B2 (en) 2008-11-06 2012-09-04 Micron Technology, Inc. Photolithography systems and associated methods of overlay error correction
NL2005997A (en) * 2010-02-19 2011-08-22 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
GB2489495B (en) * 2011-03-31 2013-03-06 Rolls Royce Plc Checking positional accuracy of features
TWI641921B (zh) * 2011-08-01 2018-11-21 諾發測量儀器股份有限公司 用以檢驗圖案化結構量測的監測系統及方法
NL2009853A (en) * 2011-12-23 2013-06-26 Asml Netherlands Bv Methods and apparatus for measuring a property of a substrate.
JP2013175500A (ja) 2012-02-23 2013-09-05 Toshiba Corp 露光装置、及び露光方法
US9753377B2 (en) 2012-08-29 2017-09-05 Asml Netherlands B.V. Deformation pattern recognition method, pattern transferring method, processing device monitoring method, and lithographic apparatus
KR102142167B1 (ko) * 2012-11-09 2020-08-07 케이엘에이 코포레이션 계측 타겟 특성화
US9123583B2 (en) * 2013-07-12 2015-09-01 Taiwan Semiconductor Manufacturing Co., Ltd. Overlay abnormality gating by Z data
JP6381197B2 (ja) 2013-10-31 2018-08-29 キヤノン株式会社 計測装置、計測方法、リソグラフィ装置、及び物品製造方法
US20180052444A1 (en) * 2016-08-18 2018-02-22 General Electric Company Component deformation modeling system
EP3364247A1 (en) * 2017-02-17 2018-08-22 ASML Netherlands B.V. Methods & apparatus for monitoring a lithographic manufacturing process
CN107527831B (zh) * 2017-08-21 2019-11-29 武汉新芯集成电路制造有限公司 一种晶圆扭曲度的表征方法
WO2019120826A1 (en) * 2017-12-19 2019-06-27 Asml Netherlands B.V. Computational metrology based correction and control

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0828321B2 (ja) * 1990-08-20 1996-03-21 松下電器産業株式会社 レジスト塗布評価方法
US20010049589A1 (en) * 1993-01-21 2001-12-06 Nikon Corporation Alignment method and apparatus therefor
JPH08115869A (ja) 1994-10-18 1996-05-07 Nikon Corp 位置合わせ方法
JPH09115817A (ja) * 1995-10-13 1997-05-02 Nikon Corp 露光方法及び装置
JP2839081B2 (ja) 1996-03-06 1998-12-16 日本電気株式会社 半導体装置の製造方法
JP2821441B2 (ja) * 1996-08-23 1998-11-05 山形日本電気株式会社 重ね合せずれ量の計測方法
JP2001266142A (ja) 2000-01-13 2001-09-28 Nikon Corp データ分類方法及びデータ分類装置、信号処理方法及び信号処理装置、位置検出方法及び位置検出装置、画像処理方法及び画像処理装置、露光方法及び露光装置、並びにデバイス製造方法
CN1314225A (zh) * 2000-02-18 2001-09-26 德克萨斯仪器股份有限公司 铜镀层集成电路焊点的结构和方法
JP2001257159A (ja) 2000-03-13 2001-09-21 Hitachi Ltd 位置合わせ方法および位置合わせ制御システム
KR20010109212A (ko) * 2000-05-31 2001-12-08 시마무라 테루오 평가방법, 위치검출방법, 노광방법 및 디바이스 제조방법,및 노광장치
US6699627B2 (en) * 2000-12-08 2004-03-02 Adlai Smith Reference wafer and process for manufacturing same
JP2003017386A (ja) * 2001-06-29 2003-01-17 Canon Inc 位置合わせ方法、露光方法、露光装置及びデバイスの製造方法
JP2003289025A (ja) 2002-03-28 2003-10-10 Toshiba Corp 半導体処理装置管理システムおよび半導体処理装置管理方法
US7069104B2 (en) * 2002-04-30 2006-06-27 Canon Kabushiki Kaisha Management system, management apparatus, management method, and device manufacturing method
JP2003329608A (ja) 2002-05-08 2003-11-19 Hitachi Ltd 検査条件判定プログラムと検査装置と検査システム
US7330279B2 (en) * 2002-07-25 2008-02-12 Timbre Technologies, Inc. Model and parameter selection for optical metrology
EP1477857A1 (en) 2003-05-13 2004-11-17 ASML Netherlands B.V. Method of characterising a process step and device manufacturing method
EP1477851A1 (en) 2003-05-13 2004-11-17 ASML Netherlands B.V. Device manufacturing method and lithographic apparatus

Also Published As

Publication number Publication date
JP2006344947A (ja) 2006-12-21
DE602006000256T2 (de) 2008-12-04
US7649614B2 (en) 2010-01-19
TWI335493B (en) 2011-01-01
CN1892431B (zh) 2011-04-13
DE602006000256D1 (de) 2008-01-03
EP1731968B1 (en) 2007-11-21
US20060279722A1 (en) 2006-12-14
KR100801272B1 (ko) 2008-02-04
TW200707118A (en) 2007-02-16
JP4578435B2 (ja) 2010-11-10
EP1731968A2 (en) 2006-12-13
EP1731968A3 (en) 2006-12-27
CN1892431A (zh) 2007-01-10
KR20060128692A (ko) 2006-12-14

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