SG127672A1 - Method of processing beam, laser irradiation apparatus, and method of manufacturing semiconductor device - Google Patents

Method of processing beam, laser irradiation apparatus, and method of manufacturing semiconductor device

Info

Publication number
SG127672A1
SG127672A1 SG200105373A SG200105373A SG127672A1 SG 127672 A1 SG127672 A1 SG 127672A1 SG 200105373 A SG200105373 A SG 200105373A SG 200105373 A SG200105373 A SG 200105373A SG 127672 A1 SG127672 A1 SG 127672A1
Authority
SG
Singapore
Prior art keywords
semiconductor device
laser irradiation
irradiation apparatus
manufacturing semiconductor
processing beam
Prior art date
Application number
SG200105373A
Other languages
English (en)
Inventor
Koichiro Tanaka
Original Assignee
Semiconductor Energy Lab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Energy Lab filed Critical Semiconductor Energy Lab
Publication of SG127672A1 publication Critical patent/SG127672A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0938—Using specific optical elements
    • G02B27/095—Refractive optical elements
    • G02B27/0955—Lenses
    • G02B27/0961—Lens arrays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0905—Dividing and/or superposing multiple light beams
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0938—Using specific optical elements
    • G02B27/095—Refractive optical elements
    • G02B27/0955—Lenses
    • G02B27/0966—Cylindrical lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/10—Beam splitting or combining systems
    • G02B27/12—Beam splitting or combining systems operating by refraction only
    • G02B27/123—The splitting element being a lens or a system of lenses, including arrays and surfaces with refractive power
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/10—Beam splitting or combining systems
    • G02B27/14—Beam splitting or combining systems operating by reflection only
    • G02B27/145—Beam splitting or combining systems operating by reflection only having sequential partially reflecting surfaces
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/10—Beam splitting or combining systems
    • G02B27/14—Beam splitting or combining systems operating by reflection only
    • G02B27/149—Beam splitting or combining systems operating by reflection only using crossed beamsplitting surfaces, e.g. cross-dichroic cubes or X-cubes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Electromagnetism (AREA)
  • Recrystallisation Techniques (AREA)
  • Thin Film Transistor (AREA)
SG200105373A 2000-09-01 2001-09-01 Method of processing beam, laser irradiation apparatus, and method of manufacturing semiconductor device SG127672A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000265451 2000-09-01

Publications (1)

Publication Number Publication Date
SG127672A1 true SG127672A1 (en) 2006-12-29

Family

ID=18752713

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200105373A SG127672A1 (en) 2000-09-01 2001-09-01 Method of processing beam, laser irradiation apparatus, and method of manufacturing semiconductor device

Country Status (6)

Country Link
US (1) US6650480B2 (zh)
KR (1) KR100863919B1 (zh)
CN (2) CN1697144B (zh)
MY (1) MY138983A (zh)
SG (1) SG127672A1 (zh)
TW (1) TW523791B (zh)

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US6955956B2 (en) * 2000-12-26 2005-10-18 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing a semiconductor device
MY127193A (en) * 2000-12-26 2006-11-30 Semiconductor Energy Lab Laser irradiation apparatus and method of laser irradiation
JP3980465B2 (ja) * 2001-11-09 2007-09-26 株式会社半導体エネルギー研究所 半導体装置の作製方法
TWI289896B (en) * 2001-11-09 2007-11-11 Semiconductor Energy Lab Laser irradiation apparatus, laser irradiation method, and method of manufacturing a semiconductor device
JP3949564B2 (ja) * 2001-11-30 2007-07-25 株式会社半導体エネルギー研究所 レーザ照射装置及び半導体装置の作製方法
CN1263255C (zh) * 2002-04-03 2006-07-05 三星电子株式会社 以太网无源光网络及点到点模拟方法
US6977775B2 (en) * 2002-05-17 2005-12-20 Sharp Kabushiki Kaisha Method and apparatus for crystallizing semiconductor with laser beams
TW200417270A (en) * 2002-06-27 2004-09-01 Tokyo Electron Ltd Semiconductor processing device
US7081704B2 (en) * 2002-08-09 2006-07-25 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US7259082B2 (en) * 2002-10-03 2007-08-21 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing semiconductor device
JP4282985B2 (ja) * 2002-12-27 2009-06-24 株式会社半導体エネルギー研究所 表示装置の作製方法
JP4662411B2 (ja) * 2003-03-14 2011-03-30 日立ビアメカニクス株式会社 レーザ加工装置
US20050104072A1 (en) 2003-08-14 2005-05-19 Slater David B.Jr. Localized annealing of metal-silicon carbide ohmic contacts and devices so formed
US7450307B2 (en) * 2003-09-09 2008-11-11 Semiconductor Energy Laboratory Co., Ltd. Laser irradiation apparatus, laser irradiation method, and method for manufacturing semiconductor device
US7109087B2 (en) * 2003-10-03 2006-09-19 Applied Materials, Inc. Absorber layer for DSA processing
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JP4741822B2 (ja) * 2004-09-02 2011-08-10 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
WO2006066706A2 (en) * 2004-12-22 2006-06-29 Carl Zeiss Laser Optics Gmbh Optical illumination system for creating a line beam
US7612832B2 (en) * 2005-03-29 2009-11-03 Microsoft Corporation Method and system for video clip compression
JP4498309B2 (ja) * 2005-05-18 2010-07-07 キヤノン株式会社 レーザー干渉による加工方法及び該加工方法で加工された回折格子、反射防止構造
JP2007110064A (ja) 2005-09-14 2007-04-26 Ishikawajima Harima Heavy Ind Co Ltd レーザアニール方法及び装置
US7615722B2 (en) * 2006-07-17 2009-11-10 Coherent, Inc. Amorphous silicon crystallization using combined beams from optically pumped semiconductor lasers
JP4478670B2 (ja) * 2006-09-08 2010-06-09 ソニー株式会社 １次元照明装置及び画像生成装置
US8279514B2 (en) * 2007-01-24 2012-10-02 Osram Ag Optoelectronic device
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JP5224218B2 (ja) * 2007-07-23 2013-07-03 カール・ツァイス・エスエムティー・ゲーエムベーハー マイクロリソグラフィ投影露光装置の光学システム
DE102007047467A1 (de) * 2007-09-28 2009-04-02 Carl Zeiss Microimaging Gmbh Anordnung zur optischen Erfassung von in einer Probe angeregter und/oder rückgestreuter Lichtstrahlung
FR2922325B1 (fr) * 2007-10-12 2010-06-11 Ecole Polytech Homogeneiseur a lame de phase
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JP5467730B2 (ja) * 2008-03-24 2014-04-09 株式会社半導体エネルギー研究所 レーザ照射装置
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CN103839790B (zh) * 2012-11-23 2016-09-28 中芯国际集成电路制造(上海)有限公司 激光退火装置及退火方法
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CN110049095A (zh) * 2019-03-01 2019-07-23 湖北三江航天红峰控制有限公司 一种激光装备数据上工业云平台的方法
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Also Published As

Publication number Publication date
MY138983A (en) 2009-08-28
CN1697144B (zh) 2010-04-28
TW523791B (en) 2003-03-11
CN1211687C (zh) 2005-07-20
KR100863919B1 (ko) 2008-10-17
US6650480B2 (en) 2003-11-18
KR20020018630A (ko) 2002-03-08
CN1340849A (zh) 2002-03-20
US20020027716A1 (en) 2002-03-07
CN1697144A (zh) 2005-11-16

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