SG120284A1 - A method program product and apparatus for model based scattering bar placement for enhanced depth of focus in quarter-wavelength lithography - Google Patents
A method program product and apparatus for model based scattering bar placement for enhanced depth of focus in quarter-wavelength lithographyInfo
- Publication number
- SG120284A1 SG120284A1 SG200505331A SG200505331A SG120284A1 SG 120284 A1 SG120284 A1 SG 120284A1 SG 200505331 A SG200505331 A SG 200505331A SG 200505331 A SG200505331 A SG 200505331A SG 120284 A1 SG120284 A1 SG 120284A1
- Authority
- SG
- Singapore
- Prior art keywords
- determining
- focus
- focus setting
- quarter
- program product
- Prior art date
Links
- 238000001459 lithography Methods 0.000 title 1
- 238000010899 nucleation Methods 0.000 abstract 4
- 238000000034 method Methods 0.000 abstract 2
- 238000003384 imaging method Methods 0.000 abstract 1
- 230000003287 optical effect Effects 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
- G03F7/70433—Layout for increasing efficiency or for compensating imaging errors, e.g. layout of exposure fields for reducing focus errors; Use of mask features for increasing efficiency or for compensating imaging errors
- G03F7/70441—Optical proximity correction [OPC]
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/36—Masks having proximity correction features; Preparation thereof, e.g. optical proximity correction [OPC] design processes
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US60356004P | 2004-08-24 | 2004-08-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG120284A1 true SG120284A1 (en) | 2006-03-28 |
Family
ID=35431328
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200505331A SG120284A1 (en) | 2004-08-24 | 2005-08-23 | A method program product and apparatus for model based scattering bar placement for enhanced depth of focus in quarter-wavelength lithography |
Country Status (7)
Country | Link |
---|---|
US (2) | US7620930B2 (de) |
EP (1) | EP1630601A3 (de) |
JP (1) | JP4383400B2 (de) |
KR (1) | KR100860328B1 (de) |
CN (1) | CN100543588C (de) |
SG (1) | SG120284A1 (de) |
TW (1) | TWI370955B (de) |
Families Citing this family (32)
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US7620930B2 (en) * | 2004-08-24 | 2009-11-17 | Asml Masktools B.V. | Method, program product and apparatus for model based scattering bar placement for enhanced depth of focus in quarter-wavelength lithography |
US7509621B2 (en) * | 2005-01-03 | 2009-03-24 | Synopsys, Inc. | Method and apparatus for placing assist features by identifying locations of constructive and destructive interference |
US7424699B2 (en) * | 2005-06-10 | 2008-09-09 | Texas Instruments Incorporated | Modifying sub-resolution assist features according to rule-based and model-based techniques |
US8132130B2 (en) * | 2005-06-22 | 2012-03-06 | Asml Masktools B.V. | Method, program product and apparatus for performing mask feature pitch decomposition for use in a multiple exposure process |
EP1804119A1 (de) * | 2005-12-27 | 2007-07-04 | Interuniversitair Microelektronica Centrum | Verfahren zur Herstellung gedämpfter Phasenverschiebungsmasken und daraus erhaltene Vorrichtungen |
US20070226674A1 (en) * | 2006-03-27 | 2007-09-27 | Henning Haffner | System and method for semiconductor device fabrication using modeling |
US7548315B2 (en) * | 2006-07-27 | 2009-06-16 | Asml Netherlands B.V. | System and method to compensate for critical dimension non-uniformity in a lithography system |
KR100881184B1 (ko) * | 2006-12-12 | 2009-02-05 | 삼성전자주식회사 | 마스크 패턴을 배치하는 방법 및 이를 이용한 장치 |
KR100874913B1 (ko) * | 2006-12-12 | 2008-12-19 | 삼성전자주식회사 | 마스크 패턴을 배치하는 방법 및 이를 이용한 장치 |
US8341561B2 (en) * | 2006-12-12 | 2012-12-25 | Samsung Electronics Co., Ltd. | Methods of arranging mask patterns and associated apparatus |
US20080169510A1 (en) * | 2007-01-17 | 2008-07-17 | International Business Machines Corporation | Performance enhancement on both nmosfet and pmosfet using self-aligned dual stressed films |
KR101096145B1 (ko) * | 2007-06-04 | 2011-12-19 | 에이에스엠엘 네델란즈 비.브이. | 모델-기반 리소그래피 안내 레이아웃 설계를 수행하는 방법들 |
KR101317844B1 (ko) * | 2007-07-06 | 2013-10-11 | 삼성전자주식회사 | 마스크 패턴을 배치하는 방법 및 이를 이용한 장치 |
CN101359178B (zh) * | 2007-08-03 | 2011-06-01 | 中芯国际集成电路制造(上海)有限公司 | 光学邻近校正的方法 |
US9779186B2 (en) | 2007-08-28 | 2017-10-03 | Asml Netherlands B.V. | Methods for performing model-based lithography guided layout design |
US8028252B2 (en) * | 2007-09-14 | 2011-09-27 | Luminescent Technologies Inc. | Technique for determining mask patterns and write patterns |
EP2040120B1 (de) * | 2007-09-19 | 2011-03-02 | Canon Kabushiki Kaisha | Maskendatenerzeugungsverfahren, Maskenherstellungsverfahren, Belichtungsverfahren, Vorrichtungsherstellungsverfahren und Programm |
JP2009093138A (ja) * | 2007-09-19 | 2009-04-30 | Canon Inc | 原版データの生成方法、原版作成方法、露光方法、デバイス製造方法及び原版データを作成するためのプログラム |
KR101113326B1 (ko) * | 2009-07-01 | 2012-03-13 | 주식회사 하이닉스반도체 | 포토마스크의 보조패턴 형성방법 |
US8250498B2 (en) * | 2010-01-28 | 2012-08-21 | Synopsys, Inc. | Method and apparatus for calibrating a photolithography process model by using a process window parameter |
JP5279745B2 (ja) | 2010-02-24 | 2013-09-04 | 株式会社東芝 | マスクレイアウト作成方法、マスクレイアウト作成装置、リソグラフィ用マスクの製造方法、半導体装置の製造方法、およびコンピュータが実行可能なプログラム |
KR101991380B1 (ko) | 2012-07-26 | 2019-06-20 | 삼성전자주식회사 | 반도체 소자의 레이아웃 생성 방법 |
CN104423172A (zh) * | 2013-08-27 | 2015-03-18 | 中芯国际集成电路制造(北京)有限公司 | 一种散射条模拟成像的检测方法 |
US9310674B2 (en) | 2014-02-20 | 2016-04-12 | International Business Machines Corporation | Mask that provides improved focus control using orthogonal edges |
US9805154B2 (en) | 2015-05-15 | 2017-10-31 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of lithography process with inserting scattering bars |
JP2017090817A (ja) * | 2015-11-16 | 2017-05-25 | キヤノン株式会社 | 露光装置、及び物品の製造方法 |
US11380516B2 (en) | 2017-04-13 | 2022-07-05 | Fractilia, Llc | System and method for generating and analyzing roughness measurements and their use for process monitoring and control |
US10522322B2 (en) | 2017-04-13 | 2019-12-31 | Fractilia, Llc | System and method for generating and analyzing roughness measurements |
US10176966B1 (en) | 2017-04-13 | 2019-01-08 | Fractilia, Llc | Edge detection system |
US10262100B2 (en) * | 2017-05-24 | 2019-04-16 | Synopsys, Inc. | Rule based assist feature placement using skeletons |
KR20210133364A (ko) | 2020-04-28 | 2021-11-08 | 삼성전자주식회사 | 반도체 장치의 제조를 위한 방법 및 컴퓨팅 장치 |
CN113589644A (zh) * | 2021-07-15 | 2021-11-02 | 中国科学院上海光学精密机械研究所 | 基于亚分辨率辅助图形种子插入的曲线型逆向光刻方法 |
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JPH04216548A (ja) * | 1990-12-18 | 1992-08-06 | Mitsubishi Electric Corp | フォトマスク |
US5242770A (en) * | 1992-01-16 | 1993-09-07 | Microunity Systems Engineering, Inc. | Mask for photolithography |
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US5682323A (en) * | 1995-03-06 | 1997-10-28 | Lsi Logic Corporation | System and method for performing optical proximity correction on macrocell libraries |
US5705301A (en) * | 1996-02-27 | 1998-01-06 | Lsi Logic Corporation | Performing optical proximity correction with the aid of design rule checkers |
JP4075966B2 (ja) * | 1996-03-06 | 2008-04-16 | エーエスエムエル ネザーランズ ビー.ブイ. | 差分干渉計システム及びこのシステムを具えたリソグラフステップアンドスキャン装置 |
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TWI290262B (en) | 2003-01-14 | 2007-11-21 | Asml Masktools Bv | Method and apparatus for providing optical proximity features to a reticle pattern for deep sub-wavelength optical lithography |
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EP1513012B1 (de) * | 2003-09-05 | 2008-02-20 | ASML MaskTools B.V. | Methode und Vorrichtung für modellgestützte Plazierung phasenbalancierter Hilfsstrukturen für optische Lithographie mit Auflösungsgrenzen unterhalb der Belichtungswellenlänge |
US7232630B2 (en) * | 2003-12-11 | 2007-06-19 | Synopsys, Inc | Method for printability enhancement of complementary masks |
US7620930B2 (en) * | 2004-08-24 | 2009-11-17 | Asml Masktools B.V. | Method, program product and apparatus for model based scattering bar placement for enhanced depth of focus in quarter-wavelength lithography |
-
2005
- 2005-08-22 US US11/208,015 patent/US7620930B2/en active Active
- 2005-08-23 SG SG200505331A patent/SG120284A1/en unknown
- 2005-08-23 JP JP2005272697A patent/JP4383400B2/ja not_active Expired - Fee Related
- 2005-08-24 KR KR1020050077709A patent/KR100860328B1/ko active IP Right Grant
- 2005-08-24 EP EP05255190A patent/EP1630601A3/de not_active Withdrawn
- 2005-08-24 TW TW094128950A patent/TWI370955B/zh not_active IP Right Cessation
- 2005-08-24 CN CNB2005101165341A patent/CN100543588C/zh not_active Expired - Fee Related
-
2009
- 2009-11-05 US US12/613,344 patent/US8495529B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US7620930B2 (en) | 2009-11-17 |
JP4383400B2 (ja) | 2009-12-16 |
CN100543588C (zh) | 2009-09-23 |
CN1800987A (zh) | 2006-07-12 |
US8495529B2 (en) | 2013-07-23 |
US20060075377A1 (en) | 2006-04-06 |
TW200619863A (en) | 2006-06-16 |
TWI370955B (en) | 2012-08-21 |
JP2006065338A (ja) | 2006-03-09 |
KR20060050603A (ko) | 2006-05-19 |
US20100047699A1 (en) | 2010-02-25 |
EP1630601A3 (de) | 2008-07-02 |
KR100860328B1 (ko) | 2008-09-25 |
EP1630601A2 (de) | 2006-03-01 |
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