SG11202112567WA - Damper control system and damper control method - Google Patents

Damper control system and damper control method

Info

Publication number
SG11202112567WA
SG11202112567WA SG11202112567WA SG11202112567WA SG11202112567WA SG 11202112567W A SG11202112567W A SG 11202112567WA SG 11202112567W A SG11202112567W A SG 11202112567WA SG 11202112567W A SG11202112567W A SG 11202112567WA SG 11202112567W A SG11202112567W A SG 11202112567WA
Authority
SG
Singapore
Prior art keywords
opening degree
shutter
damper
pressure
pressure sensor
Prior art date
Application number
SG11202112567WA
Other languages
English (en)
Inventor
Akira Imamura
Mitsuru Miyazaki
Junji Kunisawa
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG11202112567WA publication Critical patent/SG11202112567WA/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H10P72/0472—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one polishing chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0408—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F7/00—Ventilation
    • F24F7/007—Ventilation with forced flow
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0458—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3306—Horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Ventilation (AREA)
SG11202112567WA 2019-05-30 2020-05-29 Damper control system and damper control method SG11202112567WA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019101611A JP7143251B2 (ja) 2019-05-30 2019-05-30 ダンパー制御システムおよびダンパー制御方法
PCT/JP2020/021418 WO2020241848A1 (ja) 2019-05-30 2020-05-29 ダンパー制御システムおよびダンパー制御方法

Publications (1)

Publication Number Publication Date
SG11202112567WA true SG11202112567WA (en) 2021-12-30

Family

ID=73552853

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202112567WA SG11202112567WA (en) 2019-05-30 2020-05-29 Damper control system and damper control method

Country Status (4)

Country Link
US (1) US11967508B2 (https=)
JP (1) JP7143251B2 (https=)
SG (1) SG11202112567WA (https=)
WO (1) WO2020241848A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102737433B1 (ko) * 2022-12-16 2024-12-02 세메스 주식회사 제어 유닛 및 이를 포함하는 반도체 제조 설비
TW202520411A (zh) * 2023-10-11 2025-05-16 日商東京威力科創股份有限公司 基板處理裝置及基板處理方法

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3548865A (en) * 1967-12-08 1970-12-22 Bela P Povinger Pressure control apparatus
US4375224A (en) * 1981-01-21 1983-03-01 Acutherm, Inc. Air conditioning control equipment
GB8531812D0 (en) * 1985-12-24 1986-02-05 Edi Eng Ltd Control system
SE458802B (sv) * 1987-04-03 1989-05-08 Stifab Ab Regleranordning foer instaellning av ett spjaell i en ventilationskanal
US4796651A (en) * 1988-03-30 1989-01-10 LeRoy D. Ginn Variable gas volume flow measuring and control methods and apparatus
JPH06163494A (ja) 1992-11-20 1994-06-10 Hitachi Electron Eng Co Ltd 半導体洗浄装置の排気ガス制御機構
US5363872A (en) * 1993-03-16 1994-11-15 Applied Materials, Inc. Low particulate slit valve system and method for controlling same
US5518446A (en) * 1994-07-28 1996-05-21 Landis & Gyr Powers, Inc. Fume hood exhaust terminal
US5758680A (en) * 1996-03-29 1998-06-02 Lam Research Corporation Method and apparatus for pressure control in vacuum processors
WO1999031561A1 (en) * 1997-12-18 1999-06-24 Nikon Corporation Method of controlling air pressure in chamber, apparatus for the same, and exposure apparatus
JP4022309B2 (ja) 1998-04-08 2007-12-19 大日本スクリーン製造株式会社 基板処理装置
JP3623654B2 (ja) 1998-04-24 2005-02-23 大日本スクリーン製造株式会社 基板処理装置
JP4298840B2 (ja) 1999-03-31 2009-07-22 芝浦メカトロニクス株式会社 スピン処理装置およびスピン処理方法
AU2001250060A1 (en) * 2000-04-04 2001-10-15 Clifford C. Federspiel Pressure based flow rate measurement device integrated with blades of a damper
JP2006078086A (ja) * 2004-09-09 2006-03-23 Taikisha Ltd 室圧制御システム
JP2009036425A (ja) * 2007-08-01 2009-02-19 Hitachi Plant Technologies Ltd 室圧制御方法及びシステム
DE102008010658B4 (de) * 2008-02-22 2010-08-19 Knorr-Bremse Systeme für Nutzfahrzeuge GmbH Abgasregelsystem und Abgasregelverfahren
JP5744382B2 (ja) 2008-07-24 2015-07-08 株式会社荏原製作所 基板処理装置および基板処理方法
JP5528374B2 (ja) * 2011-03-03 2014-06-25 東京エレクトロン株式会社 ガス減圧供給装置、これを備えるシリンダキャビネット、バルブボックス、及び基板処理装置
JP6105868B2 (ja) * 2012-06-26 2017-03-29 株式会社不二工機 電動弁制御装置及び電動弁装置
US9465391B2 (en) * 2014-01-09 2016-10-11 Fisher Controls International Llc Valve positioner with overpressure protection capabilities

Also Published As

Publication number Publication date
US20220319874A1 (en) 2022-10-06
JP2020198324A (ja) 2020-12-10
WO2020241848A1 (ja) 2020-12-03
JP7143251B2 (ja) 2022-09-28
US11967508B2 (en) 2024-04-23

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