SG11202110483XA - Mounting apparatus - Google Patents

Mounting apparatus

Info

Publication number
SG11202110483XA
SG11202110483XA SG11202110483XA SG11202110483XA SG11202110483XA SG 11202110483X A SG11202110483X A SG 11202110483XA SG 11202110483X A SG11202110483X A SG 11202110483XA SG 11202110483X A SG11202110483X A SG 11202110483XA SG 11202110483X A SG11202110483X A SG 11202110483XA
Authority
SG
Singapore
Prior art keywords
mounting apparatus
mounting
Prior art date
Application number
SG11202110483XA
Other languages
English (en)
Inventor
Hijiri Hayashi
Tetsuya Utano
Kohei Seyama
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of SG11202110483XA publication Critical patent/SG11202110483XA/en

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Classifications

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    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
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    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
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  • Engineering & Computer Science (AREA)
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  • Computer Hardware Design (AREA)
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  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Auxiliary Devices For And Details Of Packaging Control (AREA)
  • Package Closures (AREA)
  • Control And Other Processes For Unpacking Of Materials (AREA)
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SG11202110483XA 2019-07-26 2020-07-15 Mounting apparatus SG11202110483XA (en)

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KR20210027503A (ko) * 2016-10-18 2021-03-10 베이징 이타운 세미컨덕터 테크놀로지 컴퍼니 리미티드 워크피스 처리를 위한 시스템 및 방법
TWI668789B (zh) * 2017-02-03 2019-08-11 日商新川股份有限公司 接合裝置
KR102000079B1 (ko) * 2017-07-19 2019-07-18 세메스 주식회사 다이 본딩 장치
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KR102047035B1 (ko) * 2017-09-25 2019-11-20 세메스 주식회사 다이 본딩 장치
JP7129793B2 (ja) * 2018-03-06 2022-09-02 シャープ株式会社 接合装置
KR102630226B1 (ko) * 2021-09-23 2024-01-29 한화정밀기계 주식회사 하이브리드 본딩 장치 및 이를 이용하는 하이브리드 본딩 방법

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WO2021020124A1 (ja) 2021-02-04
CN113632212A (zh) 2021-11-09
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