SG11202100516XA - Tape for glass processing - Google Patents

Tape for glass processing

Info

Publication number
SG11202100516XA
SG11202100516XA SG11202100516XA SG11202100516XA SG11202100516XA SG 11202100516X A SG11202100516X A SG 11202100516XA SG 11202100516X A SG11202100516X A SG 11202100516XA SG 11202100516X A SG11202100516X A SG 11202100516XA SG 11202100516X A SG11202100516X A SG 11202100516XA
Authority
SG
Singapore
Prior art keywords
tape
glass processing
glass
processing
Prior art date
Application number
SG11202100516XA
Other languages
English (en)
Inventor
Yukihiro Matsubara
Hirotoki Yokoi
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of SG11202100516XA publication Critical patent/SG11202100516XA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54—Glass
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
SG11202100516XA 2019-05-29 2020-03-04 Tape for glass processing SG11202100516XA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019100128A JP7269096B2 (ja) 2019-05-29 2019-05-29 ガラス加工用テープ
PCT/JP2020/009036 WO2020240965A1 (ja) 2019-05-29 2020-03-04 ガラス加工用テープ

Publications (1)

Publication Number Publication Date
SG11202100516XA true SG11202100516XA (en) 2021-02-25

Family

ID=73545921

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202100516XA SG11202100516XA (en) 2019-05-29 2020-03-04 Tape for glass processing

Country Status (7)

Country Link
JP (1) JP7269096B2 (ja)
KR (1) KR102505638B1 (ja)
CN (1) CN112368106B (ja)
PH (1) PH12021550130A1 (ja)
SG (1) SG11202100516XA (ja)
TW (1) TWI743811B (ja)
WO (1) WO2020240965A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114804647B (zh) * 2022-03-25 2024-04-05 吴江南玻华东工程玻璃有限公司 一种镀膜玻璃样片的制备方法及中空夹层玻璃样片

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS611830A (ja) * 1985-05-16 1986-01-07 Yanmar Diesel Engine Co Ltd デイーゼル機関の調速装置
JPH10310749A (ja) * 1997-05-13 1998-11-24 Mitsui Chem Inc 半導体ウエハダイシング用粘着フィルム及び半導体ウエハのダイシング方法
JP4358502B2 (ja) 2002-03-12 2009-11-04 浜松ホトニクス株式会社 半導体基板の切断方法
JP2004273895A (ja) 2003-03-11 2004-09-30 Disco Abrasive Syst Ltd 半導体ウエーハの分割方法
EP1634673A4 (en) * 2003-04-25 2009-04-08 Nitto Denko Corp METHOD FOR PRODUCING A LASER-TREATED PRODUCT AND AN ADHESIVE SHEET FOR A LASER TREATMENT USED FOR THIS PRODUCT
JP5151015B2 (ja) * 2005-08-25 2013-02-27 東洋紡株式会社 熱収縮性ポリエステル系フィルム及びラベルとその製造方法
CN101668794A (zh) * 2007-05-08 2010-03-10 三井化学株式会社 丙烯类聚合物的交联体
JP5290853B2 (ja) * 2009-04-28 2013-09-18 三菱樹脂株式会社 ダイシング用粘着シート
JP5554118B2 (ja) * 2010-03-31 2014-07-23 古河電気工業株式会社 ウエハ加工用テープ
JP2012174945A (ja) * 2011-02-23 2012-09-10 Furukawa Electric Co Ltd:The 半導体ウエハの加工方法
JP5801584B2 (ja) * 2011-03-29 2015-10-28 リンテック株式会社 ダイシングテープおよびチップ状部品の製造方法
JP5764519B2 (ja) * 2011-03-31 2015-08-19 古河電気工業株式会社 ダイシングテープ及び半導体ウエハ加工方法
JP5184685B1 (ja) * 2011-09-26 2013-04-17 古河電気工業株式会社 半導体ウエハ加工用テープ
JP5294358B2 (ja) * 2012-01-06 2013-09-18 古河電気工業株式会社 ウエハ加工用テープ及びこれを使用した半導体装置の製造方法
JP6295135B2 (ja) 2014-04-24 2018-03-14 日東電工株式会社 ダイシング・ダイボンドフィルム
WO2016152957A1 (ja) 2015-03-24 2016-09-29 古河電気工業株式会社 半導体加工用テープ
JP6632115B2 (ja) * 2015-07-17 2020-01-15 藤森工業株式会社 接着性樹脂層及び接着性樹脂フィルム
JP2017147293A (ja) * 2016-02-16 2017-08-24 日立化成株式会社 接着シートとダイシングテープを用いる半導体装置の製造方法
JP2018166148A (ja) * 2017-03-28 2018-10-25 リンテック株式会社 ダイシングシート用基材フィルムおよびダイシングシート
MY187307A (en) * 2018-03-28 2021-09-21 Furukawa Electric Co Ltd Tape for semiconductor processing

Also Published As

Publication number Publication date
CN112368106A (zh) 2021-02-12
TW202043403A (zh) 2020-12-01
JP7269096B2 (ja) 2023-05-08
CN112368106B (zh) 2022-11-01
PH12021550130A1 (en) 2021-09-27
WO2020240965A1 (ja) 2020-12-03
KR102505638B1 (ko) 2023-03-06
TWI743811B (zh) 2021-10-21
JP2020194906A (ja) 2020-12-03
KR20210015893A (ko) 2021-02-10

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