SG11202011472VA - Mould for encapsulating electronic components, insert for such a mould, method for producing an insert and method for encapsulating electronic components - Google Patents
Mould for encapsulating electronic components, insert for such a mould, method for producing an insert and method for encapsulating electronic componentsInfo
- Publication number
- SG11202011472VA SG11202011472VA SG11202011472VA SG11202011472VA SG11202011472VA SG 11202011472V A SG11202011472V A SG 11202011472VA SG 11202011472V A SG11202011472V A SG 11202011472VA SG 11202011472V A SG11202011472V A SG 11202011472VA SG 11202011472V A SG11202011472V A SG 11202011472VA
- Authority
- SG
- Singapore
- Prior art keywords
- mould
- insert
- electronic components
- encapsulating electronic
- producing
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
- H01L21/566—Release layers for moulds, e.g. release layers, layers against residue during moulding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
- H01L2924/1816—Exposing the passive side of the semiconductor or solid-state body
- H01L2924/18161—Exposing the passive side of the semiconductor or solid-state body of a flip chip
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL2021145A NL2021145B1 (en) | 2018-06-18 | 2018-06-18 | Mould for encapsulating electronic components, insert for such a mould, method for producing an insert and method for encapsulating electronic components |
PCT/NL2019/050374 WO2019245364A1 (en) | 2018-06-18 | 2019-06-18 | Mould for encapsulating electronic components, insert for such a mould, method for producing an insert and method for encapsulating electronic components |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202011472VA true SG11202011472VA (en) | 2020-12-30 |
Family
ID=63145170
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202011472VA SG11202011472VA (en) | 2018-06-18 | 2019-06-18 | Mould for encapsulating electronic components, insert for such a mould, method for producing an insert and method for encapsulating electronic components |
Country Status (8)
Country | Link |
---|---|
JP (1) | JP7391051B2 (ko) |
KR (1) | KR20210022002A (ko) |
CN (1) | CN112262461A (ko) |
NL (1) | NL2021145B1 (ko) |
PH (1) | PH12020552144A1 (ko) |
SG (1) | SG11202011472VA (ko) |
TW (1) | TWI834678B (ko) |
WO (1) | WO2019245364A1 (ko) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114679840B (zh) * | 2022-03-28 | 2024-05-24 | 杭州电子科技大学 | 一种柔性器件封装结构及封装方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4658353B2 (ja) * | 2001-03-01 | 2011-03-23 | ルネサスエレクトロニクス株式会社 | 樹脂モールド金型及び樹脂モールドパッケージの製造方法 |
NL1019042C2 (nl) * | 2001-09-26 | 2003-03-27 | Europ Semiconductor Assembly E | Werkwijze voor het inkapselen van een chip en/of ander voorwerp. |
JP4102634B2 (ja) * | 2002-09-27 | 2008-06-18 | Towa株式会社 | 電子部品の樹脂注入装置 |
JP2004128303A (ja) | 2002-10-04 | 2004-04-22 | Towa Corp | アンダーフィル樹脂モールド基板及び個片とアンダーフィル樹脂モールド方法及び金型 |
JP4443334B2 (ja) * | 2004-07-16 | 2010-03-31 | Towa株式会社 | 半導体素子の樹脂封止成形方法 |
JP4755206B2 (ja) * | 2006-02-03 | 2011-08-24 | 三井化学株式会社 | デジタル一眼レフカメラ用樹脂製中空パッケージ及びその製造方法並びにそれを用いた半導体装置及びデジタル一眼レフカメラ |
JP2007288081A (ja) | 2006-04-20 | 2007-11-01 | Towa Corp | 電子部品の樹脂封止成形装置 |
EP2192825A1 (en) * | 2008-11-26 | 2010-06-02 | Osram Gesellschaft mit Beschränkter Haftung | An injection tool for encapsulating electronic circuits with light sources, and related encapsulation process |
MY156340A (en) * | 2010-03-25 | 2016-02-15 | Sumitomo Bakelite Co | Epoxy resin composition for semiconductor encapsulation, and semiconductor device using the same |
JP5630652B2 (ja) * | 2011-01-06 | 2014-11-26 | 日立化成株式会社 | 封止用エポキシ樹脂成形材料および電子部品装置 |
CN105917451B (zh) | 2014-01-14 | 2018-07-06 | 山田尖端科技株式会社 | 树脂模制模具及树脂模制方法 |
-
2018
- 2018-06-18 NL NL2021145A patent/NL2021145B1/en active
-
2019
- 2019-06-18 KR KR1020207036958A patent/KR20210022002A/ko not_active Application Discontinuation
- 2019-06-18 WO PCT/NL2019/050374 patent/WO2019245364A1/en active Application Filing
- 2019-06-18 TW TW108121121A patent/TWI834678B/zh active
- 2019-06-18 CN CN201980039639.1A patent/CN112262461A/zh active Pending
- 2019-06-18 SG SG11202011472VA patent/SG11202011472VA/en unknown
- 2019-06-18 JP JP2020569196A patent/JP7391051B2/ja active Active
-
2020
- 2020-12-10 PH PH12020552144A patent/PH12020552144A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
JP2021531643A (ja) | 2021-11-18 |
PH12020552144A1 (en) | 2021-06-21 |
JP7391051B2 (ja) | 2023-12-04 |
TWI834678B (zh) | 2024-03-11 |
TW202000416A (zh) | 2020-01-01 |
NL2021145B1 (en) | 2020-01-06 |
KR20210022002A (ko) | 2021-03-02 |
CN112262461A (zh) | 2021-01-22 |
WO2019245364A1 (en) | 2019-12-26 |
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