SG11202011472VA - Mould for encapsulating electronic components, insert for such a mould, method for producing an insert and method for encapsulating electronic components - Google Patents
Mould for encapsulating electronic components, insert for such a mould, method for producing an insert and method for encapsulating electronic componentsInfo
- Publication number
- SG11202011472VA SG11202011472VA SG11202011472VA SG11202011472VA SG11202011472VA SG 11202011472V A SG11202011472V A SG 11202011472VA SG 11202011472V A SG11202011472V A SG 11202011472VA SG 11202011472V A SG11202011472V A SG 11202011472VA SG 11202011472V A SG11202011472V A SG 11202011472VA
- Authority
- SG
- Singapore
- Prior art keywords
- mould
- insert
- electronic components
- encapsulating electronic
- producing
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
- H01L21/566—Release layers for moulds, e.g. release layers, layers against residue during moulding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
- H01L2924/1816—Exposing the passive side of the semiconductor or solid-state body
- H01L2924/18161—Exposing the passive side of the semiconductor or solid-state body of a flip chip
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL2021145A NL2021145B1 (en) | 2018-06-18 | 2018-06-18 | Mould for encapsulating electronic components, insert for such a mould, method for producing an insert and method for encapsulating electronic components |
PCT/NL2019/050374 WO2019245364A1 (en) | 2018-06-18 | 2019-06-18 | Mould for encapsulating electronic components, insert for such a mould, method for producing an insert and method for encapsulating electronic components |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202011472VA true SG11202011472VA (en) | 2020-12-30 |
Family
ID=63145170
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202011472VA SG11202011472VA (en) | 2018-06-18 | 2019-06-18 | Mould for encapsulating electronic components, insert for such a mould, method for producing an insert and method for encapsulating electronic components |
Country Status (7)
Country | Link |
---|---|
JP (1) | JP7391051B2 (en) |
KR (1) | KR20210022002A (en) |
CN (1) | CN112262461A (en) |
NL (1) | NL2021145B1 (en) |
PH (1) | PH12020552144A1 (en) |
SG (1) | SG11202011472VA (en) |
WO (1) | WO2019245364A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114679840B (en) * | 2022-03-28 | 2024-05-24 | 杭州电子科技大学 | Flexible device packaging structure and packaging method |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4658353B2 (en) * | 2001-03-01 | 2011-03-23 | ルネサスエレクトロニクス株式会社 | Resin mold and resin mold package manufacturing method |
NL1019042C2 (en) * | 2001-09-26 | 2003-03-27 | Europ Semiconductor Assembly E | Method for encapsulating a chip and / or other object. |
JP4102634B2 (en) * | 2002-09-27 | 2008-06-18 | Towa株式会社 | Resin injection device for electronic parts |
JP2004128303A (en) * | 2002-10-04 | 2004-04-22 | Towa Corp | Underfill resin mold substrate and individual piece, and underfill resin molding method and die |
JP4443334B2 (en) * | 2004-07-16 | 2010-03-31 | Towa株式会社 | Resin sealing molding method of semiconductor element |
JP2007288081A (en) * | 2006-04-20 | 2007-11-01 | Towa Corp | Resin seal molding device of electronic component |
EP2192825A1 (en) * | 2008-11-26 | 2010-06-02 | Osram Gesellschaft mit Beschränkter Haftung | An injection tool for encapsulating electronic circuits with light sources, and related encapsulation process |
JP6422447B2 (en) * | 2014-01-14 | 2018-11-14 | アピックヤマダ株式会社 | Resin mold and resin molding method |
-
2018
- 2018-06-18 NL NL2021145A patent/NL2021145B1/en active
-
2019
- 2019-06-18 JP JP2020569196A patent/JP7391051B2/en active Active
- 2019-06-18 SG SG11202011472VA patent/SG11202011472VA/en unknown
- 2019-06-18 KR KR1020207036958A patent/KR20210022002A/en not_active Application Discontinuation
- 2019-06-18 WO PCT/NL2019/050374 patent/WO2019245364A1/en active Application Filing
- 2019-06-18 CN CN201980039639.1A patent/CN112262461A/en active Pending
-
2020
- 2020-12-10 PH PH12020552144A patent/PH12020552144A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
PH12020552144A1 (en) | 2021-06-21 |
TW202000416A (en) | 2020-01-01 |
JP7391051B2 (en) | 2023-12-04 |
CN112262461A (en) | 2021-01-22 |
WO2019245364A1 (en) | 2019-12-26 |
JP2021531643A (en) | 2021-11-18 |
NL2021145B1 (en) | 2020-01-06 |
KR20210022002A (en) | 2021-03-02 |
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