TW202000416A - Mould for encapsulating electronic components, insert for such a mould, method for producing an insert and method for encapsulating electronic components - Google Patents
Mould for encapsulating electronic components, insert for such a mould, method for producing an insert and method for encapsulating electronic components Download PDFInfo
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- TW202000416A TW202000416A TW108121121A TW108121121A TW202000416A TW 202000416 A TW202000416 A TW 202000416A TW 108121121 A TW108121121 A TW 108121121A TW 108121121 A TW108121121 A TW 108121121A TW 202000416 A TW202000416 A TW 202000416A
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- electronic components
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- 238000000034 method Methods 0.000 title claims abstract description 45
- 238000004519 manufacturing process Methods 0.000 title description 6
- 238000000465 moulding Methods 0.000 claims abstract description 100
- 239000012778 molding material Substances 0.000 claims description 36
- 230000008878 coupling Effects 0.000 claims description 28
- 238000010168 coupling process Methods 0.000 claims description 28
- 238000005859 coupling reaction Methods 0.000 claims description 28
- 239000002184 metal Substances 0.000 claims description 24
- 239000011888 foil Substances 0.000 claims description 23
- 239000002861 polymer material Substances 0.000 claims description 7
- 239000000969 carrier Substances 0.000 claims description 3
- 229920001971 elastomer Polymers 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 3
- 229920003051 synthetic elastomer Polymers 0.000 claims description 3
- 239000005061 synthetic rubber Substances 0.000 claims description 3
- 239000004848 polyfunctional curative Substances 0.000 claims description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims 1
- 239000000806 elastomer Substances 0.000 claims 1
- 229910052731 fluorine Inorganic materials 0.000 claims 1
- 239000011737 fluorine Substances 0.000 claims 1
- 238000004806 packaging method and process Methods 0.000 description 14
- 239000000758 substrate Substances 0.000 description 11
- 239000000463 material Substances 0.000 description 6
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 229920001973 fluoroelastomer Polymers 0.000 description 3
- 239000005022 packaging material Substances 0.000 description 3
- 238000012858 packaging process Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000001721 transfer moulding Methods 0.000 description 3
- 238000000748 compression moulding Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
- H01L21/566—Release layers for moulds, e.g. release layers, layers against residue during moulding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
- H01L2924/1816—Exposing the passive side of the semiconductor or solid-state body
- H01L2924/18161—Exposing the passive side of the semiconductor or solid-state body of a flip chip
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
Description
本發明有關一種模具，用於封裝一載體上安裝的多個電子組件，該模具包括至少二個可相對彼此移位之模件，該等模件至少其中之一於其接觸側內凹設一模穴，且該等模件之設計係配合該模穴，圍繞欲封裝的電子組件。本發明亦提供一種方法，其中使用此種模具封裝一載體上安裝的多個電子組件，此方法包括以下處理步驟：a)將載有一或多個電子組件的載體，置於兩模件之間，並使該等電子組件面向一模穴；b)將該等模件朝向彼此移動，以使該載體夾置於該等模件之間，讓所述至少一模穴圍住欲封裝的電子組件，並使所述嵌件接觸該等電子組件至少其中之一；c)將一成型材料注入該模穴；及d)將該等模件彼此分開，並將含有已成型電子組件的載體從該等模件中取出，藉此亦使該嵌件脫離該等電子組件。此外，本發明亦提供用於本發明模具與方法之嵌件，以及此種嵌件的製作方法。The present invention relates to a mold for encapsulating a plurality of electronic components mounted on a carrier. The mold includes at least two modules that can be displaced relative to each other, and at least one of the modules is recessed on its contact side. Cavity, and the design of the modules is matched with the cavity, surrounding the electronic component to be packaged. The present invention also provides a method in which a plurality of electronic components mounted on a carrier are encapsulated using such a mold. The method includes the following processing steps: a) placing a carrier carrying one or more electronic components between two modules And make the electronic components face a mold cavity; b) move the modules toward each other so that the carrier is sandwiched between the modules, so that the at least one mold cavity surrounds the electron to be packaged Components, and the insert is brought into contact with at least one of the electronic components; c) a molding material is injected into the cavity; and d) the modules are separated from each other, and the carrier containing the molded electronic components is removed from The modules are taken out, thereby also detaching the insert from the electronic components. In addition, the present invention also provides an insert for the mold and method of the present invention, and a method for manufacturing such an insert.
使用一成型材料封裝一載體上安裝的多個電子組件，為一已知技術。其中之載體通常亦稱為「基板」。在工業規模的生產中，此種電子組件都有封裝，通常是使用添加了填充材料的硬化環氧樹脂(epoxy)或樹脂(resin)形成所述封裝。市場的趨勢係朝向同時封裝大量尺寸不同且精確度需求仍不斷提高的的電子組件。如此可產生在單一包裝中具有多種不同電子組件組合的製品。此處可將所述電子組件設想為諸如各種半導體(係指晶片，雖然發光二極體LEDs在這方面亦被視為半導體)，而這類半導體通常變得越來越小。一旦注入成型材料，該等集體封裝的電子組件即位於設在該載體單側但有時也設在該載體兩側的封裝(包裝)體內。所述成型或封裝材料經常呈現為與該載體連接之一扁平層，將該等電子組件全部或局部埋入或封裝於該扁平層內。所述載體可包含一引線框架、一局部使用環氧樹脂製成之多層載體(亦稱為電路板或基板等)或另一載體結構。The use of a molding material to encapsulate multiple electronic components mounted on a carrier is a known technique. The carrier is usually also called "substrate". In industrial-scale production, such electronic components are packaged, and the package is usually formed by using a hardened epoxy resin or resin added with a filler material. The market trend is towards the simultaneous packaging of a large number of electronic components with different sizes and the demand for accuracy is still increasing. This can produce articles with multiple combinations of different electronic components in a single package. Here, the electronic components can be imagined as various semiconductors (referred to as wafers, although light emitting diodes LEDs are also regarded as semiconductors in this respect), and such semiconductors generally become smaller and smaller. Once the molding material is injected, the collectively packaged electronic components are located in a package (packaging) body provided on one side of the carrier but sometimes also on both sides of the carrier. The molding or packaging material often appears as a flat layer connected to the carrier, and the electronic components are completely or partially embedded or encapsulated in the flat layer. The carrier may include a lead frame, a multilayer carrier (also called a circuit board or substrate, etc.) made of epoxy resin, or another carrier structure.
封裝一載體上安裝的多個電子組件時，根據先前技術之封裝製程，通常係提供至少二個半模，該等半模至少其中之一係凹設一或複數個模穴。將載有欲封裝電子組件的載體置於兩半模之間後，再將兩半模朝彼此移動，例如，使它們夾住該載體。然後可將一種通常已加熱的液態成型材料饋入該等模穴；通常是利用轉送成型(transfer moulding)來饋入所述成型材料。或者，也可以在兩模件閉合前，將成型材料注入模穴，此種替代轉送成型的製程稱為壓縮成型(compression moulding)。等所述一或二個模穴內的成型材料至少局部(化學)硬化後，從封裝壓床取出載有已封裝電子組件的載體，並可於進一步處理時將封裝後的製品彼此分開。尤其，在封裝製程中，可使用金屬箔將一部份電子組件隔開，如此可防止電子組件被金屬箔覆蓋的部份被成型材料覆蓋。被成型材料局部覆蓋的電子組件可用於各種不同應用中，例如各種不同類型的感知器組件、超薄型封裝或散熱組件(全部未封裝成型的電子組件稱為「裸晶」或「裸片」製品)。此種封裝方法是以大型工業規模進行的，並可在妥善控制下進行局部無覆蓋的電子組件的封裝。先前技術之電子組件封裝製程可產生局部無覆蓋的電子組件，但其問題在於此種製程只適於封裝大量電子組件，且該等電子組件上欲保留不覆蓋的扁平部位，須具有相同的高度。因此，該等電子組件上欲保留不覆蓋之部位的靈活性，以及以局部不覆蓋方式同時封裝高度不同的多個電子組件的可能性，都受到限制。When packaging a plurality of electronic components mounted on a carrier, according to the packaging process of the prior art, usually at least two mold halves are provided, and at least one of the mold halves is provided with one or more mold cavities. After the carrier carrying the electronic component to be packaged is placed between the two mold halves, the two mold halves are moved toward each other, for example, so that they sandwich the carrier. A liquid moulding material which is usually heated can then be fed into the mould cavities; the moulding material is usually fed by transfer moulding. Alternatively, the molding material can be injected into the cavity before the two molds are closed. This alternative transfer molding process is called compression molding. After the molding material in the one or two cavities is at least partially (chemically) hardened, the carrier carrying the packaged electronic components is taken out from the packaging press, and the packaged products can be separated from each other during further processing. In particular, in the packaging process, metal foil can be used to separate a part of the electronic components, so as to prevent the parts of the electronic components covered by the metal foil from being covered by the molding material. Electronic components partially covered by molding materials can be used in various applications, such as various types of sensor components, ultra-thin packaging or heat dissipation components (all unpackaged electronic components are called "die" or "die" Products). This packaging method is carried out on a large-scale industrial scale, and can encapsulate partially uncovered electronic components under proper control. The prior art electronic component packaging process can produce partially uncovered electronic components, but the problem is that this process is only suitable for packaging a large number of electronic components, and the flat parts on these electronic components that want to retain uncovered must have the same height . Therefore, the flexibility to keep the parts that are not covered on these electronic components and the possibility of simultaneously encapsulating multiple electronic components of different heights in a partially uncovered manner are limited.
本發明之目的係提供另一種用於封裝多個電子組件的模具與方法，當電子組件中未覆蓋的部份具有不同尺寸且/或形狀差異時，使用此種模具與方法可實現電子組件的局部不覆蓋封裝。The purpose of the present invention is to provide another mold and method for encapsulating multiple electronic components. When the uncovered parts of the electronic component have different sizes and/or shapes, the mold and method can be used to achieve the electronic component Partially do not cover the package.
為達此一目的，如前簡介，本發明提供一種模具，用以封裝一載體上安裝的多個電子組件，其中係使用一嵌件形成至少該模穴的一部份，而該嵌件具有一面向該等電子組件的撓性立體成型表面。此處，該嵌件成型表面的撓性係詮釋為可相對兩模件的無撓性結構產生撓曲。此種嵌件亦可稱為「襯墊」，它可實現具有任何所需形狀的接觸表面。此外，該嵌件的成型表面形狀通常極為貼合欲封裝的電子組件之形狀。由於可實現具有任何所需形狀的接觸表面，根據本發明之模具允許成型後的電子組件具有更高的形狀自由度，其中，該嵌件還可以配合不同尺寸的電子組件組合，也可以配合尺寸相同但「覆蓋率」需求不同的電子組件組合。例如，在單一封裝內具有不同高度的多種電子組件，可為「裸晶」經成型後外露例如一較小電子組件之上表面及一較高電子組件之表面。此處，所述嵌件之撓性立體成型表面係設為可在成型期間接觸該等電子組件欲保留外露的部份。設計所述嵌件時，亦可使其在接觸或不接觸一或多個電子組件的情況，還接觸該載體的一部份，以使該載體的一部份保持外露。該載體外露的部份可作為一連接器及/或一成型表面，供日後安裝一或多個組件。透過所述嵌件成型表面的拓樸(topology)，亦可在硬化的成型材料上實現局部位置內的高度變異。此外，由於該嵌件成型表面有撓性，所以所述嵌件可透過形變補償該等電子組件的高度公差。以此種方式，在成型期間，即使該撓性立體成型表面並非完全配合該等電子組件的形狀，也不會對電子組件產生過多的壓力。To achieve this goal, as described above, the present invention provides a mold for encapsulating a plurality of electronic components mounted on a carrier, wherein an insert is used to form at least a part of the mold cavity, and the insert has A flexible three-dimensional molding surface facing the electronic components. Here, the flexibility of the molding surface of the insert is interpreted as being able to deflect the inflexible structure of the two modules. Such inserts can also be referred to as "pads", which can achieve contact surfaces with any desired shape. In addition, the shape of the molding surface of the insert is very close to the shape of the electronic component to be packaged. Since a contact surface having any desired shape can be realized, the mold according to the present invention allows the molded electronic component to have a higher degree of freedom in shape, wherein the insert can also be combined with electronic components of different sizes, and can also be sized The same combination of electronic components with different "coverage" requirements. For example, a variety of electronic components with different heights in a single package can be "die" exposed after molding such as the upper surface of a smaller electronic component and the surface of a higher electronic component. Here, the flexible three-dimensional molding surface of the insert is configured to contact the parts of the electronic components that are to be exposed during molding. When designing the insert, it may also contact a part of the carrier with or without contacting one or more electronic components, so as to keep a part of the carrier exposed. The exposed part of the carrier can be used as a connector and/or a molding surface for the installation of one or more components in the future. Through the topology of the insert molding surface, a high degree of variation in local position can also be achieved on the hardened molding material. In addition, because the molding surface of the insert is flexible, the insert can compensate for the high tolerance of the electronic components through deformation. In this way, during molding, even if the flexible three-dimensional molding surface does not completely match the shape of the electronic components, excessive pressure will not be generated on the electronic components.
根據本發明模具之一實施例，該嵌件的立體成型表面係使用一種聚合物材料製成，例如，使用一種硫化合成橡膠製成，更明確地說，係使用一種含氟彈性體製成的。在一常見變異中，該嵌件係由一種FKM型橡膠(氟化橡膠)構成。使用硫化合成橡膠，尤其是使用含氟彈性體作為該嵌件之立體成型表面，其優點在於此類材料能耐受成型材料的處理高溫，同時也具有撓性及抗化學藥劑性。前述耐高溫特性是必要的，因為將成型材料注入模穴時，外加的處理溫度通常在100-200°C之間。含氟彈性體通常更耐熱與耐化學腐蝕性。According to one embodiment of the mold of the present invention, the three-dimensional molding surface of the insert is made of a polymer material, for example, a vulcanized synthetic rubber, more specifically, a fluoroelastomer . In a common variation, the insert is composed of a FKM type rubber (fluorinated rubber). The use of vulcanized synthetic rubber, especially the use of fluoroelastomers as the three-dimensional molding surface of the insert, the advantage is that such materials can withstand the high temperature of the molding material processing, but also has flexibility and chemical resistance. The aforementioned high temperature resistance characteristics are necessary because when the molding material is injected into the cavity, the applied processing temperature is usually between 100-200°C. Fluoroelastomers are generally more resistant to heat and chemicals.
所述嵌件可經由能脫離的方式與該模件連接，以允許更換嵌件。如此可在多個生產周期之間，允許封裝設計不同的多個電子組件而不須改變該等模件，並允許更換破損的嵌件。The insert can be detachably connected to the module to allow replacement of the insert. This allows multiple electronic components with different packaging designs to be packaged without changing the modules between multiple production cycles and allows replacement of damaged inserts.
根據另一增加模具功能性的解決方案中，該模具可包括多個撓性嵌件，此等嵌件具有面向該等電子組件的立體成型表面。此處，每一嵌件的立體成型表面可有不同的設計，因此可在同一模具內同時成型多個具有不同設計的電子組件。然而，倘若一組要封裝的電子組件於成型後要形成形狀完全相同的封裝，那麼可讓該等嵌件的成型表面具有相同的形狀。使用多數嵌件的另一優點在於，該等嵌件若有例如破損或失效的情況，可以各自獨立更換。According to another solution to increase the functionality of the mold, the mold may include a plurality of flexible inserts having three-dimensional molding surfaces facing the electronic components. Here, the three-dimensional molding surface of each insert can have different designs, so multiple electronic components with different designs can be molded simultaneously in the same mold. However, if a group of electronic components to be packaged are to form packages with the same shape after molding, then the molding surfaces of the inserts can have the same shape. Another advantage of using most inserts is that if the inserts are damaged or fail, they can be replaced independently.
根據再一增加模具功能性的方式，該模具可包括至少二個彼此相對之模件，其接觸側各凹設一模穴；其中，該等模穴至少局部各由一具有撓性立體成型表面的嵌件形成。藉由在兩個彼此相對之模件的接觸側各提供一模穴，可在該載體及/或該載體兩相反側上的電子組件間保留一空間，在成型期間用來填充成型材料。藉此可同時封裝該載體(的一部份)及/或位於該載體兩相反側上的電子組件。此外，由於兩個模穴都可至少局部由一具有撓性立體成型表面的嵌件形成，所以成型後電子組件之形狀自由度及電子組件之高度公差補償能力，係適用於該載體兩相反側上安裝的電子組件。According to yet another way to increase the functionality of the mold, the mold may include at least two modules opposed to each other, each of which has a cavity on the contact side; wherein the cavity at least partially includes a flexible three-dimensional molding surface Of the insert. By providing a mold cavity on the contact sides of two opposing modules, a space can be reserved between the carrier and/or electronic components on opposite sides of the carrier for filling the molding material during molding. Thereby, (a part of) the carrier and/or electronic components on opposite sides of the carrier can be packaged at the same time. In addition, since both mold cavities can be formed at least partially by an insert with a flexible three-dimensional molding surface, the shape freedom of the electronic component after molding and the high tolerance compensation capability of the electronic component are applicable to the opposite sides of the carrier Electronic components installed on.
或者， 由一對彼此相對之嵌件所提供的二個彼此相對的撓性立體成型表面，其中之一可作為貼合該等電子組件的支撐表面，不論該等電子組件是否要封裝在該載體的單側；而包圍位於該載體另側電子組件的模穴，則至少局部由該等彼此相對的撓性立體成型表面中的另一成型表面形成之。因此，作為支撐表面的撓性立體成型表面，其拓樸最好配合受撐電子組件及載體之拓樸。使用該嵌件的撓性立體成型表面作為支撐表面，其優點在於，該支撐表面可支撐的表面，具有形狀自由度。此外，以該撓性立體成型表面作為支撐表面時，能夠補償受撐表面內的尺寸公差；若受撐表面上包括已封裝的電子組件時，此種尺寸公差補償能力尤其有用。藉由本發明此一模具實施例，雖然所述載體兩相反側上都可有電子組件安裝其上，但可以只封裝該載體單側上的電子組件。因此可以讓該載體一側上的電子組件保留為未封裝的樣態。然而，也可以依序封裝該載體兩相反側的電子組件；其中，當第一次成型作業完成後，要將該載體上下翻轉。Or, two mutually opposing flexible three-dimensional molding surfaces provided by a pair of mutually opposing inserts, one of which can be used as a supporting surface for fitting the electronic components, regardless of whether the electronic components are to be packaged in the carrier One side of the carrier; and the cavity surrounding the electronic component on the other side of the carrier is formed at least partially by another molding surface among the flexible three-dimensional molding surfaces facing each other. Therefore, as the flexible three-dimensional molding surface of the supporting surface, its topology is preferably matched with the topology of the supported electronic components and carriers. The use of the flexible three-dimensional molding surface of the insert as a supporting surface has the advantage that the surface that can be supported by the supporting surface has freedom in shape. In addition, when the flexible three-dimensional molding surface is used as a supporting surface, the dimensional tolerance in the supported surface can be compensated; if the supported surface includes packaged electronic components, such dimensional tolerance compensation capability is particularly useful. With this mold embodiment of the present invention, although electronic components can be mounted on opposite sides of the carrier, only electronic components on one side of the carrier can be encapsulated. Therefore, the electronic components on one side of the carrier can be left unencapsulated. However, electronic components on opposite sides of the carrier can also be packaged in sequence; wherein, after the first molding operation is completed, the carrier must be turned upside down.
根據本發明模具之一較佳實施例，該嵌件立體成型表面之硬度，依照ASTM D2240 A型規範，在70-100 Sh-A之間，較佳在80-90 Sh-A之間。依目前發現，此硬度範圍內的成型表面可在撓性與尺寸穩定性之間，提供適當的平衡。所述嵌件成型表面應有充分的撓性，以便能配合該等電子組件的尺寸公差。透過其撓性，該成型表面可以接觸該等電子組件於封裝後欲保留裸露的不同部份，而不會對該等電子組件產生高壓力。另一方面，該嵌件成型表面也應具有充分的剛性，以於成型製程期間，尤其是將成型材料注入模穴的期間，保持尺寸穩定。因此，該成型表面應極為貼合該等電子組件欲保留外露且毫無任何成型材料的部份。如此可確保成型材料只封裝電子組件上需要封裝的部位。According to a preferred embodiment of the mold of the present invention, the hardness of the three-dimensional molding surface of the insert is between 70-100 Sh-A, preferably 80-90 Sh-A, in accordance with ASTM D2240 Type A specifications. According to the current findings, the molding surface in this hardness range can provide an appropriate balance between flexibility and dimensional stability. The insert molding surface should have sufficient flexibility to match the dimensional tolerances of the electronic components. Through its flexibility, the molding surface can contact different parts of the electronic components that are to be kept exposed after packaging without high pressure on the electronic components. On the other hand, the molding surface of the insert should also have sufficient rigidity to maintain dimensional stability during the molding process, especially when the molding material is injected into the cavity. Therefore, the molding surface should closely fit the parts of the electronic components that want to remain exposed without any molding material. This ensures that the molding material encapsulates only the parts of the electronic component that need to be encapsulated.
所述嵌件可包括一無撓性聯結件，用以承載該撓性立體成型表面。因此，所述無撓性聯結件可用大致剛性的材料製成，諸如金屬。通常，設置所述無撓性聯結件的一側，係背對面向欲成型電子組件的那一側。所述嵌件的無撓性聯結件可對該撓性成型表面提供妥善控制的支撐。如此有利於該嵌件的尺寸穩定性。此外，所述無撓性聯結件有助於嵌件與模具的聯結。為了易於與模件聯結，所述無撓性聯結件可設置聯結裝置。The insert may include a non-flexible coupling piece for supporting the flexible three-dimensional molding surface. Therefore, the non-flexible coupling can be made of a substantially rigid material, such as metal. Generally, the side where the non-flexible coupling member is provided is the side facing away from the electronic component to be molded. The non-flexible coupling of the insert can provide properly controlled support for the flexible molding surface. This is beneficial to the dimensional stability of the insert. In addition, the non-flexible coupling facilitates the coupling of the insert and the mold. For easy coupling with the module, the flexible coupling can be provided with a coupling device.
為了確保注入模穴的成型材料留在模穴內部而不會經由嵌件洩漏，所述嵌件立體成型表面較佳對該成型材料具有防滲能力。使用對該成型材料具有防滲能力的成型表面時，不必額外以例如覆蓋片或金屬箔等形式覆蓋所述嵌件即可達到優質的模穴密封。In order to ensure that the molding material injected into the cavity remains inside the cavity without leaking through the insert, the three-dimensional molding surface of the insert preferably has impermeability to the molding material. When using a molding surface having impermeability to the molding material, it is not necessary to additionally cover the insert in the form of, for example, a cover sheet or a metal foil to achieve high-quality cavity sealing.
根據本發明模具之再一實施例，包含該模穴且設為用以容置所述模具嵌件的模件，係包括一開孔。此開孔將所述模穴連同其內的嵌件連接至該模具的外部。此開孔可連接一負壓裝置，以於該模穴內產生局部真空；在特定實例中，也能在該嵌件之撓性立體成型表面產生局部真空。為了連接所述開孔與該嵌件成型表面，該等模件其中之一內凹設的模穴於其一側與該嵌件之間可保留一空間。所述嵌件可選擇性地或額外地設置多個抽吸孔， 該等抽吸孔從所述成型表面延伸至該嵌件後側，亦即背對成型表面的那一側。若該嵌件立體成型表面與該等欲封裝的電子組件之間插設有一金屬箔層，那麼外加於該成型表面與該金屬箔層之間的負壓會將金屬箔吸到該成型表面上。如此可確保金屬箔層貼合該成型表面之立體拓樸。尤其，敷設所述金屬箔層有助於從模穴中脫出已成型的電子組件。According to yet another embodiment of the mold of the present invention, the mold including the mold cavity and configured to receive the mold insert includes an opening. This opening connects the cavity with the insert in it to the outside of the mold. The opening can be connected to a negative pressure device to generate a partial vacuum in the cavity; in a specific example, a partial vacuum can also be generated on the flexible three-dimensional molding surface of the insert. In order to connect the opening with the molding surface of the insert, a cavity in one of the modules can be reserved between one side and the insert. The insert may optionally or additionally be provided with a plurality of suction holes that extend from the molding surface to the rear side of the insert, that is, the side facing away from the molding surface. If a metal foil layer is interposed between the three-dimensional molding surface of the insert and the electronic components to be packaged, the negative pressure applied between the molding surface and the metal foil layer will suck the metal foil onto the molding surface . This ensures that the metal foil layer conforms to the three-dimensional topology of the molding surface. In particular, laying the metal foil layer helps to release the formed electronic component from the cavity.
本發明進而有關一種用於本發明模具中的嵌件，其優點已於先前有關本發明模具的敘述中說明過。The invention further relates to an insert used in the mold of the invention, the advantages of which have already been described in the previous description of the mold of the invention.
本發明亦有關一種方法，用於製作本發明之嵌件，此方法包括：使一聚合物材料連同一硬化劑在一無撓性聯結件與一相對的模具之間成型，藉此使該聚合物材料在該無撓性聯結件上硫化(硬化)。藉由所述聚合物材料在該無撓性聯結件上硫化(硬化)，可以在該撓性立體成型表面與該無撓性聯結件之間實現牢固的結合。在硬化期間，聚合物鏈之間形成交聯，如此可顯著增加所述聚合物材料及該嵌件撓性立體成型表面的強度與耐用性。然而，可能需要後硬化處理，諸如使用滅菌釜，以達最佳硬化。The present invention also relates to a method for manufacturing the insert of the present invention. The method includes: forming a polymer material with a hardener between a non-flexible coupling member and an opposing mold, thereby allowing the polymerization The material is vulcanized (hardened) on the non-flexible coupling. By vulcanizing (hardening) the polymer material on the inflexible coupling member, a firm bond can be achieved between the flexible three-dimensional molding surface and the inflexible coupling member. During hardening, cross-links are formed between the polymer chains, which can significantly increase the strength and durability of the polymer material and the flexible three-dimensional molding surface of the insert. However, post-hardening treatment may be required, such as using a sterilizer to achieve optimal hardening.
最後，本發明亦有關一種方法，其中使用根據本發明之模具，封裝一載體上安裝的多個電子組件。此方法包括以下處理步驟：a)載有一或多個電子組件的載體，置於兩模件之間，並使該等電子組件面向一模穴；b)將該等模件朝向彼此移動，以使該載體夾置於該等模件之間，讓所述至少一模穴圍住欲封裝的電子組件，並使所述嵌件接觸該等電子組件至少其中之一及/或該載體；c)將一成型材料注入該模穴；及d)將該等模件彼此分開，並將含有已成型電子組件的載體從該等模件中取出，藉此亦使該嵌件脫離該等電子組件。藉由執行此方法，可以獲得一封裝後製品，其中，除了所述嵌件在成型期間與該等電子組件及/或該載體接觸之至少一位置，該等電子組件及該載體至少局部被該成型材料覆蓋。如先前已曾提到，由於具有撓性嵌件成型表面，所以該嵌件可藉由有限的形變補償該等電子組件於尺寸上的高度公差。如此可避免在成型期間對該等電子組件施加過度的壓力。使用本發明之嵌件時，甚至可補償高達50μm的高度公差。Finally, the invention also relates to a method in which a mold according to the invention is used to encapsulate a plurality of electronic components mounted on a carrier. The method includes the following processing steps: a) a carrier carrying one or more electronic components is placed between the two modules, and the electronic components are oriented toward a cavity; b) the modules are moved toward each other, to Placing the carrier between the modules, allowing the at least one cavity to surround the electronic component to be packaged, and allowing the insert to contact at least one of the electronic components and/or the carrier; c ) Inject a molding material into the cavity; and d) separate the modules from each other, and remove the carrier containing the molded electronic components from the modules, thereby also removing the insert from the electronic components . By performing this method, a packaged product can be obtained in which, in addition to at least one location where the insert is in contact with the electronic components and/or the carrier during molding, the electronic components and the carrier are at least partially Covered with molding material. As mentioned previously, due to the flexible insert molding surface, the insert can compensate for the high tolerance of the dimensions of the electronic components by limited deformation. This prevents excessive pressure on the electronic components during molding. When using the insert of the present invention, even a height tolerance of up to 50 μm can be compensated.
將載有一或多個電子組件的載體夾在兩模件之間前，可以在所述模穴內引進一金屬箔層，以至少局部覆蓋該嵌件的撓性立體成型表面。所述金屬箔層可作為脫模金屬箔，有助於從模穴中脫出已局部成型的電子組件。尤其，該等模件朝向彼此移動時，於該處理步驟c)的期間，所述金屬箔被夾置於該嵌件與該等電子組件及/或該載體之間。在一較佳實例中，可經由所述模件內的一個開孔，將一負壓外加於該金屬箔層與該嵌件撓性立體成型表面之間。此負壓可確保該金屬箔層貼合該成型表面之立體拓樸並於整個成型製程中繼續留在該成型表面上。Before sandwiching the carrier carrying one or more electronic components between the two modules, a metal foil layer can be introduced into the cavity to at least partially cover the flexible three-dimensional molding surface of the insert. The metal foil layer can be used as a mold release metal foil, which helps to release partially formed electronic components from the cavity. In particular, when the modules move towards each other, during the processing step c), the metal foil is sandwiched between the insert and the electronic components and/or the carrier. In a preferred example, a negative pressure may be applied between the metal foil layer and the flexible three-dimensional molding surface of the insert through an opening in the module. This negative pressure can ensure that the metal foil layer conforms to the three-dimensional topography of the molding surface and remains on the molding surface throughout the molding process.
根據本發明方法之一實施例，封裝一載體上安裝的多個電子組件時，先根據方法步驟b)將該等模件朝向彼此移動後，再根據方法步驟c)將成型材料注入該模穴，其中係在該成型材料上施加壓力，將液態的成型材料移置到包圍該等電子組件的模穴內。此方法亦稱為「轉送成型」。因此，在該等模件彼此分開之前，該成型材料已至少局部硬化，而從模具脫出已成型的製品時，由模具塑形的製品不會失去其形狀。在另一替代成型製程中，係根據方法步驟b)將該等模件朝向彼此移動前，先根據方法步驟c)將封裝材料注入該模穴。此種成型製程亦稱為「壓縮成型」。本發明之實施不限於特定類型的成型製程。通常在成型製程前及/或製程期間，會將封裝材料加熱，但這同樣不是本發明的限制條件。According to an embodiment of the method of the present invention, when encapsulating a plurality of electronic components mounted on a carrier, first move the other modules toward each other according to method step b), and then inject molding material into the cavity according to method step c) , Where pressure is applied to the molding material to displace the liquid molding material into the cavity surrounding the electronic components. This method is also known as "transfer molding". Therefore, before the modules are separated from each other, the molding material has at least partially hardened, and when the molded product is released from the mold, the product shaped by the mold does not lose its shape. In another alternative molding process, according to method step b), before the isomodules are moved toward each other, the packaging material is injected into the cavity according to method step c). This molding process is also called "compression molding". The implementation of the present invention is not limited to a specific type of molding process. Generally, the packaging material is heated before and/or during the molding process, but this is also not a limitation of the present invention.
圖1為一剖視圖，顯示本發明模具(1)夾住一個載體或基板(2)，該載體/基板(2)上承載多個要合併在單一封裝內的電子組件(3)。該模具(1)包括二個模件(4, 5)，其中上模件(5)於其接觸側(7)凹設一模穴(6)。模穴(6)的一側由一嵌件(8)定義之。該嵌件(8)具有一撓性立體成型表面(9)，面向該等電子組件(3)。該嵌件(8)背對所述立體成型表面(9)並面向上模件(5)的那一側，包括一無撓性聯結件(10)，用於支撐該成型表面(9)。該嵌件(8)係藉由多支設於該無撓性聯結件(10)上作為聯結裝置的螺栓(11)，以可脫離的樣態連接於該上模件(5)。該上模件(5)更設有多個抽吸開孔(12)，該等開孔(12)之一端連接到所述模具(1)外側，並與一負壓裝置(13)連接。該等開孔(12)由狹窄空間流入寬廣的模穴(6)內部，其中，該嵌件(8)與該模穴(6)的一側之間有一保留空間，如此可確保所述撓性立體成型表面(9)與一金屬箔層(14)之間有一外加的負壓。所述金屬箔層(14)係夾在該嵌件(8)與該等電子組件(3)及該載體(2)之間(一方面是該嵌件(8)，另一方面是該等電子組件(3)及該載體(2))，藉此至少局部覆蓋所述撓性立體成型表面(9)。與該金屬箔層(14)接觸的電子組件表面(15)及載體表面(16)會於成型後外露。要從該等模件(4, 5)脫出載有已成型電子組件(3)的載體(2)時，所述金屬箔層(14)將作為脫模金屬箔。1 is a cross-sectional view showing that the mold (1) of the present invention sandwiches a carrier or substrate (2), and the carrier/substrate (2) carries a plurality of electronic components (3) to be combined in a single package. The mold (1) includes two modules (4, 5), wherein the upper mold (5) has a cavity (6) recessed on its contact side (7). One side of the cavity (6) is defined by an insert (8). The insert (8) has a flexible three-dimensional molding surface (9) facing the electronic components (3). The insert (8) facing away from the three-dimensional forming surface (9) and facing the upper module (5) includes a flexible coupling (10) for supporting the forming surface (9). The insert (8) is connected to the upper mold (5) in a detachable manner by bolts (11) provided on the inflexible coupling (10) as coupling devices. The upper mold (5) is further provided with a plurality of suction openings (12), one end of the openings (12) is connected to the outside of the mold (1), and is connected to a negative pressure device (13). The openings (12) flow from a narrow space into a wide mold cavity (6), wherein there is a reserved space between the insert (8) and one side of the mold cavity (6), so as to ensure the flexibility There is an applied negative pressure between the solid three-dimensional molding surface (9) and a metal foil layer (14). The metal foil layer (14) is sandwiched between the insert (8) and the electronic components (3) and the carrier (2) (on the one hand is the insert (8), on the other hand is the The electronic component (3) and the carrier (2)), thereby at least partially covering the flexible three-dimensional molding surface (9). The electronic component surface (15) and the carrier surface (16) in contact with the metal foil layer (14) will be exposed after molding. When the carrier (2) carrying the molded electronic component (3) is to be released from the modules (4, 5), the metal foil layer (14) will serve as a release metal foil.
圖2a-2d概要描繪使用本發明一模具封裝一載體單側上安裝的多個電子組件時所包括的方法步驟。在這些圖式中，相同元件係以相同參考標號標示之。如同圖1，圖2a-2d顯示一模具嵌件(20)，其包圍一模具的部份模穴(21)(圖式中未進一步描繪)。所述嵌件(20)包括一撓性立體成型表面(22)及一附接於該撓性立體成型表面(22)的無撓性聯結件(23)。所述無撓性聯結件(23)之設計係用以連接一模件。所述撓性立體成型表面(22)面向一個單側設有多個電子組件(25、26、27)的載體或基板(24)。圖2a顯示其中二個電子組件(26、27)例如因為生產公差及/或電子組件類型差異而具有一高差(h)。圖2b描繪兩模件朝向彼此移動後的情況；其中，嵌件(20)的撓性立體成型表面(22)與該等電子組件(25、26、27)相接觸。從此一圖式可以看出，前述高差(h)藉由所述撓性成型表面(22)獲得補償。所述載體(24)及其上安裝的電子組件(25、26、27)被圍封在該等模件之間後，將一成型材料(28)注入模穴(21)，如圖2c所示，其中以箭頭(29)指示注入方向。模穴(21)填充完成後，移動該二模件使之彼此分開，使撓性立體成型表面(22)上升，離開該等電子組件(25、26、27)。圖2d顯示經由本發明方法產生的封裝後製品(30)，其中，該等電子組件(25、26、27)現在已局部被所述成型材料(28)封裝。該等電子組件(25、26、27)於成型期間被該撓性立體成型表面(22)覆蓋的部份，則因此保留裸露。2a-2d outline the method steps involved in packaging a plurality of electronic components mounted on one side of a carrier using a mold of the present invention. In these drawings, the same elements are marked with the same reference numerals. Like FIG. 1, FIGS. 2a-2d show a mold insert (20) which surrounds a part of a mold cavity (21) of a mold (not further depicted in the figure). The insert (20) includes a flexible three-dimensional molding surface (22) and a non-flexible coupling member (23) attached to the flexible three-dimensional molding surface (22). The design of the flexible coupling (23) is used to connect a module. The flexible three-dimensional molding surface (22) faces a carrier or substrate (24) provided with a plurality of electronic components (25, 26, 27) on one side. Figure 2a shows that two of the electronic components (26, 27) have a height difference (h) due to, for example, production tolerances and/or electronic component type differences. Figure 2b depicts the situation after the two modules are moved towards each other; wherein the flexible three-dimensional molding surface (22) of the insert (20) is in contact with the electronic components (25, 26, 27). As can be seen from this figure, the aforementioned height difference (h) is compensated by the flexible molding surface (22). After the carrier (24) and the electronic components (25, 26, 27) mounted thereon are enclosed between the modules, a molding material (28) is injected into the cavity (21), as shown in FIG. 2c The arrow (29) indicates the direction of injection. After the cavity (21) is filled, the two modules are moved apart from each other, so that the flexible three-dimensional molding surface (22) rises away from the electronic components (25, 26, 27). Figure 2d shows a packaged article (30) produced by the method of the invention, wherein the electronic components (25, 26, 27) are now partially encapsulated by the molding material (28). The parts of the electronic components (25, 26, 27) that are covered by the flexible three-dimensional molding surface (22) during molding remain exposed.
圖3a-3d概要描繪使用本發明另一模具實施例封裝一載體或基板(44)兩相反側上安裝的多個電子組件(45、46、47、48、49、50)時所包括的方法步驟。在這些圖式中，相同元件同樣係以相同參考標號標示之。圖3a-3d顯示的方法步驟極為類似圖2a-2d所顯示的方法步驟；然而有一個重要的差別在於，其中使用的模具(圖3a-3d中並未進一步描繪)現在包括二個模具嵌件(40、41)，各自形成兩相對模穴(42、43)其中之一的一部份。因此，該等模穴(42、43)係設計為各自圍封一載體或基板(44)兩相反側的其中一側；所述兩相反側包括要加以€的電子組件(45、46、47、48、49、50)及部份載體(44)。該二嵌件(40、41)皆包括一撓性立體成型表面(51、52)及一附接於該撓性立體成型表面(51、52)的無撓性聯結件(53、54)。圖3b描繪兩模件朝向彼此移動後的情況；其中一嵌件(40)的撓性立體成型表面(51)與位於該載體(44)一側上的電子組件(45、46、47)相接觸，而另一嵌件(41)的撓性立體成型表面(52)則與位於該載體(44)另一側上的電子組件(48、49、50)相接觸。此外，較後提及的嵌件(41)接觸該載體(44)的一部份(55)，因此該部份在成型後將會裸露。圖3c顯示將成型材料(56)注入該等模穴(42、43)的連續步驟，其中以箭頭(57)指示注入方向。該等模穴(42、43)填充完成後，移動該二模件使之彼此分開，使撓性立體成型表面(51、52)上升，離開該等電子組件(45、46、47、48、49、50)。圖3d描繪所產生的封裝後製品(58)，其中，該等電子組件(45、46、47、48、49、50)現在已局部被所述成型材料(56)封裝。而該等電子組件(45、46、47、48、49、50)於成型期間被該撓性立體成型表面(51、52)覆蓋的部份以及成型期間被該撓性立體成型表面(51、52)覆蓋的局部載體(55)則因此外露。Figures 3a-3d outline the method involved in packaging multiple electronic components (45, 46, 47, 48, 49, 50) mounted on opposite sides of a carrier or substrate (44) using another mold embodiment of the invention step. In these drawings, the same elements are also marked with the same reference numerals. The method steps shown in Figures 3a-3d are very similar to the method steps shown in Figures 2a-2d; however, there is an important difference in that the mold used therein (not further depicted in Figures 3a-3d) now includes two mold inserts (40, 41), each forming part of one of the two opposing mold cavities (42, 43). Therefore, the mold cavities (42, 43) are designed to enclose one of two opposite sides of a carrier or substrate (44); the two opposite sides include electronic components (45, 46, 47) to be added , 48, 49, 50) and some carriers (44). The two inserts (40, 41) each include a flexible three-dimensional molding surface (51, 52) and a non-flexible coupling member (53, 54) attached to the flexible three-dimensional molding surface (51, 52). Figure 3b depicts the situation after the two modules are moved towards each other; the flexible three-dimensional molding surface (51) of one insert (40) is opposite the electronic components (45, 46, 47) on the side of the carrier (44) And the flexible three-dimensional molding surface (52) of the other insert (41) is in contact with the electronic components (48, 49, 50) on the other side of the carrier (44). In addition, the insert (41) mentioned later contacts a part (55) of the carrier (44), so the part will be exposed after molding. Figure 3c shows the successive steps of injecting the molding material (56) into the cavity (42, 43), wherein the direction of injection is indicated by the arrow (57). After the filling of the cavity (42, 43) is completed, the two modules are moved away from each other, so that the flexible three-dimensional molding surface (51, 52) rises, leaving the electronic components (45, 46, 47, 48, 49, 50). Figure 3d depicts the resulting packaged article (58), wherein the electronic components (45, 46, 47, 48, 49, 50) are now partially encapsulated by the molding material (56). The parts of the electronic components (45, 46, 47, 48, 49, 50) covered by the flexible three-dimensional molding surface (51, 52) during molding and the flexible three-dimensional molding surface (51, 52) during molding 52) The covered partial carrier (55) is thus exposed.
1‧‧‧模具
2‧‧‧載體/基板
3‧‧‧電子組件
4,5‧‧‧模件
6‧‧‧模穴
7‧‧‧接觸側
8‧‧‧嵌件
9‧‧‧成型表面
10‧‧‧無撓性聯結件
11‧‧‧螺栓
12‧‧‧開孔
13‧‧‧抽空/真空/負壓裝置
14‧‧‧金屬箔層
15‧‧‧電子組件表面
16‧‧‧載體表面
20‧‧‧模具嵌件
21‧‧‧模穴
22‧‧‧撓性立體成型表面
23‧‧‧無撓性聯結件
24‧‧‧載體/基板
25-27‧‧‧電子組件
28‧‧‧成型材料
29‧‧‧箭頭(注入方向)
30‧‧‧產生的封裝後製品
h‧‧‧高差
40,41‧‧‧模具嵌件
42,43‧‧‧模穴
44‧‧‧載體/基板
45-50‧‧‧電子組件
51,52‧‧‧撓性立體成型表面
53,54‧‧‧無撓性聯結件
55‧‧‧局部載體
56‧‧‧成型材料
57‧‧‧箭頭(注入方向)
58‧‧‧產生的封裝後製品1‧‧‧
以下將根據下列圖式顯示的非限制性示例實施例，進一步闡述本發明。其中： 圖1為一剖視圖，顯示本發明模具夾住一個載有多個電子組件的載體； 圖2a-2d概要顯示使用本發明一模具封裝一載體單側上安裝的多個電子組件時所包括的方法步驟，以及 圖3a-3d概要顯示使用本發明另一模具封裝一載體兩相反側上安裝的多個電子組件時所包括的方法步驟。The present invention will be further explained below based on non-limiting exemplary embodiments shown in the following drawings. among them: 1 is a cross-sectional view showing that the mold of the present invention clamps a carrier carrying multiple electronic components; 2a-2d schematically show the method steps involved in packaging a plurality of electronic components mounted on one side of a carrier using a mold of the present invention, and 3a-3d schematically show the method steps involved in packaging a plurality of electronic components mounted on opposite sides of a carrier using another mold of the present invention.
20‧‧‧模具嵌件 20‧‧‧Mould insert
22‧‧‧撓性立體成型表面 22‧‧‧ Flexible three-dimensional molding surface
23‧‧‧無撓性聯結件 23‧‧‧ Non-flexible coupling
24‧‧‧載體/基板 24‧‧‧carrier/substrate
25‧‧‧電子組件 25‧‧‧Electronic components
26‧‧‧電子組件 26‧‧‧Electronic components
27‧‧‧電子組件 27‧‧‧Electronic components
h‧‧‧高差 h‧‧‧Height difference
Claims (18)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL2021145A NL2021145B1 (en) | 2018-06-18 | 2018-06-18 | Mould for encapsulating electronic components, insert for such a mould, method for producing an insert and method for encapsulating electronic components |
| NLNL2021145 | 2018-06-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202000416A true TW202000416A (en) | 2020-01-01 |
| TWI834678B TWI834678B (en) | 2024-03-11 |
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| Publication number | Publication date |
|---|---|
| PH12020552144A1 (en) | 2021-06-21 |
| SG11202011472VA (en) | 2020-12-30 |
| JP7391051B2 (en) | 2023-12-04 |
| CN112262461A (en) | 2021-01-22 |
| WO2019245364A1 (en) | 2019-12-26 |
| JP2021531643A (en) | 2021-11-18 |
| NL2021145B1 (en) | 2020-01-06 |
| KR20210022002A (en) | 2021-03-02 |
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