SG11202009373PA - Substrate processing apparatus - Google Patents

Substrate processing apparatus

Info

Publication number
SG11202009373PA
SG11202009373PA SG11202009373PA SG11202009373PA SG11202009373PA SG 11202009373P A SG11202009373P A SG 11202009373PA SG 11202009373P A SG11202009373P A SG 11202009373PA SG 11202009373P A SG11202009373P A SG 11202009373PA SG 11202009373P A SG11202009373P A SG 11202009373PA
Authority
SG
Singapore
Prior art keywords
processing apparatus
substrate processing
substrate
processing
Prior art date
Application number
SG11202009373PA
Other languages
English (en)
Inventor
Kuniaki Yamaguchi
Hiroshi Shimomoto
Soichi Isobe
Koji Maeda
Kenji Shinkai
Hidetatsu Isokawa
Dai Yoshinari
Masayuki Tamura
Xu Haiyang
Shun Ehara
Kentaro Asano
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG11202009373PA publication Critical patent/SG11202009373PA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/015—Temperature control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/005—Positioning devices for conditioning tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
SG11202009373PA 2019-03-06 2020-03-04 Substrate processing apparatus SG11202009373PA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019041015A JP7160725B2 (ja) 2019-03-06 2019-03-06 基板処理装置
PCT/JP2020/009018 WO2020179804A1 (ja) 2019-03-06 2020-03-04 基板処理装置

Publications (1)

Publication Number Publication Date
SG11202009373PA true SG11202009373PA (en) 2020-10-29

Family

ID=72336936

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202009373PA SG11202009373PA (en) 2019-03-06 2020-03-04 Substrate processing apparatus

Country Status (5)

Country Link
US (1) US11541502B2 (zh)
JP (1) JP7160725B2 (zh)
CN (1) CN113474121B (zh)
SG (1) SG11202009373PA (zh)
WO (1) WO2020179804A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115431153A (zh) * 2022-08-22 2022-12-06 中国科学院上海光学精密机械研究所 一种用于光学抛光加工的修盘、注液、清洁三位一体式装置及方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10264011A (ja) * 1997-03-24 1998-10-06 Canon Inc 精密研磨装置及び方法
JP4091187B2 (ja) 1998-12-08 2008-05-28 株式会社荏原製作所 洗浄具、基板洗浄装置及び基板洗浄方法
JP4349752B2 (ja) * 2000-10-24 2009-10-21 株式会社荏原製作所 ポリッシング方法
TW495416B (en) * 2000-10-24 2002-07-21 Ebara Corp Polishing apparatus
TWI591705B (zh) * 2002-11-15 2017-07-11 荏原製作所股份有限公司 基板處理裝置
US20090067959A1 (en) 2006-02-22 2009-03-12 Nobuyuki Takahashi Substrate processing apparatus, substrate transfer apparatus, substrate clamp apparatus, and chemical liquid treatment apparatus
JP2008091698A (ja) * 2006-10-03 2008-04-17 Matsushita Electric Ind Co Ltd 基板処理装置および基板処理方法
JP5744382B2 (ja) 2008-07-24 2015-07-08 株式会社荏原製作所 基板処理装置および基板処理方法
JP5294944B2 (ja) 2009-03-31 2013-09-18 株式会社荏原製作所 基板の洗浄方法
JP6209088B2 (ja) * 2013-01-25 2017-10-04 株式会社荏原製作所 研磨方法および装置
JP2016043471A (ja) 2014-08-26 2016-04-04 株式会社荏原製作所 基板処理装置
KR102202331B1 (ko) * 2014-10-03 2021-01-13 가부시키가이샤 에바라 세이사꾸쇼 기판 처리 장치 및 처리 방법
JP6426965B2 (ja) * 2014-10-03 2018-11-21 株式会社荏原製作所 処理コンポーネント、処理モジュール、及び、処理方法
JP6727044B2 (ja) * 2016-06-30 2020-07-22 株式会社荏原製作所 基板処理装置
JP6357260B2 (ja) 2016-09-30 2018-07-11 株式会社荏原製作所 研磨装置、及び研磨方法
JP2019029562A (ja) 2017-08-01 2019-02-21 株式会社荏原製作所 基板処理装置

Also Published As

Publication number Publication date
US20210394332A1 (en) 2021-12-23
CN113474121B (zh) 2023-07-14
JP2020142329A (ja) 2020-09-10
CN113474121A (zh) 2021-10-01
US11541502B2 (en) 2023-01-03
WO2020179804A1 (ja) 2020-09-10
JP7160725B2 (ja) 2022-10-25

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