SG11202007003RA - Methods and apparatus for cleaning substrates - Google Patents
Methods and apparatus for cleaning substratesInfo
- Publication number
- SG11202007003RA SG11202007003RA SG11202007003RA SG11202007003RA SG11202007003RA SG 11202007003R A SG11202007003R A SG 11202007003RA SG 11202007003R A SG11202007003R A SG 11202007003RA SG 11202007003R A SG11202007003R A SG 11202007003RA SG 11202007003R A SG11202007003R A SG 11202007003RA
- Authority
- SG
- Singapore
- Prior art keywords
- methods
- cleaning substrates
- substrates
- cleaning
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/CN2018/073723 WO2019144256A1 (fr) | 2018-01-23 | 2018-01-23 | Procédés et appareil de nettoyage de substrats |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202007003RA true SG11202007003RA (en) | 2020-08-28 |
Family
ID=67395151
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202007003RA SG11202007003RA (en) | 2018-01-23 | 2018-01-23 | Methods and apparatus for cleaning substrates |
Country Status (7)
Country | Link |
---|---|
US (1) | US20210031243A1 (fr) |
EP (1) | EP3743939A4 (fr) |
JP (1) | JP7217280B2 (fr) |
KR (1) | KR102553512B1 (fr) |
CN (1) | CN111656484A (fr) |
SG (1) | SG11202007003RA (fr) |
WO (1) | WO2019144256A1 (fr) |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3192610B2 (ja) * | 1996-05-28 | 2001-07-30 | キヤノン株式会社 | 多孔質表面の洗浄方法、半導体表面の洗浄方法および半導体基体の製造方法 |
US6058945A (en) | 1996-05-28 | 2000-05-09 | Canon Kabushiki Kaisha | Cleaning methods of porous surface and semiconductor surface |
US7336019B1 (en) * | 2005-07-01 | 2008-02-26 | Puskas William L | Apparatus, circuitry, signals, probes and methods for cleaning and/or processing with sound |
US20060086604A1 (en) * | 1996-09-24 | 2006-04-27 | Puskas William L | Organism inactivation method and system |
US20080047575A1 (en) * | 1996-09-24 | 2008-02-28 | Puskas William L | Apparatus, circuitry, signals and methods for cleaning and processing with sound |
US6124214A (en) * | 1998-08-27 | 2000-09-26 | Micron Technology, Inc. | Method and apparatus for ultrasonic wet etching of silicon |
JP2003234320A (ja) * | 2002-02-06 | 2003-08-22 | Nec Electronics Corp | 基板の洗浄方法、洗浄薬液、洗浄装置及び半導体装置 |
JP2003311226A (ja) * | 2002-04-19 | 2003-11-05 | Kaijo Corp | 洗浄処理方法及び洗浄処理装置 |
US7373941B2 (en) * | 2003-03-28 | 2008-05-20 | Taiwan Semiconductor Manufacturing Co. Ltd | Wet cleaning cavitation system and method to remove particulate wafer contamination |
US7270130B2 (en) * | 2003-10-15 | 2007-09-18 | Infineon Technologies Ag | Semiconductor device cleaning employing heterogeneous nucleation for controlled cavitation |
JP2007150164A (ja) * | 2005-11-30 | 2007-06-14 | Renesas Technology Corp | 基板洗浄方法 |
US20100224215A1 (en) * | 2009-03-06 | 2010-09-09 | Imec | Method for Reducing the Damage Induced by a Physical Force Assisted Cleaning |
US9492852B2 (en) * | 2009-03-31 | 2016-11-15 | Acm Research (Shanghai) Inc. | Methods and apparatus for cleaning semiconductor wafers |
US8973601B2 (en) * | 2010-02-01 | 2015-03-10 | Ultrasonic Power Corporation | Liquid condition sensing circuit and method |
CN102368468B (zh) * | 2011-10-17 | 2013-09-25 | 浙江贝盛光伏股份有限公司 | 一种硅片预清洗工艺 |
US10910244B2 (en) * | 2015-05-20 | 2021-02-02 | Acm Research, Inc. | Methods and system for cleaning semiconductor wafers |
US10512946B2 (en) * | 2015-09-03 | 2019-12-24 | Taiwan Semiconductor Manufacturing Co., Ltd. | Gigasonic cleaning techniques |
CN105414084A (zh) * | 2015-12-10 | 2016-03-23 | 北京七星华创电子股份有限公司 | 具有超声或兆声振荡的二相流雾化清洗装置及清洗方法 |
-
2018
- 2018-01-23 EP EP18902437.5A patent/EP3743939A4/fr active Pending
- 2018-01-23 KR KR1020207023518A patent/KR102553512B1/ko active IP Right Grant
- 2018-01-23 US US16/964,507 patent/US20210031243A1/en active Pending
- 2018-01-23 SG SG11202007003RA patent/SG11202007003RA/en unknown
- 2018-01-23 CN CN201880087245.9A patent/CN111656484A/zh active Pending
- 2018-01-23 JP JP2020540638A patent/JP7217280B2/ja active Active
- 2018-01-23 WO PCT/CN2018/073723 patent/WO2019144256A1/fr unknown
Also Published As
Publication number | Publication date |
---|---|
JP2021515979A (ja) | 2021-06-24 |
WO2019144256A1 (fr) | 2019-08-01 |
CN111656484A (zh) | 2020-09-11 |
EP3743939A4 (fr) | 2021-08-18 |
US20210031243A1 (en) | 2021-02-04 |
JP7217280B2 (ja) | 2023-02-02 |
KR20200106542A (ko) | 2020-09-14 |
KR102553512B1 (ko) | 2023-07-10 |
EP3743939A1 (fr) | 2020-12-02 |
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