SG11202004210QA - Additive manufacturing technology microwave vertical launch - Google Patents

Additive manufacturing technology microwave vertical launch

Info

Publication number
SG11202004210QA
SG11202004210QA SG11202004210QA SG11202004210QA SG11202004210QA SG 11202004210Q A SG11202004210Q A SG 11202004210QA SG 11202004210Q A SG11202004210Q A SG 11202004210QA SG 11202004210Q A SG11202004210Q A SG 11202004210QA SG 11202004210Q A SG11202004210Q A SG 11202004210QA
Authority
SG
Singapore
Prior art keywords
additive manufacturing
manufacturing technology
vertical launch
technology microwave
microwave vertical
Prior art date
Application number
SG11202004210QA
Other languages
English (en)
Inventor
Andrew Southworth
Thomas Sikina
John Haven
James Benedict
Kevin Wilder
Original Assignee
Raytheon Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raytheon Co filed Critical Raytheon Co
Publication of SG11202004210QA publication Critical patent/SG11202004210QA/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/04—Fixed joints
    • H01P1/047—Strip line joints
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling
    • H01P5/022—Transitions between lines of the same kind and shape, but with different dimensions
    • H01P5/028—Transitions between lines of the same kind and shape, but with different dimensions between strip lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0242—Structural details of individual signal conductors, e.g. related to the skin effect
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/421—Blind plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0251—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance related to vias or transitions between vias and transmission lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10242—Metallic cylinders
SG11202004210QA 2017-11-10 2018-11-07 Additive manufacturing technology microwave vertical launch SG11202004210QA (en)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US201762584264P 2017-11-10 2017-11-10
US201762584260P 2017-11-10 2017-11-10
US201862636375P 2018-02-28 2018-02-28
US201862636364P 2018-02-28 2018-02-28
US15/988,296 US20190150296A1 (en) 2017-11-10 2018-05-24 Additive manufacturing technology microwave vertical launch
PCT/US2018/059625 WO2019094470A1 (en) 2017-11-10 2018-11-07 Additive manufacturing technology microwave vertical launch

Publications (1)

Publication Number Publication Date
SG11202004210QA true SG11202004210QA (en) 2020-06-29

Family

ID=66433707

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202004210QA SG11202004210QA (en) 2017-11-10 2018-11-07 Additive manufacturing technology microwave vertical launch

Country Status (8)

Country Link
US (2) US20190150296A1 (zh)
EP (1) EP3707973A1 (zh)
JP (1) JP7297747B2 (zh)
KR (1) KR20200074983A (zh)
CN (1) CN111567151A (zh)
SG (1) SG11202004210QA (zh)
TW (2) TWI810219B (zh)
WO (1) WO2019094470A1 (zh)

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* Cited by examiner, † Cited by third party
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KR20210151967A (ko) * 2019-05-14 2021-12-14 레이던 컴퍼니 플랫-와이어 구리 수직 발사 마이크로파 상호접속 방법
US11089673B2 (en) 2019-07-19 2021-08-10 Raytheon Company Wall for isolation enhancement
US11109489B2 (en) 2019-08-15 2021-08-31 Raytheon Company Apparatus for fabricating Z-axis vertical launch within a printed circuit board
US10631405B1 (en) * 2019-09-20 2020-04-21 Raytheon Company Additive manufacturing technology (AMT) inverted pad interface
US11134575B2 (en) * 2019-09-30 2021-09-28 Gentherm Gmbh Dual conductor laminated substrate
US11653484B2 (en) 2019-11-08 2023-05-16 Raytheon Company Printed circuit board automated layup system
US11606865B2 (en) * 2019-11-08 2023-03-14 Raytheon Company Method for forming channels in printed circuit boards by stacking slotted layers
US11431115B2 (en) * 2020-02-15 2022-08-30 Centipede Systems, Inc. Connectors for interconnecting microelectronic circuits
US11122692B1 (en) * 2020-06-11 2021-09-14 Raytheon Company Preparation of solder bump for compatibility with printed electronics and enhanced via reliability
US11764077B2 (en) * 2021-07-23 2023-09-19 Innolux Corporation Composite layer circuit element and manufacturing method thereof
CN115513662B (zh) * 2022-10-28 2024-04-26 中国电子科技集团公司第二十九研究所 一种曲面天线曲面电阻结构及其原位增材制造方法

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JPH0812887B2 (ja) * 1985-04-13 1996-02-07 富士通株式会社 高速集積回路パツケ−ジ
US5857858A (en) * 1996-12-23 1999-01-12 General Electric Company Demountable and repairable low pitch interconnect for stacked multichip modules
US6356245B2 (en) * 1999-04-01 2002-03-12 Space Systems/Loral, Inc. Microwave strip transmission lines, beamforming networks and antennas and methods for preparing the same
JP3710652B2 (ja) * 1999-08-03 2005-10-26 三菱電機株式会社 ストリップライン給電装置
JP3487283B2 (ja) * 2000-10-31 2004-01-13 三菱電機株式会社 差動ストリップ線路垂直変換器および光モジュール
US6651322B1 (en) * 2000-12-28 2003-11-25 Unisys Corporation Method of reworking a multilayer printed circuit board assembly
US6593535B2 (en) * 2001-06-26 2003-07-15 Teradyne, Inc. Direct inner layer interconnect for a high speed printed circuit board
JP4059085B2 (ja) * 2003-01-14 2008-03-12 松下電器産業株式会社 高周波積層部品およびその製造方法
US6937120B2 (en) * 2003-04-02 2005-08-30 Harris Corporation Conductor-within-a-via microwave launch
US7315223B2 (en) * 2004-06-30 2008-01-01 Emag Technologies, Inc. Microstrip-to-microstrip RF transition including co-planar waveguide connected by vias
US20060044083A1 (en) * 2004-08-27 2006-03-02 Maksim Kuzmenka Circuit board and method for producing a circuit board
JP4498258B2 (ja) * 2005-10-13 2010-07-07 富士通オプティカルコンポーネンツ株式会社 コイルパッケージ
US7405477B1 (en) * 2005-12-01 2008-07-29 Altera Corporation Ball grid array package-to-board interconnect co-design apparatus
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JP5397225B2 (ja) * 2007-10-25 2014-01-22 日本電気株式会社 高周波基板および、これを用いた高周波モジュール
CN102595778B (zh) * 2012-03-13 2015-12-16 华为技术有限公司 一种多层印制电路板及其制造方法
JP2014146650A (ja) * 2013-01-28 2014-08-14 Murata Mfg Co Ltd 配線基板およびその製造方法
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Also Published As

Publication number Publication date
JP2021502707A (ja) 2021-01-28
US20190150296A1 (en) 2019-05-16
TW201924499A (zh) 2019-06-16
EP3707973A1 (en) 2020-09-16
TW202344151A (zh) 2023-11-01
KR20200074983A (ko) 2020-06-25
JP7297747B2 (ja) 2023-06-26
CN111567151A (zh) 2020-08-21
US20230121347A1 (en) 2023-04-20
TWI810219B (zh) 2023-08-01
WO2019094470A1 (en) 2019-05-16

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