SG11202003933XA - Spiral antenna and related fabrication techniques - Google Patents
Spiral antenna and related fabrication techniquesInfo
- Publication number
- SG11202003933XA SG11202003933XA SG11202003933XA SG11202003933XA SG11202003933XA SG 11202003933X A SG11202003933X A SG 11202003933XA SG 11202003933X A SG11202003933X A SG 11202003933XA SG 11202003933X A SG11202003933X A SG 11202003933XA SG 11202003933X A SG11202003933X A SG 11202003933XA
- Authority
- SG
- Singapore
- Prior art keywords
- fabrication techniques
- spiral antenna
- related fabrication
- antenna
- spiral
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/16—Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole
- H01Q9/26—Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole with folded element or elements, the folded parts being spaced apart a small fraction of operating wavelength
- H01Q9/27—Spiral antennas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
- H05K1/0221—Coaxially shielded signal lines comprising a continuous shielding layer partially or wholly surrounding the signal lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/421—Blind plated via connections
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Details Of Aerials (AREA)
- Structure Of Printed Boards (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201762584260P | 2017-11-10 | 2017-11-10 | |
PCT/US2018/059410 WO2019094373A2 (en) | 2017-11-10 | 2018-11-06 | Spiral antenna and related fabrication techniques |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202003933XA true SG11202003933XA (en) | 2020-05-28 |
Family
ID=65041838
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202003933XA SG11202003933XA (en) | 2017-11-10 | 2018-11-06 | Spiral antenna and related fabrication techniques |
Country Status (7)
Country | Link |
---|---|
US (2) | US11289814B2 (ja) |
EP (1) | EP3707974B1 (ja) |
JP (1) | JP7221955B2 (ja) |
KR (1) | KR102567182B1 (ja) |
CN (1) | CN111567150A (ja) |
SG (1) | SG11202003933XA (ja) |
WO (1) | WO2019094373A2 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11089673B2 (en) * | 2019-07-19 | 2021-08-10 | Raytheon Company | Wall for isolation enhancement |
US11171101B2 (en) * | 2020-03-31 | 2021-11-09 | Raytheon Company | Process for removing bond film from cavities in printed circuit boards |
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KR102479633B1 (ko) | 2017-11-10 | 2022-12-22 | 레이던 컴퍼니 | 무선 주파수 회로의 적층 가공 기술(amt) 패러데이 경계 |
CN111788737B (zh) | 2017-11-10 | 2022-11-15 | 雷神公司 | 毫米波传输线架构 |
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WO2019226635A1 (en) | 2018-05-22 | 2019-11-28 | Raytheon Company | Millimeter wave phased array |
-
2018
- 2018-11-05 US US16/180,822 patent/US11289814B2/en active Active
- 2018-11-06 KR KR1020207013727A patent/KR102567182B1/ko active IP Right Grant
- 2018-11-06 CN CN201880072526.7A patent/CN111567150A/zh active Pending
- 2018-11-06 JP JP2020525917A patent/JP7221955B2/ja active Active
- 2018-11-06 EP EP18836674.4A patent/EP3707974B1/en active Active
- 2018-11-06 WO PCT/US2018/059410 patent/WO2019094373A2/en unknown
- 2018-11-06 SG SG11202003933XA patent/SG11202003933XA/en unknown
-
2022
- 2022-01-18 US US17/578,034 patent/US11581652B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
WO2019094373A2 (en) | 2019-05-16 |
US11289814B2 (en) | 2022-03-29 |
KR20200078539A (ko) | 2020-07-01 |
US20220140485A1 (en) | 2022-05-05 |
US20190148832A1 (en) | 2019-05-16 |
EP3707974A2 (en) | 2020-09-16 |
KR102567182B1 (ko) | 2023-08-16 |
JP2021508421A (ja) | 2021-03-04 |
US11581652B2 (en) | 2023-02-14 |
CN111567150A (zh) | 2020-08-21 |
WO2019094373A3 (en) | 2019-08-22 |
JP7221955B2 (ja) | 2023-02-14 |
EP3707974B1 (en) | 2024-02-21 |
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