SG11201909027SA - Semiconductor wafer container - Google Patents

Semiconductor wafer container

Info

Publication number
SG11201909027SA
SG11201909027SA SG11201909027SA SG11201909027SA SG 11201909027S A SG11201909027S A SG 11201909027SA SG 11201909027S A SG11201909027S A SG 11201909027SA SG 11201909027S A SG11201909027S A SG 11201909027SA
Authority
SG
Singapore
Prior art keywords
wafer
outer shell
semiconductor wafer
contact
shell
Prior art date
Application number
Other languages
English (en)
Inventor
Masayuki Nishijima
Kenichi Hirose
Christie James
Original Assignee
Achilles Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Achilles Corp filed Critical Achilles Corp
Publication of SG11201909027SA publication Critical patent/SG11201909027SA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67353—Closed carriers specially adapted for a single substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67386—Closed carriers characterised by the construction of the closed carrier

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
SG11201909027S 2017-03-31 2018-02-06 Semiconductor wafer container SG11201909027SA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017071320A JP6990873B2 (ja) 2017-03-31 2017-03-31 半導体ウェハ容器
PCT/JP2018/004019 WO2018179859A1 (ja) 2017-03-31 2018-02-06 半導体ウェハ容器

Publications (1)

Publication Number Publication Date
SG11201909027SA true SG11201909027SA (en) 2019-10-30

Family

ID=63675145

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201909027S SG11201909027SA (en) 2017-03-31 2018-02-06 Semiconductor wafer container

Country Status (6)

Country Link
US (1) US11121013B2 (ja)
JP (1) JP6990873B2 (ja)
CN (1) CN110582843B (ja)
SG (1) SG11201909027SA (ja)
TW (1) TWI673837B (ja)
WO (1) WO2018179859A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7330081B2 (ja) * 2019-12-03 2023-08-21 三菱電機株式会社 キャリアスペーサおよび半導体装置の製造方法
CN114378085B (zh) * 2022-03-23 2022-06-28 北京晨晶电子有限公司 半导体晶片的清洗工装与清洗方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4511038A (en) * 1984-01-30 1985-04-16 Ekc Technology, Inc. Container for masks and pellicles
JP2002002695A (ja) 2000-06-15 2002-01-09 Kyocera Corp 基板収納トレイ及びこれを用いた基板梱包体
US6837374B2 (en) * 2001-07-15 2005-01-04 Entegris, Inc. 300MM single stackable film frame carrier
JP2003168731A (ja) 2001-12-03 2003-06-13 M B K Micro Tec:Kk 基板トレー、基板トレー敷設用シート及び基板収納方法
WO2004087535A1 (ja) 2003-03-31 2004-10-14 Achilles Corporation 半導体ウエハの容器
JP4644035B2 (ja) * 2005-05-25 2011-03-02 ミライアル株式会社 枚葉収納容器
JP4789566B2 (ja) * 2005-09-30 2011-10-12 ミライアル株式会社 薄板保持容器及び薄板保持容器用処理装置
JP4716928B2 (ja) * 2006-06-07 2011-07-06 信越ポリマー株式会社 ウェーハ収納容器
JP4744603B2 (ja) * 2006-07-25 2011-08-10 ミライアル株式会社 クッションシート付ウエハ収納容器
JP4883627B2 (ja) * 2007-01-24 2012-02-22 ミライアル株式会社 クッションシート付ウエハ収納容器
JP4825771B2 (ja) 2007-10-22 2011-11-30 信越ポリマー株式会社 ウェーハ収納容器およびウェーハのハンドリング方法
US8356713B2 (en) * 2007-11-09 2013-01-22 Shin-Etsu Polymer Co., Ltd. Retainer and substrate storage container
US8863956B2 (en) * 2011-01-19 2014-10-21 Ray G. Brooks Packaging system for protection of IC wafers during fabrication, transport and storage
US9653331B2 (en) * 2011-02-16 2017-05-16 Texchem Advanced Products Incorporated Sdn. Bhd. Single and dual stage wafer cushion
SG11201505757VA (en) * 2013-02-11 2015-09-29 Achilles Corp A tray for a wafer with tape frame
US10643876B2 (en) * 2016-06-28 2020-05-05 Murata Machinery, Ltd. Substrate carrier and substrate carrier stack

Also Published As

Publication number Publication date
CN110582843B (zh) 2023-03-21
TW201838105A (zh) 2018-10-16
CN110582843A (zh) 2019-12-17
WO2018179859A1 (ja) 2018-10-04
JP6990873B2 (ja) 2022-02-03
TWI673837B (zh) 2019-10-01
US11121013B2 (en) 2021-09-14
JP2018174222A (ja) 2018-11-08
US20210118712A1 (en) 2021-04-22

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