SG11201907771TA - Mask blank, method for manufacturing transfer mask, and method for manufacturing semiconductor device - Google Patents
Mask blank, method for manufacturing transfer mask, and method for manufacturing semiconductor deviceInfo
- Publication number
- SG11201907771TA SG11201907771TA SG11201907771TA SG11201907771TA SG11201907771TA SG 11201907771T A SG11201907771T A SG 11201907771TA SG 11201907771T A SG11201907771T A SG 11201907771TA SG 11201907771T A SG11201907771T A SG 11201907771TA SG 11201907771T A SG11201907771T A SG 11201907771TA
- Authority
- SG
- Singapore
- Prior art keywords
- manufacturing
- hard mask
- mask film
- mask
- semiconductor device
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 2
- 238000000034 method Methods 0.000 title 2
- 239000004065 semiconductor Substances 0.000 title 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 abstract 2
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 abstract 2
- 238000004458 analytical method Methods 0.000 abstract 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract 2
- 239000000463 material Substances 0.000 abstract 2
- 229910052760 oxygen Inorganic materials 0.000 abstract 2
- 239000001301 oxygen Substances 0.000 abstract 2
- 238000001228 spectrum Methods 0.000 abstract 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract 1
- 229910052799 carbon Inorganic materials 0.000 abstract 1
- 238000001514 detection method Methods 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- 239000002356 single layer Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- 229910052715 tantalum Inorganic materials 0.000 abstract 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 abstract 1
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
- G03F1/48—Protective coatings
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/22—Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof
- G03F1/24—Reflection masks; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/80—Etching
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0015—Production of aperture devices, microporous systems or stamps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
- H01L21/0332—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their composition, e.g. multilayer masks, materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
- H01L21/0334—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
- H01L21/0337—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment
Abstract
A light shielding film 2 made up of a material containing one or more elements selected from silicon and tantalum and a hard mask film 3 made up of a material containing chrome, oxygen, and carbon are laminated on a translucent substrate 1. The hard mask film 3 is a single layer film having a composition gradient portion with increased oxygen content on the surface and on the neighboring region. The maximum peak for N1s in a narrow scan spectrum obtained via X-ray photoelectron spectroscopy analysis is the lower limit of detection or less. The portions excluding the composition gradient portion of the hard mask film 3 have a 50 atom% or more chrome content, and the maximum peak for Cr2p in a narrow scan spectrum obtained via X-ray photoelectron spectroscopy analysis has a binding energy of 574 eV or less.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017034706 | 2017-02-27 | ||
PCT/JP2018/002072 WO2018155047A1 (en) | 2017-02-27 | 2018-01-24 | Mask blank, method for manufacturing transfer mask, and method for manufacturing semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201907771TA true SG11201907771TA (en) | 2019-09-27 |
Family
ID=63253886
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201911900YA SG10201911900YA (en) | 2017-02-27 | 2018-01-24 | Mask blank, method for manufacturing transfer mask, and method for manufacturing semiconductor device |
SG10201911903XA SG10201911903XA (en) | 2017-02-27 | 2018-01-24 | Mask blank, method for manufacturing transfer mask, and method for manufacturing semiconductor device |
SG11201907771TA SG11201907771TA (en) | 2017-02-27 | 2018-01-24 | Mask blank, method for manufacturing transfer mask, and method for manufacturing semiconductor device |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201911900YA SG10201911900YA (en) | 2017-02-27 | 2018-01-24 | Mask blank, method for manufacturing transfer mask, and method for manufacturing semiconductor device |
SG10201911903XA SG10201911903XA (en) | 2017-02-27 | 2018-01-24 | Mask blank, method for manufacturing transfer mask, and method for manufacturing semiconductor device |
Country Status (7)
Country | Link |
---|---|
US (3) | US11281089B2 (en) |
JP (7) | JP6415768B2 (en) |
KR (4) | KR102429244B1 (en) |
CN (1) | CN110383167B (en) |
SG (3) | SG10201911900YA (en) |
TW (3) | TWI819878B (en) |
WO (1) | WO2018155047A1 (en) |
Families Citing this family (7)
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JP7313166B2 (en) * | 2019-03-18 | 2023-07-24 | Hoya株式会社 | Mask blank, method for manufacturing transfer mask, and method for manufacturing semiconductor device |
CN110707130A (en) * | 2019-09-04 | 2020-01-17 | 武汉华星光电半导体显示技术有限公司 | Display panel and manufacturing method thereof |
WO2021085382A1 (en) * | 2019-10-29 | 2021-05-06 | Agc株式会社 | Reflective mask blank and reflective mask |
WO2022214434A1 (en) * | 2021-04-06 | 2022-10-13 | Nilt Switzerland Gmbh | Optical metastructures having meta-atoms composed of a high refractive index material |
US11709423B2 (en) | 2021-05-10 | 2023-07-25 | Applied Materials, Inc. | Methods of greytone imprint lithography to fabricate optical devices |
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-
2018
- 2018-01-24 KR KR1020227015762A patent/KR102429244B1/en active IP Right Grant
- 2018-01-24 KR KR1020197024790A patent/KR102273801B1/en active IP Right Grant
- 2018-01-24 WO PCT/JP2018/002072 patent/WO2018155047A1/en active Application Filing
- 2018-01-24 SG SG10201911900YA patent/SG10201911900YA/en unknown
- 2018-01-24 US US16/488,901 patent/US11281089B2/en active Active
- 2018-01-24 SG SG10201911903XA patent/SG10201911903XA/en unknown
- 2018-01-24 KR KR1020217020525A patent/KR102365595B1/en active IP Right Grant
- 2018-01-24 KR KR1020227005244A patent/KR102398092B1/en active IP Right Grant
- 2018-01-24 SG SG11201907771TA patent/SG11201907771TA/en unknown
- 2018-01-24 CN CN201880014226.3A patent/CN110383167B/en active Active
- 2018-02-13 TW TW111141884A patent/TWI819878B/en active
- 2018-02-13 TW TW110114187A patent/TWI786605B/en active
- 2018-02-13 TW TW107105192A patent/TWI726192B/en active
- 2018-02-22 JP JP2018030096A patent/JP6415768B2/en active Active
- 2018-10-02 JP JP2018187468A patent/JP6575957B2/en active Active
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2019
- 2019-08-14 JP JP2019148894A patent/JP6732081B2/en active Active
- 2019-08-14 JP JP2019148893A patent/JP6767551B2/en active Active
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2020
- 2020-07-07 JP JP2020117297A patent/JP6920775B2/en active Active
- 2020-09-17 JP JP2020156495A patent/JP7030164B2/en active Active
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2022
- 2022-02-10 US US17/668,597 patent/US11762279B2/en active Active
- 2022-02-21 JP JP2022024928A patent/JP7201853B2/en active Active
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2023
- 2023-07-25 US US18/226,165 patent/US20230367196A1/en active Pending
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