SG11201903555WA - Chip defect detection device and detection method - Google Patents

Chip defect detection device and detection method

Info

Publication number
SG11201903555WA
SG11201903555WA SG11201903555WA SG11201903555WA SG11201903555WA SG 11201903555W A SG11201903555W A SG 11201903555WA SG 11201903555W A SG11201903555W A SG 11201903555WA SG 11201903555W A SG11201903555W A SG 11201903555WA SG 11201903555W A SG11201903555W A SG 11201903555WA
Authority
SG
Singapore
Prior art keywords
detection
chip
receiving
detection device
defect
Prior art date
Application number
SG11201903555WA
Other languages
English (en)
Inventor
Pengli Zhang
Hailiang Lu
Fan Wang
Original Assignee
Shanghai Micro Electronics Equipment Group Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Micro Electronics Equipment Group Co Ltd filed Critical Shanghai Micro Electronics Equipment Group Co Ltd
Publication of SG11201903555WA publication Critical patent/SG11201903555WA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G01B9/02015—Interferometers characterised by the beam path configuration
    • G01B9/02032—Interferometers characterised by the beam path configuration generating a spatial carrier frequency, e.g. by creating lateral or angular offset between reference and object beam
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G01B9/021—Interferometers using holographic techniques
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B2210/00—Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
    • G01B2210/40—Caliper-like sensors
    • G01B2210/48—Caliper-like sensors for measurement of a wafer

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
SG11201903555WA 2016-10-20 2017-10-20 Chip defect detection device and detection method SG11201903555WA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201610916613.9A CN107966453B (zh) 2016-10-20 2016-10-20 一种芯片缺陷检测装置及检测方法
PCT/CN2017/107115 WO2018072749A1 (zh) 2016-10-20 2017-10-20 一种芯片缺陷检测装置及检测方法

Publications (1)

Publication Number Publication Date
SG11201903555WA true SG11201903555WA (en) 2019-05-30

Family

ID=61997180

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201903555WA SG11201903555WA (en) 2016-10-20 2017-10-20 Chip defect detection device and detection method

Country Status (8)

Country Link
US (1) US10942129B2 (de)
EP (1) EP3531118A4 (de)
JP (1) JP2019537713A (de)
KR (1) KR20190069533A (de)
CN (1) CN107966453B (de)
SG (1) SG11201903555WA (de)
TW (1) TWI642928B (de)
WO (1) WO2018072749A1 (de)

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CN109270082B (zh) * 2018-08-09 2021-05-11 宁夏中晶半导体材料有限公司 一种利用腐蚀方法及微观检测确定单晶硅晶线的方法
CN109712912B (zh) * 2018-12-06 2023-07-18 通富微电子股份有限公司 一种芯片倒装设备及方法
CN111380874B (zh) * 2018-12-28 2021-04-30 上海微电子装备（集团）股份有限公司 缺陷检测装置、键合设备以及键合方法
US10684118B1 (en) * 2019-04-09 2020-06-16 Asm Technology Singapore Pte Ltd Apparatus for determining an orientation of a die
CN112748111B (zh) * 2019-10-31 2022-09-27 上海微电子装备（集团）股份有限公司 三维检测装置及三维检测方法
US11631169B2 (en) 2020-08-02 2023-04-18 KLA Corp. Inspection of noisy patterned features
CN112595720A (zh) * 2020-12-21 2021-04-02 藤仓烽火光电材料科技有限公司 一种基于激光干涉成像检测疏松体的系统
JP7555310B2 (ja) * 2021-07-14 2024-09-24 株式会社日立ハイテク 試料観察装置、試料観察方法、およびコンピュータシステム
CN116309600B (zh) * 2023-05-24 2023-08-04 山东金佳成工程材料有限公司 基于图像处理的环保纺织品质量检测方法

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CN101324422B (zh) * 2007-06-12 2011-01-19 北京普瑞微纳科技有限公司 白光干涉测量样品表面形状精细分布的方法及其装置
CN201050978Y (zh) * 2007-06-15 2008-04-23 西安普瑞光学仪器有限公司 白光干涉测量样品表面形状精细分布的装置
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CN104297260B (zh) * 2014-11-04 2017-10-10 广州广电运通金融电子股份有限公司 一种薄介质的无接触式检测方法及装置
CN104534979B (zh) * 2014-12-10 2016-10-19 佛山市南海区欧谱曼迪科技有限责任公司 一种多波长相移显微成像系统及方法
DE102015113465B4 (de) * 2015-08-14 2018-05-03 Medizinisches Laserzentrum Lübeck GmbH Verfahren und Vorrichtung zum Ablichten wenigstens einer Schnittfläche im Innern eines Licht streuenden Objekts
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CN105842257B (zh) * 2016-05-09 2019-01-11 南京理工大学 一种亚微米量级的玻璃亚表面缺陷检测装置及方法

Also Published As

Publication number Publication date
TWI642928B (zh) 2018-12-01
TW201819897A (zh) 2018-06-01
US20200173932A1 (en) 2020-06-04
CN107966453B (zh) 2020-08-04
EP3531118A1 (de) 2019-08-28
EP3531118A4 (de) 2019-11-20
WO2018072749A1 (zh) 2018-04-26
CN107966453A (zh) 2018-04-27
KR20190069533A (ko) 2019-06-19
JP2019537713A (ja) 2019-12-26
US10942129B2 (en) 2021-03-09

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