SG11201902595UA - A method of depositing a tin layer on a metal substrate and a use of a structure comprising a nickel/phosphorous alloy underlayer and said tin layer with said method - Google Patents

A method of depositing a tin layer on a metal substrate and a use of a structure comprising a nickel/phosphorous alloy underlayer and said tin layer with said method

Info

Publication number
SG11201902595UA
SG11201902595UA SG11201902595UA SG11201902595UA SG11201902595UA SG 11201902595U A SG11201902595U A SG 11201902595UA SG 11201902595U A SG11201902595U A SG 11201902595UA SG 11201902595U A SG11201902595U A SG 11201902595UA SG 11201902595U A SG11201902595U A SG 11201902595UA
Authority
SG
Singapore
Prior art keywords
erasmusstrabe
berlin
tin layer
atotech
depositing
Prior art date
Application number
SG11201902595UA
Other languages
English (en)
Inventor
Din-Ghee Neoh
Chee-Chow Tan
Jen Joo Lim
Robert Rüther
Jürgen Barthelmes
Olaf Kurtz
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Publication of SG11201902595UA publication Critical patent/SG11201902595UA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C19/00—Alloys based on nickel or cobalt
    • C22C19/03—Alloys based on nickel or cobalt based on nickel
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C25D5/14—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Rolls And Other Rotary Bodies (AREA)
SG11201902595UA 2016-10-24 2017-10-24 A method of depositing a tin layer on a metal substrate and a use of a structure comprising a nickel/phosphorous alloy underlayer and said tin layer with said method SG11201902595UA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP16195351 2016-10-24
PCT/EP2017/077156 WO2018077874A1 (en) 2016-10-24 2017-10-24 A method of depositing a tin layer on a metal substrate and a use of a structure comprising a nickel/phosphorous alloy underlayer and said tin layer with said method

Publications (1)

Publication Number Publication Date
SG11201902595UA true SG11201902595UA (en) 2019-05-30

Family

ID=57211308

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201902595UA SG11201902595UA (en) 2016-10-24 2017-10-24 A method of depositing a tin layer on a metal substrate and a use of a structure comprising a nickel/phosphorous alloy underlayer and said tin layer with said method

Country Status (8)

Country Link
US (1) US20190271093A1 (https=)
EP (1) EP3529398B1 (https=)
JP (1) JP6990240B2 (https=)
KR (1) KR102404045B1 (https=)
CN (1) CN109844182A (https=)
MY (1) MY192687A (https=)
SG (1) SG11201902595UA (https=)
WO (1) WO2018077874A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7121881B2 (ja) * 2017-08-08 2022-08-19 三菱マテリアル株式会社 銀皮膜付端子材及び銀皮膜付端子
JP7520025B2 (ja) * 2019-02-25 2024-07-22 タタ、スティール、アイモイデン、ベスローテン、フェンノートシャップ 酸化クロム層を電解析出させる方法
US11306409B2 (en) 2019-05-23 2022-04-19 Ag-Nano System Llc Method to enable electroplating of golden silver nanoparticles
US12410525B2 (en) * 2020-12-17 2025-09-09 Macdermid, Incorporated Multilayer corrosion system
JP2023075905A (ja) * 2021-11-19 2023-05-31 千住金属工業株式会社 金属体の形成方法および金属体、ならびにその金属体を備える嵌合型接続端子

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58221291A (ja) * 1982-06-16 1983-12-22 Furukawa Electric Co Ltd:The 電気接続用銀被覆銅材料
JPH0790675A (ja) * 1993-09-21 1995-04-04 Murata Mfg Co Ltd 電子部品の製造方法
US5750017A (en) * 1996-08-21 1998-05-12 Lucent Technologies Inc. Tin electroplating process
US6361823B1 (en) 1999-12-03 2002-03-26 Atotech Deutschland Gmbh Process for whisker-free aqueous electroless tin plating
US20020187364A1 (en) * 2001-03-16 2002-12-12 Shipley Company, L.L.C. Tin plating
US20020185716A1 (en) * 2001-05-11 2002-12-12 Abys Joseph Anthony Metal article coated with multilayer finish inhibiting whisker growth
DE10132478C1 (de) * 2001-07-03 2003-04-30 Atotech Deutschland Gmbh Verfahren zum Abscheiden einer Metallschicht sowie Verfahren zum Regenerieren einer Metallionen in einer hohen Oxidationsstufe enthaltenden Lösung
JP2005109373A (ja) * 2003-10-02 2005-04-21 Fuji Electric Device Technology Co Ltd 半導体装置
JP4894304B2 (ja) * 2005-03-28 2012-03-14 ソニー株式会社 無鉛Ｓｎベースめっき膜及び接続部品の接点構造
TW200712254A (en) 2005-06-24 2007-04-01 Technic Silver barrier layers to minimize whisker growth tin electrodeposits
JP2007284762A (ja) 2006-04-18 2007-11-01 Sumitomo Metal Mining Co Ltd スズめっき皮膜の形成方法および半導体装置
JP4847898B2 (ja) * 2007-03-07 2011-12-28 日立電線株式会社 配線用導体およびその製造方法
EP2014798B1 (en) 2007-07-10 2016-04-13 ATOTECH Deutschland GmbH Solution and process for increasing the solderability and corrosion resistance of metal or metal alloy surface
JP5086485B1 (ja) 2011-09-20 2012-11-28 Ｊｘ日鉱日石金属株式会社 電子部品用金属材料及びその製造方法

Also Published As

Publication number Publication date
MY192687A (en) 2022-09-01
WO2018077874A1 (en) 2018-05-03
KR102404045B1 (ko) 2022-05-30
JP2019533088A (ja) 2019-11-14
CN109844182A (zh) 2019-06-04
US20190271093A1 (en) 2019-09-05
EP3529398B1 (en) 2022-10-19
EP3529398A1 (en) 2019-08-28
JP6990240B2 (ja) 2022-01-12
KR20190070958A (ko) 2019-06-21

Similar Documents

Publication Publication Date Title
SG11201902595UA (en) A method of depositing a tin layer on a metal substrate and a use of a structure comprising a nickel/phosphorous alloy underlayer and said tin layer with said method
SG11201901006RA (en) Systems and methods for enhanced organizational transparency using a credit chain
SG11201407417VA (en) Encoding and reconstruction of residual data based on support information
SG11201806624XA (en) Deposition of molybdenum thin films using a molybdenum carbonyl precursor
SG11201900269XA (en) Channel sensing for independent links
SG11201909931PA (en) Oligomeric particle reagents and methods of use thereof
SG11201909957TA (en) Engineered ligase variants
SG11201901463YA (en) Apparatus and methods for atomic layer deposition
SG11201408269PA (en) Nanosilica coating assembly with enhanced durability
SG11201909009TA (en) Catheter securement device with window
SG11201408263QA (en) Laver-snack made of laver and cereal sheets and process of producing the same
SG11201407907XA (en) Apparatus and method for film formation
SG11201808419YA (en) All-digital software-defined cognitive heterogeneous network transceiver architecture
SG11201906972WA (en) Application control method and application control device
SG11201805191SA (en) Yeast cell
SG11201809875VA (en) Compositions and methods for treating spinal muscular atrophy
SG11201907004YA (en) Communication method, network device and terminal
SG11201901172QA (en) A method for manufacturing a fuel component
SG11201908435VA (en) A key for a lock and a combination of a cylinder lock and a reverible flat key
SG11201806919WA (en) Conductive paste comprising a silicone oil
SG11201908605XA (en) Antifouling article
SG11201908686WA (en) Scheduling request for wireless systems
SG11201908513RA (en) Peptides for treatment of diabetes
SG11201407208UA (en) A method for dynamic generation and modification of an electronic entity architecture
SG11201807340SA (en) A circuit layer for an integrated circuit card