SG11201807714QA - Dicing die bonding sheet, method for producing semiconductor chip and method for manufacturing semiconductor device - Google Patents

Dicing die bonding sheet, method for producing semiconductor chip and method for manufacturing semiconductor device

Info

Publication number
SG11201807714QA
SG11201807714QA SG11201807714QA SG11201807714QA SG11201807714QA SG 11201807714Q A SG11201807714Q A SG 11201807714QA SG 11201807714Q A SG11201807714Q A SG 11201807714QA SG 11201807714Q A SG11201807714Q A SG 11201807714QA SG 11201807714Q A SG11201807714Q A SG 11201807714QA
Authority
SG
Singapore
Prior art keywords
die bonding
bonding sheet
pressure
sensitive adhesive
semiconductor chip
Prior art date
Application number
SG11201807714QA
Other languages
English (en)
Inventor
Hideaki Suzuki
Sayaka Tsuchiyama
Akinori Sato
Natsuki NAKAAKI
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of SG11201807714QA publication Critical patent/SG11201807714QA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
SG11201807714QA 2016-03-10 2017-02-24 Dicing die bonding sheet, method for producing semiconductor chip and method for manufacturing semiconductor device SG11201807714QA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016046904 2016-03-10
PCT/JP2017/007103 WO2017154619A1 (ja) 2016-03-10 2017-02-24 ダイシングダイボンディングシート、半導体チップの製造方法及び半導体装置の製造方法

Publications (1)

Publication Number Publication Date
SG11201807714QA true SG11201807714QA (en) 2018-10-30

Family

ID=59790379

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201807714QA SG11201807714QA (en) 2016-03-10 2017-02-24 Dicing die bonding sheet, method for producing semiconductor chip and method for manufacturing semiconductor device

Country Status (6)

Country Link
JP (1) JP6805233B2 (ko)
KR (1) KR102637302B1 (ko)
CN (1) CN108713241B (ko)
SG (1) SG11201807714QA (ko)
TW (1) TWI702645B (ko)
WO (1) WO2017154619A1 (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6978890B2 (ja) * 2017-10-16 2021-12-08 リンテック株式会社 ダイシングダイボンディングシート及び半導体チップの製造方法
EP3760423A1 (en) * 2019-07-02 2021-01-06 Essilor International Method for making optical lenses using 3d printed functional wafers
TW202204150A (zh) * 2020-03-27 2022-02-01 日商琳得科股份有限公司 半導體裝置製造用片、半導體裝置製造用片的製造方法、以及具膜狀接著劑之半導體晶片的製造方法
JP7005805B1 (ja) 2021-04-28 2022-02-10 藤森工業株式会社 テープ

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005235795A (ja) * 2004-02-17 2005-09-02 Sumitomo Bakelite Co Ltd 半導体ウエハ加工用粘着テープ
JP4550680B2 (ja) 2005-07-12 2010-09-22 古河電気工業株式会社 半導体ウエハ固定用粘着テープ
CN101772831B (zh) * 2007-07-19 2011-12-21 积水化学工业株式会社 切割和芯片接合用带以及半导体芯片的制造方法
JP5353702B2 (ja) * 2007-10-09 2013-11-27 日立化成株式会社 接着フィルム付き半導体チップの製造方法及びこの製造方法に用いられる半導体用接着フィルム、並びに、半導体装置の製造方法
JP5069662B2 (ja) * 2007-11-12 2012-11-07 リンテック株式会社 粘着シート
JP2012222002A (ja) * 2011-04-04 2012-11-12 Nitto Denko Corp ダイシング・ダイボンドフィルム、及び、半導体装置の製造方法
JP5786505B2 (ja) * 2011-07-08 2015-09-30 日立化成株式会社 ダイシング・ダイボンディング一体型テープ
JP6287200B2 (ja) * 2013-12-27 2018-03-07 日立化成株式会社 ダイシング・ダイボンディング一体型テープ用ダイシングテープ

Also Published As

Publication number Publication date
KR102637302B1 (ko) 2024-02-15
KR20180122618A (ko) 2018-11-13
TWI702645B (zh) 2020-08-21
WO2017154619A1 (ja) 2017-09-14
JP6805233B2 (ja) 2020-12-23
CN108713241B (zh) 2023-04-11
CN108713241A (zh) 2018-10-26
JPWO2017154619A1 (ja) 2019-01-10
TW201802900A (zh) 2018-01-16

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