SG11201807420YA - Encapsulated instrumented substrate apparatus for acquiring measurement parameters in high temperature process applications - Google Patents

Encapsulated instrumented substrate apparatus for acquiring measurement parameters in high temperature process applications

Info

Publication number
SG11201807420YA
SG11201807420YA SG11201807420YA SG11201807420YA SG11201807420YA SG 11201807420Y A SG11201807420Y A SG 11201807420YA SG 11201807420Y A SG11201807420Y A SG 11201807420YA SG 11201807420Y A SG11201807420Y A SG 11201807420YA SG 11201807420Y A SG11201807420Y A SG 11201807420YA
Authority
SG
Singapore
Prior art keywords
international
california
enclosure
substrate
milpitas
Prior art date
Application number
SG11201807420YA
Other languages
English (en)
Inventor
Mei Sun
Earl Jensen
Jing Zhou
Ran Liu
Original Assignee
Kla Tencor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kla Tencor Corp filed Critical Kla Tencor Corp
Publication of SG11201807420YA publication Critical patent/SG11201807420YA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Arrangements For Transmission Of Measured Signals (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
  • Heterocyclic Carbon Compounds Containing A Hetero Ring Having Oxygen Or Sulfur (AREA)
SG11201807420YA 2016-06-15 2017-06-14 Encapsulated instrumented substrate apparatus for acquiring measurement parameters in high temperature process applications SG11201807420YA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201662350688P 2016-06-15 2016-06-15
US15/277,792 US10460966B2 (en) 2016-06-15 2016-09-27 Encapsulated instrumented substrate apparatus for acquiring measurement parameters in high temperature process applications
PCT/US2017/037548 WO2017218701A1 (en) 2016-06-15 2017-06-14 Encapsulated instrumented substrate apparatus for acquiring measurement parameters in high temperature process applications

Publications (1)

Publication Number Publication Date
SG11201807420YA true SG11201807420YA (en) 2018-12-28

Family

ID=60661415

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201807420YA SG11201807420YA (en) 2016-06-15 2017-06-14 Encapsulated instrumented substrate apparatus for acquiring measurement parameters in high temperature process applications

Country Status (7)

Country Link
US (2) US10460966B2 (enExample)
JP (2) JP6920357B2 (enExample)
KR (1) KR102446462B1 (enExample)
CN (2) CN112820718B (enExample)
SG (1) SG11201807420YA (enExample)
TW (1) TWI751172B (enExample)
WO (1) WO2017218701A1 (enExample)

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US10460966B2 (en) 2016-06-15 2019-10-29 Kla-Tencor Corporation Encapsulated instrumented substrate apparatus for acquiring measurement parameters in high temperature process applications
US20180366354A1 (en) 2017-06-19 2018-12-20 Applied Materials, Inc. In-situ semiconductor processing chamber temperature apparatus
US10900843B2 (en) * 2018-06-05 2021-01-26 Kla Corporation In-situ temperature sensing substrate, system, and method
US10794681B2 (en) * 2018-09-04 2020-10-06 Applied Materials, Inc. Long range capacitive gap measurement in a wafer form sensor system
US11315811B2 (en) 2018-09-06 2022-04-26 Kla Corporation Process temperature measurement device fabrication techniques and methods of calibration and data interpolation of the same
KR102136466B1 (ko) * 2018-09-11 2020-07-22 주식회사 이큐셀 고온 공정 진단이 가능한 웨이퍼 센서
US11054317B2 (en) * 2018-09-28 2021-07-06 Applied Materials, Inc. Method and apparatus for direct measurement of chucking force on an electrostatic chuck
US12074044B2 (en) * 2018-11-14 2024-08-27 Cyberoptics Corporation Wafer-like sensor
US11636948B2 (en) * 2019-05-21 2023-04-25 Q Med Innovations, Inc. Instrument kit tracking system
KR102438344B1 (ko) * 2019-10-14 2022-09-01 세메스 주식회사 웨이퍼형 센서 유닛 및 웨이퍼형 센서 유닛의 제조 방법
KR102382971B1 (ko) * 2019-11-05 2022-04-05 이트론 주식회사 반도체 공정 진단을 위한 온도 센서 장치 및 이의 제조 방법
US11668601B2 (en) 2020-02-24 2023-06-06 Kla Corporation Instrumented substrate apparatus
US11924972B2 (en) * 2020-06-02 2024-03-05 Applied Materials, Inc. Diagnostic disc with a high vacuum and temperature tolerant power source
US11589474B2 (en) 2020-06-02 2023-02-21 Applied Materials, Inc. Diagnostic disc with a high vacuum and temperature tolerant power source
US20220223441A1 (en) * 2021-01-08 2022-07-14 Kla Corporation Process condition sensing apparatus
US11688614B2 (en) * 2021-04-28 2023-06-27 Kla Corporation Mitigating thermal expansion mismatch in temperature probe construction apparatus and method
US20240035896A1 (en) * 2022-07-28 2024-02-01 Applied Materials, Inc. Radical sensor substrate
CN115399913B (zh) * 2022-09-16 2024-05-03 复旦大学附属中山医院 一种高灵敏度柔性人工智能皮肤及其制备方法

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US7757574B2 (en) * 2002-01-24 2010-07-20 Kla-Tencor Corporation Process condition sensing wafer and data analysis system
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US11150140B2 (en) 2016-02-02 2021-10-19 Kla Corporation Instrumented substrate apparatus for acquiring measurement parameters in high temperature process applications
US10460966B2 (en) 2016-06-15 2019-10-29 Kla-Tencor Corporation Encapsulated instrumented substrate apparatus for acquiring measurement parameters in high temperature process applications

Also Published As

Publication number Publication date
US20170365495A1 (en) 2017-12-21
CN112820718B (zh) 2024-12-20
JP2019523884A (ja) 2019-08-29
JP7194786B2 (ja) 2022-12-22
TWI751172B (zh) 2022-01-01
US20200203200A1 (en) 2020-06-25
CN109314066A (zh) 2019-02-05
CN112820718A (zh) 2021-05-18
KR102446462B1 (ko) 2022-09-21
JP6920357B2 (ja) 2021-08-18
US11823925B2 (en) 2023-11-21
JP2021170034A (ja) 2021-10-28
CN109314066B (zh) 2021-01-15
US10460966B2 (en) 2019-10-29
TW201810479A (zh) 2018-03-16
KR20190008578A (ko) 2019-01-24
WO2017218701A1 (en) 2017-12-21

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