SG11201806881WA - Protective film formation sheet, manufacturing method for protective film formation sheet, and manufacturing method for semiconductor device - Google Patents
Protective film formation sheet, manufacturing method for protective film formation sheet, and manufacturing method for semiconductor deviceInfo
- Publication number
- SG11201806881WA SG11201806881WA SG11201806881WA SG11201806881WA SG11201806881WA SG 11201806881W A SG11201806881W A SG 11201806881WA SG 11201806881W A SG11201806881W A SG 11201806881WA SG 11201806881W A SG11201806881W A SG 11201806881WA SG 11201806881W A SG11201806881W A SG 11201806881WA
- Authority
- SG
- Singapore
- Prior art keywords
- protective film
- film formation
- manufacturing
- formation sheet
- semiconductor device
- Prior art date
Links
- 230000015572 biosynthetic process Effects 0.000 title abstract 7
- 230000001681 protective effect Effects 0.000 title abstract 7
- 238000004519 manufacturing process Methods 0.000 title 2
- 239000004065 semiconductor Substances 0.000 title 1
- 230000003068 static effect Effects 0.000 abstract 1
- 230000003746 surface roughness Effects 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/185—Joining of semiconductor bodies for junction formation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Dicing (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016031343 | 2016-02-22 | ||
| PCT/JP2017/005937 WO2017145938A1 (ja) | 2016-02-22 | 2017-02-17 | 保護膜形成用シート、保護膜形成用シートの製造方法及び半導体装置の製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201806881WA true SG11201806881WA (en) | 2018-09-27 |
Family
ID=59686239
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201806881WA SG11201806881WA (en) | 2016-02-22 | 2017-02-17 | Protective film formation sheet, manufacturing method for protective film formation sheet, and manufacturing method for semiconductor device |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JP6893498B2 (ko) |
| KR (1) | KR102637275B1 (ko) |
| CN (1) | CN108701641B (ko) |
| SG (1) | SG11201806881WA (ko) |
| TW (1) | TWI758276B (ko) |
| WO (1) | WO2017145938A1 (ko) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7482035B2 (ja) * | 2018-12-05 | 2024-05-13 | リンテック株式会社 | 保護膜形成用複合シート、及び半導体チップの製造方法 |
| US20220220345A1 (en) * | 2019-03-18 | 2022-07-14 | Modu Tech Co., Ltd. | Adhesive tape for semiconductor package manufacturing process, and method for manufacturing same |
| JP7478524B2 (ja) | 2019-09-05 | 2024-05-07 | リンテック株式会社 | 保護膜形成用フィルム、保護膜形成用複合シート、及び保護膜付きワーク加工物の製造方法 |
| KR20230024542A (ko) * | 2021-08-12 | 2023-02-21 | (주)이녹스첨단소재 | 웨이퍼 이면 연삭용 점착 필름 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5432853Y2 (ko) | 1974-12-12 | 1979-10-11 | ||
| JPH0620601Y2 (ja) * | 1986-06-13 | 1994-06-01 | 株式会社きもと | 転写可能な保護膜形成用多層シ−ト |
| JP3668439B2 (ja) * | 2001-06-14 | 2005-07-06 | ソニーケミカル株式会社 | 接着フィルム |
| JP2003336217A (ja) * | 2002-05-21 | 2003-11-28 | Sanvic Inc | ポリエチレンと１−ヘキセンとの共重合体シートを二枚重ねて形成した接触面で摩擦力を低減する工法 |
| JP2007031470A (ja) * | 2005-07-22 | 2007-02-08 | Toppan Printing Co Ltd | 積層光学部材用粘着シート |
| JP5537134B2 (ja) * | 2009-11-30 | 2014-07-02 | リンテック株式会社 | ラベル用粘着シート積層体およびラベル用粘着シート積層体の製造方法 |
| JP5565230B2 (ja) * | 2010-09-16 | 2014-08-06 | 日本ゼオン株式会社 | 光学フィルムロール及び光学フィルムロールの製造方法 |
| JP5865045B2 (ja) * | 2011-12-07 | 2016-02-17 | リンテック株式会社 | 保護膜形成層付ダイシングシートおよびチップの製造方法 |
| JP5514376B1 (ja) * | 2012-11-05 | 2014-06-04 | リンテック株式会社 | 粘着シート |
| JP6325307B2 (ja) * | 2014-03-28 | 2018-05-16 | 積水化成品工業株式会社 | 深絞り成形用の樹脂製発泡シート、容器及びこれらの製造方法 |
| JP6319433B2 (ja) * | 2014-05-23 | 2018-05-09 | リンテック株式会社 | 保護膜形成用複合シート |
-
2017
- 2017-02-17 WO PCT/JP2017/005937 patent/WO2017145938A1/ja active Application Filing
- 2017-02-17 JP JP2018501637A patent/JP6893498B2/ja active Active
- 2017-02-17 CN CN201780013457.8A patent/CN108701641B/zh active Active
- 2017-02-17 SG SG11201806881WA patent/SG11201806881WA/en unknown
- 2017-02-17 KR KR1020187023729A patent/KR102637275B1/ko active IP Right Grant
- 2017-02-20 TW TW106105584A patent/TWI758276B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| CN108701641A (zh) | 2018-10-23 |
| JP6893498B2 (ja) | 2021-06-23 |
| TW201801160A (zh) | 2018-01-01 |
| KR102637275B1 (ko) | 2024-02-15 |
| CN108701641B (zh) | 2023-03-28 |
| JPWO2017145938A1 (ja) | 2018-12-13 |
| TWI758276B (zh) | 2022-03-21 |
| KR20180118628A (ko) | 2018-10-31 |
| WO2017145938A1 (ja) | 2017-08-31 |
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