SG11201707720SA - Engineered polymer-based electronic materials - Google Patents
Engineered polymer-based electronic materialsInfo
- Publication number
- SG11201707720SA SG11201707720SA SG11201707720SA SG11201707720SA SG11201707720SA SG 11201707720S A SG11201707720S A SG 11201707720SA SG 11201707720S A SG11201707720S A SG 11201707720SA SG 11201707720S A SG11201707720S A SG 11201707720SA SG 11201707720S A SG11201707720S A SG 11201707720SA
- Authority
- SG
- Singapore
- Prior art keywords
- electronic materials
- based electronic
- engineered polymer
- engineered
- polymer
- Prior art date
Links
- 239000012776 electronic material Substances 0.000 title 1
- 229920000642 polymer Polymers 0.000 title 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
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- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
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- Materials Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Wire Bonding (AREA)
- Paints Or Removers (AREA)
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IN930DE2015 | 2015-04-01 | ||
PCT/GB2016/050910 WO2016156853A1 (en) | 2015-04-01 | 2016-03-31 | Engineered polymer-based electronic materials |
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EP (1) | EP3277453B1 (ko) |
JP (2) | JP2018518544A (ko) |
KR (1) | KR102050252B1 (ko) |
CN (1) | CN107771354B (ko) |
SG (1) | SG11201707720SA (ko) |
TW (1) | TWI701287B (ko) |
WO (1) | WO2016156853A1 (ko) |
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JP7013790B2 (ja) * | 2017-10-24 | 2022-02-01 | 昭和電工マテリアルズ株式会社 | 封止用エポキシ樹脂組成物及び電子部品装置 |
KR102394809B1 (ko) * | 2017-12-20 | 2022-05-04 | 현대자동차주식회사 | 고방열 복합수지 |
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CN108559228B (zh) * | 2018-05-09 | 2020-05-01 | 西北工业大学 | 一种环氧树脂基电磁屏蔽复合材料及其制备方法 |
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CN109206739A (zh) * | 2018-07-26 | 2019-01-15 | 四川大学 | 氮磷硅改性石墨烯无卤阻燃聚合物复合材料及其制备方法 |
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CN109014660B (zh) * | 2018-09-27 | 2021-01-15 | 华北水利水电大学 | 一种高氮钢钎焊用钎料的增强剂 |
CN110734712B (zh) * | 2018-10-26 | 2020-12-15 | 嘉兴学院 | 一种陶瓷基导电胶材料的制备方法 |
CN109517177A (zh) * | 2018-11-26 | 2019-03-26 | 衡阳思迈科科技有限公司 | 烃羧基改性导电银胶乳液的制备方法 |
CN110370780B (zh) * | 2019-06-28 | 2021-09-07 | 佛山佛塑科技集团股份有限公司 | 软包装膜的制备方法 |
CN110699026B (zh) * | 2019-10-22 | 2022-11-18 | 亿铖达(深圳)新材料有限公司 | 一种柔性环氧灌封胶 |
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2016
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- 2016-03-31 EP EP16719889.4A patent/EP3277453B1/en active Active
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WO2016156853A8 (en) | 2018-01-25 |
TWI701287B (zh) | 2020-08-11 |
CN107771354B (zh) | 2022-09-13 |
WO2016156853A1 (en) | 2016-10-06 |
CN107771354A (zh) | 2018-03-06 |
EP3277453A1 (en) | 2018-02-07 |
JP2018518544A (ja) | 2018-07-12 |
EP3277453B1 (en) | 2024-01-17 |
US20180056455A1 (en) | 2018-03-01 |
US20190143461A9 (en) | 2019-05-16 |
KR20170136561A (ko) | 2017-12-11 |
JP2020097721A (ja) | 2020-06-25 |
TW201700597A (zh) | 2017-01-01 |
US10682732B2 (en) | 2020-06-16 |
KR102050252B1 (ko) | 2019-11-29 |
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