SG11201707348QA - Testing head with vertical probes, particularly for high frequency applications - Google Patents

Testing head with vertical probes, particularly for high frequency applications

Info

Publication number
SG11201707348QA
SG11201707348QA SG11201707348QA SG11201707348QA SG11201707348QA SG 11201707348Q A SG11201707348Q A SG 11201707348QA SG 11201707348Q A SG11201707348Q A SG 11201707348QA SG 11201707348Q A SG11201707348Q A SG 11201707348QA SG 11201707348Q A SG11201707348Q A SG 11201707348QA
Authority
SG
Singapore
Prior art keywords
high frequency
frequency applications
testing head
vertical probes
probes
Prior art date
Application number
SG11201707348QA
Other languages
English (en)
Inventor
Daniele Acconcia
Original Assignee
Technoprobe Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Technoprobe Spa filed Critical Technoprobe Spa
Publication of SG11201707348QA publication Critical patent/SG11201707348QA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/0675—Needle-like
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
SG11201707348QA 2015-03-13 2016-03-10 Testing head with vertical probes, particularly for high frequency applications SG11201707348QA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
ITMI20150386 2015-03-13
PCT/EP2016/055141 WO2016146476A1 (en) 2015-03-13 2016-03-10 Testing head with vertical probes, particularly for high frequency applications

Publications (1)

Publication Number Publication Date
SG11201707348QA true SG11201707348QA (en) 2017-10-30

Family

ID=53284346

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201707348QA SG11201707348QA (en) 2015-03-13 2016-03-10 Testing head with vertical probes, particularly for high frequency applications

Country Status (10)

Country Link
US (1) US10578646B2 (ja)
EP (1) EP3268751B1 (ja)
JP (1) JP6752829B2 (ja)
KR (1) KR102536001B1 (ja)
CN (1) CN107430150B (ja)
MY (1) MY187095A (ja)
PH (1) PH12017501672A1 (ja)
SG (1) SG11201707348QA (ja)
TW (1) TWI693408B (ja)
WO (1) WO2016146476A1 (ja)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107430150B (zh) 2015-03-13 2020-08-21 泰克诺探头公司 特别用于高频应用的具有竖向探针的测试头
IT201600127507A1 (it) * 2016-12-16 2018-06-16 Technoprobe Spa Sonda di contatto e relativa testa di misura per un’apparecchiatura di test di dispositivi elettronici
JP7148212B2 (ja) * 2017-04-27 2022-10-05 日本電産リード株式会社 検査治具、及び基板検査装置
DE102017209510A1 (de) 2017-06-06 2018-12-06 Feinmetall Gmbh Kontaktelementsystem
JP2019074483A (ja) * 2017-10-19 2019-05-16 株式会社日本マイクロニクス 電気的接続装置
CN109752576B (zh) * 2017-11-01 2021-01-08 中华精测科技股份有限公司 探针卡装置及其信号传输模块
CN108593980A (zh) * 2018-04-18 2018-09-28 强半导体（苏州）有限公司 一种接触探针、测试头及接触探针的制造方法
IT201800010071A1 (it) * 2018-11-06 2020-05-06 Technoprobe Spa Testa di misura a sonde verticali con migliorate proprietà di contatto con un dispositivo di test
KR102164373B1 (ko) * 2019-04-05 2020-10-12 윌테크놀러지(주) 스크럽 제어 및 밴딩방향 제어가 가능한 수직형 프로브 카드용 니들
IT201900024889A1 (it) 2019-12-19 2021-06-19 Technoprobe Spa Sonda di contatto per applicazioni ad alta frequenza con migliorata portata di corrente
TW202206824A (zh) * 2020-08-04 2022-02-16 義大利商探針科技公司 電子裝置的探針頭的接觸探針
IT202000028364A1 (it) * 2020-11-25 2022-05-25 Technoprobe Spa Sonda di contatto per teste di misura di dispositivi elettronici
TWI756947B (zh) * 2020-11-30 2022-03-01 中華精測科技股份有限公司 探針卡裝置及雙溝式探針
JP2022116470A (ja) * 2021-01-29 2022-08-10 株式会社村田製作所 プローブ装置
KR102509528B1 (ko) * 2021-02-05 2023-03-14 (주)포인트엔지니어링 전기 전도성 접촉핀
KR102260983B1 (ko) * 2021-04-16 2021-06-04 윌테크놀러지(주) 정렬효율이 향상된 수직형 프로브 카드용 니들
WO2022249954A1 (ja) * 2021-05-28 2022-12-01 株式会社日本マイクロニクス プローブ
CN115480082A (zh) * 2021-06-15 2022-12-16 迪科特测试科技(苏州)有限公司 弹力型探针元件、组件和测试装置
TWI798127B (zh) * 2021-07-07 2023-04-01 旺矽科技股份有限公司 垂直式探針頭
KR102321081B1 (ko) * 2021-07-21 2021-11-03 (주)새한마이크로텍 접촉 프로브 조립체
IT202100032882A1 (it) * 2021-12-29 2023-06-29 Technoprobe Spa Sonda di contatto per teste di misura di dispositivi elettronici e relativa testa di misura
WO2023163271A1 (ko) * 2022-02-25 2023-08-31 (주)티에스이 저마찰형 프로브 헤드
CN115308456B (zh) * 2022-09-29 2023-03-10 深圳市道格特科技有限公司 一种垂直探针及探针卡

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4622514A (en) * 1984-06-15 1986-11-11 Ibm Multiple mode buckling beam probe assembly
FR2815127B1 (fr) 2000-10-05 2002-12-20 Andre Sabatier Connecteur electrique a contacts multiples
JP5075309B2 (ja) 2001-03-16 2012-11-21 日本発條株式会社 導電性接触子用支持体
TW200301360A (en) 2001-12-03 2003-07-01 Advantest Corp Contact structure and production method thereof and probe contact assembly using same
WO2007086147A1 (ja) * 2006-01-25 2007-08-02 Kabushiki Kaisha Nihon Micronics 通電試験用プローブ、プローブ組立体およびその製造方法
KR20080003836A (ko) * 2007-10-26 2008-01-08 테크노프로브 에스.피.에이. 수직 프로브를 가지는 반도체 집적 전자 소자 테스트헤드용 접촉 프로브
JP4921344B2 (ja) * 2007-12-26 2012-04-25 株式会社ヨコオ 検査ソケット
DE102008023761B9 (de) * 2008-05-09 2012-11-08 Feinmetall Gmbh Elektrisches Kontaktelement zum Berührungskontaktieren von elektrischen Prüflingen sowie entsprechende Kontaktieranordnung
CN101738509B (zh) * 2008-11-24 2011-11-30 旺矽科技股份有限公司 高频垂直式探针装置
US8222912B2 (en) * 2009-03-12 2012-07-17 Sv Probe Pte. Ltd. Probe head structure for probe test cards
JP2012173263A (ja) * 2011-02-24 2012-09-10 Japan Electronic Materials Corp 電気的接触子及び電気的接触子ユニット
US9702904B2 (en) * 2011-03-21 2017-07-11 Formfactor, Inc. Non-linear vertical leaf spring
JP2013007700A (ja) * 2011-06-27 2013-01-10 Japan Electronic Materials Corp 電気的接触子
US9279830B2 (en) * 2011-12-31 2016-03-08 Intel Corporation Test probe structures and methods including positioning test probe structures in a test head
JP2013257299A (ja) 2012-06-14 2013-12-26 Sumitomo Electric Ind Ltd コンタクトプローブ、プローブカード及び電子部品の検査方法
US20140043054A1 (en) * 2012-08-09 2014-02-13 Formfactor, Inc. Vertical probes for multi-pitch full grid contact array
KR102092430B1 (ko) 2012-12-04 2020-03-23 일본전자재료(주) 전기적 접촉자
CN103063887A (zh) * 2012-12-31 2013-04-24 福建合顺微电子有限公司 一种探针自动对准电极测试方法、工具及其装置
KR102081478B1 (ko) 2013-07-09 2020-02-25 폼팩터, 인크. 전기적 도전성 가이드 플레이트들 사이의, 신호 통과 경로들 및 이차 경로들을 갖는 다경로 전기적 프로브 및 프로브 어셈블리들
CN107430150B (zh) 2015-03-13 2020-08-21 泰克诺探头公司 特别用于高频应用的具有竖向探针的测试头

Also Published As

Publication number Publication date
JP2018509638A (ja) 2018-04-05
TW201632892A (zh) 2016-09-16
EP3268751A1 (en) 2018-01-17
CN107430150B (zh) 2020-08-21
US10578646B2 (en) 2020-03-03
CN107430150A (zh) 2017-12-01
JP6752829B2 (ja) 2020-09-09
TWI693408B (zh) 2020-05-11
US20180011126A1 (en) 2018-01-11
EP3268751B1 (en) 2020-02-05
WO2016146476A1 (en) 2016-09-22
KR20170129806A (ko) 2017-11-27
MY187095A (en) 2021-08-31
PH12017501672A1 (en) 2018-03-19
KR102536001B1 (ko) 2023-05-24

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