SG11201704005XA - Resin film-forming sheet, resin film-forming composite sheet, and silicon wafer regeneration method - Google Patents

Resin film-forming sheet, resin film-forming composite sheet, and silicon wafer regeneration method

Info

Publication number
SG11201704005XA
SG11201704005XA SG11201704005XA SG11201704005XA SG11201704005XA SG 11201704005X A SG11201704005X A SG 11201704005XA SG 11201704005X A SG11201704005X A SG 11201704005XA SG 11201704005X A SG11201704005X A SG 11201704005XA SG 11201704005X A SG11201704005X A SG 11201704005XA
Authority
SG
Singapore
Prior art keywords
resin film
forming
sheet
silicon wafer
regeneration method
Prior art date
Application number
SG11201704005XA
Other languages
English (en)
Inventor
Naoya Saiki
Daisuke Yamamoto
Hiroyuki Yoneyama
Youichi Inao
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of SG11201704005XA publication Critical patent/SG11201704005XA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/16—Layered products comprising a layer of synthetic resin specially treated, e.g. irradiated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/18—Homopolymers or copolymers of nitriles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/185—Joining of semiconductor bodies for junction formation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
SG11201704005XA 2015-01-14 2015-11-18 Resin film-forming sheet, resin film-forming composite sheet, and silicon wafer regeneration method SG11201704005XA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015005168 2015-01-14
PCT/JP2015/082433 WO2016113998A1 (ja) 2015-01-14 2015-11-18 樹脂膜形成用シート、樹脂膜形成用複合シート、及びシリコンウエハの再生方法

Publications (1)

Publication Number Publication Date
SG11201704005XA true SG11201704005XA (en) 2017-07-28

Family

ID=56405555

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201704005XA SG11201704005XA (en) 2015-01-14 2015-11-18 Resin film-forming sheet, resin film-forming composite sheet, and silicon wafer regeneration method

Country Status (6)

Country Link
JP (1) JP6464196B2 (ja)
KR (1) KR102343970B1 (ja)
CN (1) CN107001664B (ja)
SG (1) SG11201704005XA (ja)
TW (2) TWI694129B (ja)
WO (1) WO2016113998A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7086102B2 (ja) * 2017-12-07 2022-06-17 リンテック株式会社 ワーク加工用シートおよび加工済みワークの製造方法
JP7025231B2 (ja) * 2018-02-01 2022-02-24 日東電工株式会社 表面保護フィルム
WO2019235287A1 (ja) * 2018-06-06 2019-12-12 積水化学工業株式会社 粘着テープ
JP7251167B2 (ja) * 2019-01-28 2023-04-04 株式会社レゾナック フィルム状接着剤、接着シート、並びに半導体装置及びその製造方法
KR102455146B1 (ko) * 2020-02-10 2022-10-17 주식회사 나노인 기판의 구조충진을 위한 가역적 코팅 방법 및 봉지 방법

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1053746A (ja) * 1996-08-09 1998-02-24 Oji Paper Co Ltd 保護フィルム剥離方法
JP2003003131A (ja) * 2001-06-18 2003-01-08 Nitto Denko Corp 半導体ウエハ保護シートの剥離用テープ
JP3766304B2 (ja) * 2001-10-09 2006-04-12 クレハエラストマー株式会社 加熱剥離型粘着シート
JP2009138026A (ja) 2007-12-03 2009-06-25 Furukawa Electric Co Ltd:The エネルギー線硬化型チップ保護用フィルム
JP5097600B2 (ja) * 2008-03-31 2012-12-12 リンテック株式会社 チップの保持構造、ダイソート用シート及び半導体装置の製造方法
JP2009246302A (ja) * 2008-03-31 2009-10-22 Lintec Corp ダイソートテープ
JP5805367B2 (ja) 2009-01-30 2015-11-04 日東電工株式会社 ダイシングテープ一体型ウエハ裏面保護フィルム
JP2013181063A (ja) * 2012-02-29 2013-09-12 Nitto Denko Corp 自発巻回性粘着フィルム
JP2013237732A (ja) * 2012-05-11 2013-11-28 Dainippon Printing Co Ltd エネルギー線易剥離型粘着剤組成物及び粘着テープ
JP2014096422A (ja) * 2012-11-07 2014-05-22 Fujifilm Corp 基板支持部材、基板処理装置、基板支持部材の製造方法、及び基板処理方法
TWI637439B (zh) * 2012-12-14 2018-10-01 琳得科股份有限公司 Protective film forming film

Also Published As

Publication number Publication date
TWI736196B (zh) 2021-08-11
KR102343970B1 (ko) 2021-12-27
CN107001664B (zh) 2020-05-12
TW202030287A (zh) 2020-08-16
TWI694129B (zh) 2020-05-21
JP6464196B2 (ja) 2019-02-06
WO2016113998A1 (ja) 2016-07-21
TW201638260A (zh) 2016-11-01
KR20170103749A (ko) 2017-09-13
CN107001664A (zh) 2017-08-01
JPWO2016113998A1 (ja) 2017-10-19

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