SG11201702984YA - Refrigerant supply device, cooling device, and cooling system - Google Patents

Refrigerant supply device, cooling device, and cooling system

Info

Publication number
SG11201702984YA
SG11201702984YA SG11201702984YA SG11201702984YA SG11201702984YA SG 11201702984Y A SG11201702984Y A SG 11201702984YA SG 11201702984Y A SG11201702984Y A SG 11201702984YA SG 11201702984Y A SG11201702984Y A SG 11201702984YA SG 11201702984Y A SG11201702984Y A SG 11201702984YA
Authority
SG
Singapore
Prior art keywords
cooling
refrigerant supply
supply device
cooling system
cooling device
Prior art date
Application number
SG11201702984YA
Other languages
English (en)
Inventor
Tadao Hosaka
Original Assignee
Nec Platforms Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Platforms Ltd filed Critical Nec Platforms Ltd
Publication of SG11201702984YA publication Critical patent/SG11201702984YA/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20818—Liquid cooling with phase change within cabinets for removing heat from server blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B23/00—Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect
    • F25B23/006—Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect boiling cooling systems
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/02—Header boxes; End plates
    • F28F9/0202—Header boxes having their inner space divided by partitions
    • F28F9/0204—Header boxes having their inner space divided by partitions for elongated header box, e.g. with transversal and longitudinal partitions
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
SG11201702984YA 2014-10-17 2015-10-14 Refrigerant supply device, cooling device, and cooling system SG11201702984YA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014212152A JP5869646B1 (ja) 2014-10-17 2014-10-17 冷媒供給装置および冷却装置および冷却システム
PCT/JP2015/005204 WO2016059800A1 (ja) 2014-10-17 2015-10-14 冷媒供給装置および冷却装置および冷却システム

Publications (1)

Publication Number Publication Date
SG11201702984YA true SG11201702984YA (en) 2017-06-29

Family

ID=55360927

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201702984YA SG11201702984YA (en) 2014-10-17 2015-10-14 Refrigerant supply device, cooling device, and cooling system

Country Status (5)

Country Link
US (1) US10149412B2 (de)
EP (1) EP3214390B1 (de)
JP (1) JP5869646B1 (de)
SG (1) SG11201702984YA (de)
WO (1) WO2016059800A1 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11105566B2 (en) 2017-03-30 2021-08-31 Nec Corporation Heat exchanger, heat exchange system, and heat exchange method
CN111240446B (zh) * 2020-01-06 2021-06-29 苏州浪潮智能科技有限公司 一种服务器用浸没式液体冷却装置
KR102549339B1 (ko) * 2023-01-17 2023-06-29 아세아열기 주식회사 히트파이프용 열교환기

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3449923A (en) * 1968-03-08 1969-06-17 Refrigerating Specialties Co Refrigerant feed control and systems
US3592017A (en) * 1969-10-02 1971-07-13 Carrier Corp Purging arrangement for refrigeration systems
US3955374A (en) * 1974-10-23 1976-05-11 Zearfoss Jr Elmer W Refrigeration apparatus and method
JPH0443736Y2 (de) * 1985-09-12 1992-10-15
JPH0796983B2 (ja) 1986-06-30 1995-10-18 日本電装株式会社 凝縮器
JP3044395B2 (ja) * 1990-12-28 2000-05-22 株式会社ゼクセル レシーバドライヤ一体型コンデンサ
JPH04294835A (ja) * 1991-03-20 1992-10-19 Matsushita Refrig Co Ltd 冷媒分流器の製造方法と冷媒分流器
JPH05312361A (ja) 1991-11-20 1993-11-22 Furukawa Electric Co Ltd:The 空調システム
JPH06195130A (ja) 1992-10-30 1994-07-15 Furukawa Electric Co Ltd:The 空調用熱交換器の液面調節器及びそれを用いた空調システム
JP4280545B2 (ja) * 2003-05-14 2009-06-17 カルソニックカンセイ株式会社 複合型熱交換器
JP4879306B2 (ja) * 2009-09-29 2012-02-22 三菱電機株式会社 分配器及びヒートポンプ装置
JP5544808B2 (ja) * 2009-09-29 2014-07-09 Ｔｄｋ株式会社 反応炉及び磁性材料用粉末の製造方法
SG11201504298TA (en) 2012-12-03 2015-07-30 Nec Corp Cooling system for electronic device storing apparatus and cooling system for electronic device storing building
JP2014126273A (ja) * 2012-12-26 2014-07-07 Daikin Ind Ltd 熱交換器および冷凍装置

Also Published As

Publication number Publication date
JP2016080262A (ja) 2016-05-16
US10149412B2 (en) 2018-12-04
US20170311489A1 (en) 2017-10-26
WO2016059800A1 (ja) 2016-04-21
EP3214390A1 (de) 2017-09-06
EP3214390A4 (de) 2018-08-01
JP5869646B1 (ja) 2016-02-24
EP3214390B1 (de) 2019-07-24

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