SG11201702039YA - Bearing apparatus and semiconductor processing device - Google Patents

Bearing apparatus and semiconductor processing device

Info

Publication number
SG11201702039YA
SG11201702039YA SG11201702039YA SG11201702039YA SG11201702039YA SG 11201702039Y A SG11201702039Y A SG 11201702039YA SG 11201702039Y A SG11201702039Y A SG 11201702039YA SG 11201702039Y A SG11201702039Y A SG 11201702039YA SG 11201702039Y A SG11201702039Y A SG 11201702039YA
Authority
SG
Singapore
Prior art keywords
processing device
semiconductor processing
bearing apparatus
bearing
semiconductor
Prior art date
Application number
SG11201702039YA
Other languages
English (en)
Inventor
Youshan Zheng
Yulin Peng
Original Assignee
Beijing Naura Microelectronics Equipment Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Beijing Naura Microelectronics Equipment Co Ltd filed Critical Beijing Naura Microelectronics Equipment Co Ltd
Publication of SG11201702039YA publication Critical patent/SG11201702039YA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
SG11201702039YA 2014-09-19 2015-09-18 Bearing apparatus and semiconductor processing device SG11201702039YA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201410484756.8A CN105489527B (zh) 2014-09-19 2014-09-19 承载装置以及半导体加工设备
PCT/CN2015/089916 WO2016041519A1 (zh) 2014-09-19 2015-09-18 承载装置以及半导体加工设备

Publications (1)

Publication Number Publication Date
SG11201702039YA true SG11201702039YA (en) 2017-04-27

Family

ID=55532573

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201702039YA SG11201702039YA (en) 2014-09-19 2015-09-18 Bearing apparatus and semiconductor processing device

Country Status (6)

Country Link
JP (1) JP2017533582A (zh)
KR (1) KR20170048469A (zh)
CN (1) CN105489527B (zh)
SG (1) SG11201702039YA (zh)
TW (1) TW201613029A (zh)
WO (1) WO2016041519A1 (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106856188B (zh) * 2015-12-08 2020-02-14 北京北方华创微电子装备有限公司 承载装置以及半导体加工设备
CN108987323B (zh) * 2017-06-05 2020-03-31 北京北方华创微电子装备有限公司 一种承载装置及半导体加工设备
CN112786422B (zh) * 2019-11-08 2024-03-12 中微半导体设备(上海)股份有限公司 一种聚焦环、等离子体处理器及方法
CN111060223A (zh) * 2019-12-26 2020-04-24 北京北方华创微电子装备有限公司 卡盘校温装置及卡盘校温方法
CN111607785A (zh) * 2020-05-26 2020-09-01 北京北方华创微电子装备有限公司 一种加热装置及半导体加工设备
CN112435913B (zh) * 2020-11-23 2024-04-12 北京北方华创微电子装备有限公司 半导体设备及其下电极
CN112658804B (zh) * 2020-12-22 2023-01-06 宁波江丰电子材料股份有限公司 一种半导体聚焦环的加工设备及方法
CN112509954B (zh) * 2021-02-04 2021-06-08 北京中硅泰克精密技术有限公司 半导体工艺设备及其承载装置
KR102451782B1 (ko) * 2021-08-27 2022-10-11 주식회사 동탄이엔지 온도 보상이 가능한 에지링 및 이를 포함하는 기판 처리 장치
CN114086146B (zh) * 2021-11-18 2023-09-08 北京北方华创微电子装备有限公司 半导体工艺设备及其承载装置
CN117577575B (zh) * 2024-01-16 2024-05-17 北京北方华创微电子装备有限公司 承载装置及半导体工艺设备

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JPH0474418U (zh) * 1990-11-07 1992-06-30
JP3583289B2 (ja) * 1998-05-28 2004-11-04 株式会社日立製作所 プラズマ処理装置及びプラズマ処理方法
JP2000277237A (ja) * 1999-03-24 2000-10-06 Komatsu Ltd 基板温度制御プレート及びそれを備える基板温度制御装置
JP4344835B2 (ja) * 2002-10-24 2009-10-14 東京エレクトロン株式会社 枚葉式の処理装置
JP4439853B2 (ja) * 2003-07-08 2010-03-24 東京エレクトロン株式会社 プラズマ処理装置、フォーカスリング及びプラズマ処理方法
US20040261946A1 (en) * 2003-04-24 2004-12-30 Tokyo Electron Limited Plasma processing apparatus, focus ring, and susceptor
JP5183058B2 (ja) * 2006-07-20 2013-04-17 アプライド マテリアルズ インコーポレイテッド 急速温度勾配コントロールによる基板処理
JP5188696B2 (ja) * 2006-11-01 2013-04-24 株式会社日立ハイテクノロジーズ ウエハ載置用電極
CN101465313A (zh) * 2007-12-18 2009-06-24 北京北方微电子基地设备工艺研究中心有限责任公司 静电卡盘工艺组件
CN101471275B (zh) * 2007-12-26 2011-04-06 北京北方微电子基地设备工艺研究中心有限责任公司 一种被处理体的保持装置
JP4450106B1 (ja) * 2008-03-11 2010-04-14 東京エレクトロン株式会社 載置台構造及び処理装置
JP5217569B2 (ja) * 2008-03-31 2013-06-19 東京エレクトロン株式会社 プラズマ処理装置
JP5274918B2 (ja) * 2008-07-07 2013-08-28 東京エレクトロン株式会社 プラズマ処理装置のチャンバー内部材の温度制御方法、チャンバー内部材及び基板載置台、並びにそれを備えたプラズマ処理装置
TWI385725B (zh) * 2009-09-18 2013-02-11 Advanced Micro Fab Equip Inc A structure that reduces the deposition of polymer on the backside of the substrate
JP5195711B2 (ja) * 2009-10-13 2013-05-15 東京エレクトロン株式会社 基板冷却装置、基板冷却方法及び記憶媒体
JP5496630B2 (ja) * 2009-12-10 2014-05-21 東京エレクトロン株式会社 静電チャック装置
JP5101665B2 (ja) * 2010-06-30 2012-12-19 東京エレクトロン株式会社 基板載置台、基板処理装置および基板処理システム
JP5642531B2 (ja) * 2010-12-22 2014-12-17 東京エレクトロン株式会社 基板処理装置及び基板処理方法
CN103794538B (zh) * 2012-10-31 2016-06-08 北京北方微电子基地设备工艺研究中心有限责任公司 静电卡盘以及等离子体加工设备
JP5696183B2 (ja) * 2013-07-19 2015-04-08 株式会社日立ハイテクノロジーズ プラズマ処理装置

Also Published As

Publication number Publication date
TWI560804B (zh) 2016-12-01
CN105489527A (zh) 2016-04-13
CN105489527B (zh) 2018-11-06
TW201613029A (en) 2016-04-01
WO2016041519A1 (zh) 2016-03-24
KR20170048469A (ko) 2017-05-08
JP2017533582A (ja) 2017-11-09

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