SG11201701990SA - High density fan out package structure - Google Patents

High density fan out package structure

Info

Publication number
SG11201701990SA
SG11201701990SA SG11201701990SA SG11201701990SA SG11201701990SA SG 11201701990S A SG11201701990S A SG 11201701990SA SG 11201701990S A SG11201701990S A SG 11201701990SA SG 11201701990S A SG11201701990S A SG 11201701990SA SG 11201701990S A SG11201701990S A SG 11201701990SA
Authority
SG
Singapore
Prior art keywords
high density
package structure
fan out
out package
density fan
Prior art date
Application number
SG11201701990SA
Other languages
English (en)
Inventor
Dong Wook Kim
Hong Bok We
Jae Sik Lee
Shiqun Gu
Original Assignee
Qualcomm Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qualcomm Inc filed Critical Qualcomm Inc
Publication of SG11201701990SA publication Critical patent/SG11201701990SA/en

Links

Classifications

    • H10P72/74—
    • H10W70/093—
    • H10W70/095—
    • H10W70/60—
    • H10W70/635—
    • H10W70/65—
    • H10W70/66—
    • H10W72/019—
    • H10W72/90—
    • H10W90/701—
    • H10P72/7424—
    • H10P72/743—
    • H10W70/685—
    • H10W72/072—
    • H10W72/07207—
    • H10W72/07307—
    • H10W72/222—
    • H10W72/241—
    • H10W72/252—
    • H10W72/29—
    • H10W74/15—
    • H10W90/724—
    • H10W90/734—
    • H10W90/794—
SG11201701990SA 2014-10-31 2015-09-04 High density fan out package structure SG11201701990SA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201462073804P 2014-10-31 2014-10-31
US14/693,820 US10157823B2 (en) 2014-10-31 2015-04-22 High density fan out package structure
PCT/US2015/048514 WO2016069112A1 (en) 2014-10-31 2015-09-04 High density fan out package structure

Publications (1)

Publication Number Publication Date
SG11201701990SA true SG11201701990SA (en) 2017-05-30

Family

ID=55853498

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201701990SA SG11201701990SA (en) 2014-10-31 2015-09-04 High density fan out package structure

Country Status (8)

Country Link
US (1) US10157823B2 (enExample)
EP (1) EP3213345B1 (enExample)
JP (1) JP6672285B2 (enExample)
KR (1) KR102440270B1 (enExample)
CN (1) CN107078119B (enExample)
BR (1) BR112017008727B1 (enExample)
SG (1) SG11201701990SA (enExample)
WO (1) WO2016069112A1 (enExample)

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US9728507B2 (en) * 2011-07-19 2017-08-08 Pfg Ip Llc Cap chip and reroute layer for stacked microelectronic module
US20170047276A1 (en) * 2015-08-13 2017-02-16 Advanced Semiconductor Engineering, Inc. Semiconductor device package and method of manufacturing the same
US9761509B2 (en) 2015-12-29 2017-09-12 United Microelectronics Corp. Semiconductor device with throgh-substrate via and method for fabrication the semiconductor device
US10141198B2 (en) * 2016-07-08 2018-11-27 Dyi-chung Hu Electronic package and manufacturing method thereof
US10872872B2 (en) * 2016-12-30 2020-12-22 Intel Corporation Package substrate with high-density interconnect layer having pillar and via connections for fan out scaling
US10050021B1 (en) * 2017-02-16 2018-08-14 Nanya Technology Corporation Die device, semiconductor device and method for making the same
WO2019083875A1 (en) * 2017-10-23 2019-05-02 Applied Materials, Inc. FAN DISTRIBUTION INTERCONNECTION INTEGRATION PROCESSES AND STRUCTURES
DE102018127448B4 (de) 2017-11-30 2023-06-22 Taiwan Semiconductor Manufacturing Co. Ltd. Metallschienenleiter für nicht-planare Halbleiter-Bauelemente
US10700207B2 (en) 2017-11-30 2020-06-30 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor device integrating backside power grid and related integrated circuit and fabrication method
US10804254B2 (en) 2018-06-29 2020-10-13 Taiwan Semiconductor Manufacturing Company, Ltd. Fan-out package with cavity substrate
US20200212536A1 (en) * 2018-12-31 2020-07-02 Texas Instruments Incorporated Wireless communication device with antenna on package
JP7335036B2 (ja) * 2019-03-29 2023-08-29 ラピスセミコンダクタ株式会社 半導体パッケージの製造方法
KR102615198B1 (ko) 2019-10-15 2023-12-18 삼성전자주식회사 반도체 패키지
KR102765303B1 (ko) 2019-12-31 2025-02-07 삼성전자주식회사 반도체 패키지
US12166003B2 (en) 2020-04-03 2024-12-10 Macom Technology Solutions Holdings, Inc. RF amplifier devices including top side contacts and methods of manufacturing
US12500562B2 (en) 2020-04-03 2025-12-16 Macom Technology Solutions Holdings, Inc. RF amplifier devices and methods of manufacturing including modularized designs with flip chip interconnections
US11356070B2 (en) 2020-06-01 2022-06-07 Wolfspeed, Inc. RF amplifiers having shielded transmission line structures
US11302662B2 (en) * 2020-05-01 2022-04-12 Nanya Technology Corporation Semiconductor package with air gap and manufacturing method thereof
US11562974B2 (en) * 2021-01-07 2023-01-24 United Microelectronics Corp. Hybrid bonding structure and method of fabricating the same
US11682607B2 (en) * 2021-02-01 2023-06-20 Qualcomm Incorporated Package having a substrate comprising surface interconnects aligned with a surface of the substrate
KR20220126850A (ko) 2021-03-09 2022-09-19 삼성전자주식회사 반도체 패키지
WO2022259923A1 (ja) * 2021-06-11 2022-12-15 株式会社村田製作所 半導体装置
US12148688B2 (en) 2023-02-13 2024-11-19 Dyi-chung Hu Semiconductor substrate and manufacturing method thereof
TWI884561B (zh) * 2023-02-13 2025-05-21 胡迪群 半導體基板及其製造方法

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JP3817463B2 (ja) * 2001-11-12 2006-09-06 新光電気工業株式会社 多層配線基板の製造方法
US6706625B1 (en) * 2002-12-06 2004-03-16 Chartered Semiconductor Manufacturing Ltd. Copper recess formation using chemical process for fabricating barrier cap for lines and vias
US6927159B2 (en) * 2003-05-27 2005-08-09 Texas Instruments Incorporated Methods for providing improved layer adhesion in a semiconductor device
TWI286372B (en) 2003-08-13 2007-09-01 Phoenix Prec Technology Corp Semiconductor package substrate with protective metal layer on pads formed thereon and method for fabricating the same
US9460951B2 (en) * 2007-12-03 2016-10-04 STATS ChipPAC Pte. Ltd. Semiconductor device and method of wafer level package integration
US8513119B2 (en) * 2008-12-10 2013-08-20 Taiwan Semiconductor Manufacturing Company, Ltd. Method of forming bump structure having tapered sidewalls for stacked dies
US8441124B2 (en) * 2010-04-29 2013-05-14 Taiwan Semiconductor Manufacturing Company, Ltd. Cu pillar bump with non-metal sidewall protection structure
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US20120282767A1 (en) 2011-05-05 2012-11-08 Stmicroelectronics Pte Ltd. Method for producing a two-sided fan-out wafer level package with electrically conductive interconnects, and a corresponding semiconductor package
KR101828490B1 (ko) 2011-08-30 2018-02-12 삼성전자주식회사 관통전극을 갖는 반도체 소자 및 그 제조방법
US8552556B1 (en) 2011-11-22 2013-10-08 Amkor Technology, Inc. Wafer level fan out package
US8716859B2 (en) * 2012-01-10 2014-05-06 Intel Mobile Communications GmbH Enhanced flip chip package
US8779559B2 (en) * 2012-02-27 2014-07-15 Qualcomm Incorporated Structure and method for strain-relieved TSV
US9385006B2 (en) * 2012-06-21 2016-07-05 STATS ChipPAC Pte. Ltd. Semiconductor device and method of forming an embedded SOP fan-out package
KR20140024674A (ko) * 2012-08-20 2014-03-03 삼성전자주식회사 관통 비아 구조체 및 재배선 구조체를 갖는 반도체 소자
US9006101B2 (en) 2012-08-31 2015-04-14 Taiwan Semiconductor Manufacturing Company, Ltd. Interconnect structure and method
US8993380B2 (en) 2013-03-08 2015-03-31 Taiwan Semiconductor Manufacturing Company, Ltd. Structure and method for 3D IC package

Also Published As

Publication number Publication date
US10157823B2 (en) 2018-12-18
BR112017008727B1 (pt) 2022-06-28
WO2016069112A1 (en) 2016-05-06
KR20170077133A (ko) 2017-07-05
BR112017008727A2 (pt) 2017-12-19
EP3213345B1 (en) 2021-01-13
CN107078119A (zh) 2017-08-18
JP2017534177A (ja) 2017-11-16
EP3213345A1 (en) 2017-09-06
KR102440270B1 (ko) 2022-09-02
CN107078119B (zh) 2021-05-14
JP6672285B2 (ja) 2020-03-25
US20160126173A1 (en) 2016-05-05

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