SG11201610427SA - Printing of multiple inks to achieve precision registration during subsequent processing - Google Patents

Printing of multiple inks to achieve precision registration during subsequent processing

Info

Publication number
SG11201610427SA
SG11201610427SA SG11201610427SA SG11201610427SA SG11201610427SA SG 11201610427S A SG11201610427S A SG 11201610427SA SG 11201610427S A SG11201610427S A SG 11201610427SA SG 11201610427S A SG11201610427S A SG 11201610427SA SG 11201610427S A SG11201610427S A SG 11201610427SA
Authority
SG
Singapore
Prior art keywords
printing
subsequent processing
during subsequent
registration during
multiple inks
Prior art date
Application number
SG11201610427SA
Other languages
English (en)
Inventor
Ann M Gilman
Daniel J Theis
Matthew S Stay
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of SG11201610427SA publication Critical patent/SG11201610427SA/en

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41MPRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00Inking and printing with a printer's forme
    • B41M1/12Stencil printing; Silk-screen printing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41MPRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00Inking and printing with a printer's forme
    • B41M1/02Letterpress printing, e.g. book printing
    • B41M1/04Flexographic printing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41MPRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00Inking and printing with a printer's forme
    • B41M1/06Lithographic printing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41MPRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00Inking and printing with a printer's forme
    • B41M1/10Intaglio printing ; Gravure printing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41MPRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00Inking and printing with a printer's forme
    • B41M1/14Multicolour printing
    • B41M1/18Printing one ink over another
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41MPRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00Inking and printing with a printer's forme
    • B41M1/26Printing on other surfaces than ordinary paper
    • B41M1/30Printing on other surfaces than ordinary paper on organic plastics, horn or similar materials
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02Pretreatment of the material to be coated
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04Coating on selected surface areas, e.g. using masks
    • C23C14/042Coating on selected surface areas, e.g. using masks using masks
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08Oxides
    • C23C14/086Oxides of zinc, germanium, cadmium, indium, tin, thallium or bismuth
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/58After-treatment
    • C23C14/5873Removal of material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0266Marks, test patterns or identification means
    • H05K1/0269Marks, test patterns or identification means for visual or optical inspection
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H05K3/048Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41MPRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00Inking and printing with a printer's forme
    • B41M1/14Multicolour printing
    • B41M1/20Multicolour printing by applying differently-coloured inks simultaneously to different parts of the printing surface
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41MPRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M3/00Printing processes to produce particular kinds of printed work, e.g. patterns
    • B41M3/14Security printing
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09818Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01Tools for processing; Objects used during processing
    • H05K2203/0104Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05Patterning and lithography; Masks; Details of resist
    • H05K2203/0562Details of resist
    • H05K2203/0568Resist used for applying paste, ink or powder
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0769Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15Position of the PCB during processing
    • H05K2203/1545Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Printing Methods (AREA)
  • Laminated Bodies (AREA)
SG11201610427SA 2014-06-20 2015-06-05 Printing of multiple inks to achieve precision registration during subsequent processing SG11201610427SA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201462014736P 2014-06-20 2014-06-20
PCT/US2015/034380 WO2015195363A1 (fr) 2014-06-20 2015-06-05 Impression à encres multiples pour obtention d'un repérage de précision lors d'un traitement ultérieur

Publications (1)

Publication Number Publication Date
SG11201610427SA true SG11201610427SA (en) 2017-01-27

Family

ID=54935974

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201610427SA SG11201610427SA (en) 2014-06-20 2015-06-05 Printing of multiple inks to achieve precision registration during subsequent processing

Country Status (6)

Country Link
US (1) US9766732B2 (fr)
EP (2) EP3157755B1 (fr)
KR (1) KR102399443B1 (fr)
CN (2) CN106457858B (fr)
SG (1) SG11201610427SA (fr)
WO (1) WO2015195363A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3551347B1 (fr) 2016-12-07 2024-03-27 3M Innovative Properties Company Procédés de passivation d'adhésifs
CN107765544B (zh) * 2017-10-27 2020-04-17 业成科技(成都)有限公司 电子装置、电子装置的制造方法以及智能手表
US10709022B1 (en) * 2019-04-19 2020-07-07 Gentherm Incorporated Milling of flex foil with two conductive layers from both sides
US20220173066A1 (en) * 2020-12-02 2022-06-02 Flex Ltd. Flexible hybrid electronics manufacturing method

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3709177A1 (de) 1987-03-20 1988-09-29 Leybold Ag Verfahren und vorrichtung zur regelung der reaktiven schichtabscheidung auf substraten mittels magnetronkatoden
US5440446A (en) 1993-10-04 1995-08-08 Catalina Coatings, Inc. Acrylate coating material
TW511423B (en) * 2001-09-25 2002-11-21 Benq Corp Soft circuit board for recognition and the manufacturing method thereof
EP1308779A3 (fr) * 2001-10-31 2003-05-28 Phogenix Imaging, LLC Méthode et dispositif de photofinissage numérique
US6761097B2 (en) * 2001-11-27 2004-07-13 Hewlett-Packard Development Company, L.P. Method for cutting multisize photographic prints
US6688717B2 (en) * 2001-12-12 2004-02-10 Eastman Kodak Company Printed medium with integral image locator and method
TWI268813B (en) * 2002-04-24 2006-12-21 Sipix Imaging Inc Process for forming a patterned thin film conductive structure on a substrate
US8002948B2 (en) 2002-04-24 2011-08-23 Sipix Imaging, Inc. Process for forming a patterned thin film structure on a substrate
US7156945B2 (en) * 2002-04-24 2007-01-02 Sipix Imaging, Inc. Process for forming a patterned thin film structure for in-mold decoration
US7018713B2 (en) 2003-04-02 2006-03-28 3M Innovative Properties Company Flexible high-temperature ultrabarrier
JP4068635B2 (ja) * 2005-09-30 2008-03-26 松下電器産業株式会社 配線基板
JP2007112060A (ja) * 2005-10-21 2007-05-10 Fuji Xerox Co Ltd ドットインパクトプリンタ装置及びドットインパクトプリンタ装置の印字方法
US20090033582A1 (en) * 2006-06-01 2009-02-05 Blenkhorn Gary P RFID tags and antennas and methods of their manufacture
EP2115543B1 (fr) * 2007-01-11 2012-10-31 3M Innovative Properties Company Détecteur de position longitudinale de nappe
KR101647265B1 (ko) * 2007-06-19 2016-08-09 쓰리엠 이노베이티브 프로퍼티즈 컴파니 변위 스케일을 제조하는 시스템 및 방법
US20100188668A1 (en) 2007-06-19 2010-07-29 3M Innovative Properties Company Total internal reflection displacement scale
KR101390767B1 (ko) * 2007-08-31 2014-04-30 엘지디스플레이 주식회사 표시소자 제조방법
JP2009099939A (ja) * 2007-09-25 2009-05-07 Dainippon Screen Mfg Co Ltd アライメントマーク形成装置
US7829168B2 (en) * 2007-11-21 2010-11-09 Promos Technologies Pte. Ltd. Methods for inspecting and optionally reworking summed photolithography patterns resulting from plurally-overlaid patterning steps during mass production of semiconductor devices
JP2010021293A (ja) * 2008-07-09 2010-01-28 Nec Electronics Corp 半導体装置および半導体装置の製造方法
JP4754613B2 (ja) * 2008-11-27 2011-08-24 日東電工株式会社 光電気混載基板およびその製造方法
SG172349A1 (en) * 2008-12-29 2011-07-28 3M Innovative Properties Co Phase-locked web position signal using web fiducials
US8992104B2 (en) * 2008-12-30 2015-03-31 3M Innovative Properties Company Apparatus and method for making fiducials on a substrate
JP4966996B2 (ja) 2009-05-19 2012-07-04 東芝機械株式会社 レール支持装置およびシートの延伸方法
CN102822985B (zh) * 2010-04-06 2016-08-03 薄膜电子有限公司 外延结构、其形成方法及包含该结构的器件
US8339433B2 (en) 2010-08-18 2012-12-25 Xerox Corporation Alternate matrix drive method for a 1200dpi LED print-head
JP5212437B2 (ja) 2010-08-30 2013-06-19 株式会社Jvcケンウッド 画像データ送信装置、画像データ受信装置、画像データ伝送システム、画像データ送信方法および画像データ受信方法
ES2397264T3 (es) 2010-09-08 2013-03-05 Titan Umreifungstechnik Gmbh & Co.Kg Procedimiento para la colocación de bandas de zunchado alrededor de piezas de embalaje
KR101812606B1 (ko) * 2011-04-26 2017-12-27 니폰 메크트론 가부시키가이샤 투명인쇄회로 제조방법 및 투명터치패널 제조방법
CN103137244B (zh) * 2011-11-28 2015-12-09 远东新世纪股份有限公司 用于触控面板的导电基材及其制造方法
JP6030665B2 (ja) * 2011-12-22 2016-11-24 スリーエム イノベイティブ プロパティズ カンパニー ウェブ製品の空間的に同期させたデータの位置合わせを保持すること
JP6060431B2 (ja) * 2012-09-28 2017-01-18 株式会社フジシール プラスチックラベルの製造方法
WO2014070131A1 (fr) * 2012-10-29 2014-05-08 Unipixel Displays, Inc. Encres composites catalytiquement actives à nanoparticules revêtues
SG11201504816WA (en) 2012-12-20 2015-07-30 3M Innovative Properties Co Printing of multiple inks to achieve precision registration during subsequent processing
SG11201601075PA (en) * 2013-08-28 2016-03-30 3M Innovative Properties Co Electronic assembly with fiducial marks for precision registration during subsequent processing steps

Also Published As

Publication number Publication date
EP3157755B1 (fr) 2022-07-27
EP3157755A4 (fr) 2018-06-27
CN106457858B (zh) 2018-10-19
US20170115761A1 (en) 2017-04-27
CN109353136B (zh) 2020-08-04
WO2015195363A1 (fr) 2015-12-23
US9766732B2 (en) 2017-09-19
CN109353136A (zh) 2019-02-19
EP3517308B1 (fr) 2022-03-16
KR20170023962A (ko) 2017-03-06
EP3517308A1 (fr) 2019-07-31
KR102399443B1 (ko) 2022-05-19
CN106457858A (zh) 2017-02-22
EP3157755A1 (fr) 2017-04-26

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