SG11201610427SA - Printing of multiple inks to achieve precision registration during subsequent processing - Google Patents
Printing of multiple inks to achieve precision registration during subsequent processingInfo
- Publication number
- SG11201610427SA SG11201610427SA SG11201610427SA SG11201610427SA SG11201610427SA SG 11201610427S A SG11201610427S A SG 11201610427SA SG 11201610427S A SG11201610427S A SG 11201610427SA SG 11201610427S A SG11201610427S A SG 11201610427SA SG 11201610427S A SG11201610427S A SG 11201610427SA
- Authority
- SG
- Singapore
- Prior art keywords
- printing
- subsequent processing
- during subsequent
- registration during
- multiple inks
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/12—Stencil printing; Silk-screen printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/02—Letterpress printing, e.g. book printing
- B41M1/04—Flexographic printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/06—Lithographic printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/10—Intaglio printing ; Gravure printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/14—Multicolour printing
- B41M1/18—Printing one ink over another
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/26—Printing on other surfaces than ordinary paper
- B41M1/30—Printing on other surfaces than ordinary paper on organic plastics, horn or similar materials
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
- C23C14/086—Oxides of zinc, germanium, cadmium, indium, tin, thallium or bismuth
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/58—After-treatment
- C23C14/5873—Removal of material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
- H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/14—Multicolour printing
- B41M1/20—Multicolour printing by applying differently-coloured inks simultaneously to different parts of the printing surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
- B41M3/14—Security printing
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/0568—Resist used for applying paste, ink or powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Printing Methods (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201462014736P | 2014-06-20 | 2014-06-20 | |
PCT/US2015/034380 WO2015195363A1 (fr) | 2014-06-20 | 2015-06-05 | Impression à encres multiples pour obtention d'un repérage de précision lors d'un traitement ultérieur |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201610427SA true SG11201610427SA (en) | 2017-01-27 |
Family
ID=54935974
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201610427SA SG11201610427SA (en) | 2014-06-20 | 2015-06-05 | Printing of multiple inks to achieve precision registration during subsequent processing |
Country Status (6)
Country | Link |
---|---|
US (1) | US9766732B2 (fr) |
EP (2) | EP3157755B1 (fr) |
KR (1) | KR102399443B1 (fr) |
CN (2) | CN106457858B (fr) |
SG (1) | SG11201610427SA (fr) |
WO (1) | WO2015195363A1 (fr) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3551347B1 (fr) | 2016-12-07 | 2024-03-27 | 3M Innovative Properties Company | Procédés de passivation d'adhésifs |
CN107765544B (zh) * | 2017-10-27 | 2020-04-17 | 业成科技(成都)有限公司 | 电子装置、电子装置的制造方法以及智能手表 |
US10709022B1 (en) * | 2019-04-19 | 2020-07-07 | Gentherm Incorporated | Milling of flex foil with two conductive layers from both sides |
US20220173066A1 (en) * | 2020-12-02 | 2022-06-02 | Flex Ltd. | Flexible hybrid electronics manufacturing method |
Family Cites Families (35)
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DE3709177A1 (de) | 1987-03-20 | 1988-09-29 | Leybold Ag | Verfahren und vorrichtung zur regelung der reaktiven schichtabscheidung auf substraten mittels magnetronkatoden |
US5440446A (en) | 1993-10-04 | 1995-08-08 | Catalina Coatings, Inc. | Acrylate coating material |
TW511423B (en) * | 2001-09-25 | 2002-11-21 | Benq Corp | Soft circuit board for recognition and the manufacturing method thereof |
EP1308779A3 (fr) * | 2001-10-31 | 2003-05-28 | Phogenix Imaging, LLC | Méthode et dispositif de photofinissage numérique |
US6761097B2 (en) * | 2001-11-27 | 2004-07-13 | Hewlett-Packard Development Company, L.P. | Method for cutting multisize photographic prints |
US6688717B2 (en) * | 2001-12-12 | 2004-02-10 | Eastman Kodak Company | Printed medium with integral image locator and method |
TWI268813B (en) * | 2002-04-24 | 2006-12-21 | Sipix Imaging Inc | Process for forming a patterned thin film conductive structure on a substrate |
US8002948B2 (en) | 2002-04-24 | 2011-08-23 | Sipix Imaging, Inc. | Process for forming a patterned thin film structure on a substrate |
US7156945B2 (en) * | 2002-04-24 | 2007-01-02 | Sipix Imaging, Inc. | Process for forming a patterned thin film structure for in-mold decoration |
US7018713B2 (en) | 2003-04-02 | 2006-03-28 | 3M Innovative Properties Company | Flexible high-temperature ultrabarrier |
JP4068635B2 (ja) * | 2005-09-30 | 2008-03-26 | 松下電器産業株式会社 | 配線基板 |
JP2007112060A (ja) * | 2005-10-21 | 2007-05-10 | Fuji Xerox Co Ltd | ドットインパクトプリンタ装置及びドットインパクトプリンタ装置の印字方法 |
US20090033582A1 (en) * | 2006-06-01 | 2009-02-05 | Blenkhorn Gary P | RFID tags and antennas and methods of their manufacture |
EP2115543B1 (fr) * | 2007-01-11 | 2012-10-31 | 3M Innovative Properties Company | Détecteur de position longitudinale de nappe |
KR101647265B1 (ko) * | 2007-06-19 | 2016-08-09 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 변위 스케일을 제조하는 시스템 및 방법 |
US20100188668A1 (en) | 2007-06-19 | 2010-07-29 | 3M Innovative Properties Company | Total internal reflection displacement scale |
KR101390767B1 (ko) * | 2007-08-31 | 2014-04-30 | 엘지디스플레이 주식회사 | 표시소자 제조방법 |
JP2009099939A (ja) * | 2007-09-25 | 2009-05-07 | Dainippon Screen Mfg Co Ltd | アライメントマーク形成装置 |
US7829168B2 (en) * | 2007-11-21 | 2010-11-09 | Promos Technologies Pte. Ltd. | Methods for inspecting and optionally reworking summed photolithography patterns resulting from plurally-overlaid patterning steps during mass production of semiconductor devices |
JP2010021293A (ja) * | 2008-07-09 | 2010-01-28 | Nec Electronics Corp | 半導体装置および半導体装置の製造方法 |
JP4754613B2 (ja) * | 2008-11-27 | 2011-08-24 | 日東電工株式会社 | 光電気混載基板およびその製造方法 |
SG172349A1 (en) * | 2008-12-29 | 2011-07-28 | 3M Innovative Properties Co | Phase-locked web position signal using web fiducials |
US8992104B2 (en) * | 2008-12-30 | 2015-03-31 | 3M Innovative Properties Company | Apparatus and method for making fiducials on a substrate |
JP4966996B2 (ja) | 2009-05-19 | 2012-07-04 | 東芝機械株式会社 | レール支持装置およびシートの延伸方法 |
CN102822985B (zh) * | 2010-04-06 | 2016-08-03 | 薄膜电子有限公司 | 外延结构、其形成方法及包含该结构的器件 |
US8339433B2 (en) | 2010-08-18 | 2012-12-25 | Xerox Corporation | Alternate matrix drive method for a 1200dpi LED print-head |
JP5212437B2 (ja) | 2010-08-30 | 2013-06-19 | 株式会社Jvcケンウッド | 画像データ送信装置、画像データ受信装置、画像データ伝送システム、画像データ送信方法および画像データ受信方法 |
ES2397264T3 (es) | 2010-09-08 | 2013-03-05 | Titan Umreifungstechnik Gmbh & Co.Kg | Procedimiento para la colocación de bandas de zunchado alrededor de piezas de embalaje |
KR101812606B1 (ko) * | 2011-04-26 | 2017-12-27 | 니폰 메크트론 가부시키가이샤 | 투명인쇄회로 제조방법 및 투명터치패널 제조방법 |
CN103137244B (zh) * | 2011-11-28 | 2015-12-09 | 远东新世纪股份有限公司 | 用于触控面板的导电基材及其制造方法 |
JP6030665B2 (ja) * | 2011-12-22 | 2016-11-24 | スリーエム イノベイティブ プロパティズ カンパニー | ウェブ製品の空間的に同期させたデータの位置合わせを保持すること |
JP6060431B2 (ja) * | 2012-09-28 | 2017-01-18 | 株式会社フジシール | プラスチックラベルの製造方法 |
WO2014070131A1 (fr) * | 2012-10-29 | 2014-05-08 | Unipixel Displays, Inc. | Encres composites catalytiquement actives à nanoparticules revêtues |
SG11201504816WA (en) | 2012-12-20 | 2015-07-30 | 3M Innovative Properties Co | Printing of multiple inks to achieve precision registration during subsequent processing |
SG11201601075PA (en) * | 2013-08-28 | 2016-03-30 | 3M Innovative Properties Co | Electronic assembly with fiducial marks for precision registration during subsequent processing steps |
-
2015
- 2015-06-05 SG SG11201610427SA patent/SG11201610427SA/en unknown
- 2015-06-05 CN CN201580032881.8A patent/CN106457858B/zh active Active
- 2015-06-05 EP EP15810561.9A patent/EP3157755B1/fr active Active
- 2015-06-05 WO PCT/US2015/034380 patent/WO2015195363A1/fr active Application Filing
- 2015-06-05 EP EP19156036.6A patent/EP3517308B1/fr active Active
- 2015-06-05 US US15/319,020 patent/US9766732B2/en active Active
- 2015-06-05 CN CN201811085940.XA patent/CN109353136B/zh active Active
- 2015-06-05 KR KR1020177001304A patent/KR102399443B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
EP3157755B1 (fr) | 2022-07-27 |
EP3157755A4 (fr) | 2018-06-27 |
CN106457858B (zh) | 2018-10-19 |
US20170115761A1 (en) | 2017-04-27 |
CN109353136B (zh) | 2020-08-04 |
WO2015195363A1 (fr) | 2015-12-23 |
US9766732B2 (en) | 2017-09-19 |
CN109353136A (zh) | 2019-02-19 |
EP3517308B1 (fr) | 2022-03-16 |
KR20170023962A (ko) | 2017-03-06 |
EP3517308A1 (fr) | 2019-07-31 |
KR102399443B1 (ko) | 2022-05-19 |
CN106457858A (zh) | 2017-02-22 |
EP3157755A1 (fr) | 2017-04-26 |
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