SG11201610427SA - Printing of multiple inks to achieve precision registration during subsequent processing - Google Patents

Printing of multiple inks to achieve precision registration during subsequent processing

Info

Publication number
SG11201610427SA
SG11201610427SA SG11201610427SA SG11201610427SA SG11201610427SA SG 11201610427S A SG11201610427S A SG 11201610427SA SG 11201610427S A SG11201610427S A SG 11201610427SA SG 11201610427S A SG11201610427S A SG 11201610427SA SG 11201610427S A SG11201610427S A SG 11201610427SA
Authority
SG
Singapore
Prior art keywords
printing
subsequent processing
during subsequent
registration during
multiple inks
Prior art date
Application number
SG11201610427SA
Inventor
Ann M Gilman
Daniel J Theis
Matthew S Stay
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of SG11201610427SA publication Critical patent/SG11201610427SA/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00—Inking and printing with a printer's forme
    • B41M1/12—Stencil printing; Silk-screen printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00—Inking and printing with a printer's forme
    • B41M1/02—Letterpress printing, e.g. book printing
    • B41M1/04—Flexographic printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00—Inking and printing with a printer's forme
    • B41M1/06—Lithographic printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00—Inking and printing with a printer's forme
    • B41M1/10—Intaglio printing ; Gravure printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00—Inking and printing with a printer's forme
    • B41M1/14—Multicolour printing
    • B41M1/18—Printing one ink over another
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00—Inking and printing with a printer's forme
    • B41M1/26—Printing on other surfaces than ordinary paper
    • B41M1/30—Printing on other surfaces than ordinary paper on organic plastics, horn or similar materials
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08—Oxides
    • C23C14/086—Oxides of zinc, germanium, cadmium, indium, tin, thallium or bismuth
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/58—After-treatment
    • C23C14/5873—Removal of material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00—Inking and printing with a printer's forme
    • B41M1/14—Multicolour printing
    • B41M1/20—Multicolour printing by applying differently-coloured inks simultaneously to different parts of the printing surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
    • B41M3/14—Security printing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0568—Resist used for applying paste, ink or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
SG11201610427SA 2014-06-20 2015-06-05 Printing of multiple inks to achieve precision registration during subsequent processing SG11201610427SA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201462014736P 2014-06-20 2014-06-20
PCT/US2015/034380 WO2015195363A1 (en) 2014-06-20 2015-06-05 Printing of multiple inks to achieve precision registration during subsequent processing

Publications (1)

Publication Number Publication Date
SG11201610427SA true SG11201610427SA (en) 2017-01-27

Family

ID=54935974

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201610427SA SG11201610427SA (en) 2014-06-20 2015-06-05 Printing of multiple inks to achieve precision registration during subsequent processing

Country Status (6)

Country Link
US (1) US9766732B2 (en)
EP (2) EP3517308B1 (en)
KR (1) KR102399443B1 (en)
CN (2) CN106457858B (en)
SG (1) SG11201610427SA (en)
WO (1) WO2015195363A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3551347B1 (en) 2016-12-07 2024-03-27 3M Innovative Properties Company Methods of passivating adhesives
CN107765544B (en) * 2017-10-27 2020-04-17 业成科技（成都）有限公司 Electronic device, manufacturing method of electronic device, and smart watch
US10709022B1 (en) * 2019-04-19 2020-07-07 Gentherm Incorporated Milling of flex foil with two conductive layers from both sides
US20220173066A1 (en) * 2020-12-02 2022-06-02 Flex Ltd. Flexible hybrid electronics manufacturing method

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3709177A1 (en) 1987-03-20 1988-09-29 Leybold Ag METHOD AND DEVICE FOR REGULATING THE REACTIVE LAYER DEPOSITION ON SUBSTRATES BY MEANS OF MAGNETIC CATALODES
US5440446A (en) 1993-10-04 1995-08-08 Catalina Coatings, Inc. Acrylate coating material
TW511423B (en) * 2001-09-25 2002-11-21 Benq Corp Soft circuit board for recognition and the manufacturing method thereof
EP1308779A3 (en) * 2001-10-31 2003-05-28 Phogenix Imaging, LLC Digital photofinishing method and apparatus
US6761097B2 (en) * 2001-11-27 2004-07-13 Hewlett-Packard Development Company, L.P. Method for cutting multisize photographic prints
US6688717B2 (en) * 2001-12-12 2004-02-10 Eastman Kodak Company Printed medium with integral image locator and method
TWI268813B (en) * 2002-04-24 2006-12-21 Sipix Imaging Inc Process for forming a patterned thin film conductive structure on a substrate
US8002948B2 (en) 2002-04-24 2011-08-23 Sipix Imaging, Inc. Process for forming a patterned thin film structure on a substrate
US7156945B2 (en) * 2002-04-24 2007-01-02 Sipix Imaging, Inc. Process for forming a patterned thin film structure for in-mold decoration
US7018713B2 (en) 2003-04-02 2006-03-28 3M Innovative Properties Company Flexible high-temperature ultrabarrier
JP4068635B2 (en) * 2005-09-30 2008-03-26 松下電器産業株式会社 Wiring board
JP2007112060A (en) * 2005-10-21 2007-05-10 Fuji Xerox Co Ltd Dot impact printer and printing method of dot impact printer
US20090033582A1 (en) * 2006-06-01 2009-02-05 Blenkhorn Gary P RFID tags and antennas and methods of their manufacture
BRPI0720784A2 (en) * 2007-01-11 2014-01-28 3M Innovative Properties Co LONGITUDINAL BLANK SENSOR
CN101688794B (en) * 2007-06-19 2012-12-12 3M创新有限公司 Systems and methods for fabricating displacement scales
EP2165162A2 (en) 2007-06-19 2010-03-24 3M Innovative Properties Company Total internal reflection displacement scale
KR101390767B1 (en) * 2007-08-31 2014-04-30 엘지디스플레이 주식회사 Method for fabricating display device
JP2009099939A (en) * 2007-09-25 2009-05-07 Dainippon Screen Mfg Co Ltd Alignment mark forming device
US7829168B2 (en) 2007-11-21 2010-11-09 Promos Technologies Pte. Ltd. Methods for inspecting and optionally reworking summed photolithography patterns resulting from plurally-overlaid patterning steps during mass production of semiconductor devices
JP2010021293A (en) * 2008-07-09 2010-01-28 Nec Electronics Corp Semiconductor device and method of manufacturing the same
JP4754613B2 (en) * 2008-11-27 2011-08-24 日東電工株式会社 Opto-electric hybrid board and manufacturing method thereof
WO2010077592A2 (en) * 2008-12-29 2010-07-08 3M Innovative Properties Company Phase-locked web position signal using web fiducials
SG172781A1 (en) * 2008-12-30 2011-08-29 3M Innovative Properties Co Apparatus and method for making fiducials on a substrate
JP4966996B2 (en) 2009-05-19 2012-07-04 東芝機械株式会社 Rail support device and sheet stretching method
US8900915B2 (en) * 2010-04-06 2014-12-02 Thin Film Electronics Asa Epitaxial structures and methods of forming the same
US8339433B2 (en) 2010-08-18 2012-12-25 Xerox Corporation Alternate matrix drive method for a 1200dpi LED print-head
JP5212437B2 (en) 2010-08-30 2013-06-19 株式会社Ｊｖｃケンウッド Image data transmitting apparatus, image data receiving apparatus, image data transmission system, image data transmitting method, and image data receiving method
ES2397264T3 (en) 2010-09-08 2013-03-05 Titan Umreifungstechnik Gmbh & Co.Kg Procedure for placing strips around packing pieces
WO2012147235A1 (en) * 2011-04-26 2012-11-01 日本メクトロン株式会社 Method for producing transparent printed wiring board, and method for producing transparent touch panel
CN103137244B (en) * 2011-11-28 2015-12-09 远东新世纪股份有限公司 For conductive base and the manufacture method thereof of contact panel
CN104094103B (en) 2011-12-22 2016-10-19 3M创新有限公司 Keep the alignment of the spatial synchronization data of web product
JP6060431B2 (en) * 2012-09-28 2017-01-18 株式会社フジシール Manufacturing method of plastic labels
WO2014070131A1 (en) * 2012-10-29 2014-05-08 Unipixel Displays, Inc. Coated nano-particle catalytically active composite inks
US9322093B2 (en) 2012-12-20 2016-04-26 3M Innovative Properties Company Printing of multiple inks to achieve precision registration during subsequent processing
JP6457528B2 (en) * 2013-08-28 2019-01-23 スリーエム イノベイティブ プロパティズ カンパニー Electronic assembly with fiducial marks for accurate alignment during subsequent processing steps

Also Published As

Publication number Publication date
CN106457858B (en) 2018-10-19
EP3517308A1 (en) 2019-07-31
CN109353136A (en) 2019-02-19
EP3517308B1 (en) 2022-03-16
US20170115761A1 (en) 2017-04-27
CN109353136B (en) 2020-08-04
EP3157755A4 (en) 2018-06-27
CN106457858A (en) 2017-02-22
US9766732B2 (en) 2017-09-19
KR20170023962A (en) 2017-03-06
WO2015195363A1 (en) 2015-12-23
KR102399443B1 (en) 2022-05-19
EP3157755B1 (en) 2022-07-27
EP3157755A1 (en) 2017-04-26

Similar Documents

Publication Publication Date Title
HK1232247A1 (en) Printing process
GB201607513D0 (en) Method of printing
PL3028856T3 (en) Printing apparatus
GB201401721D0 (en) Ink formulation
EP3096953A4 (en) Inkjet printing
GB2558530B (en) Printing ink
GB201522222D0 (en) Printing ink
SG11201504816WA (en) Printing of multiple inks to achieve precision registration during subsequent processing
SG11201804262UA (en) Lithographic ink
GB201408467D0 (en) Inks
SG11201610427SA (en) Printing of multiple inks to achieve precision registration during subsequent processing
PL3169522T3 (en) Inking unit of a printing unit
ZA201701532B (en) Improvements to router apparatus (body features)
GB2538619B (en) Printing ink
GB201509208D0 (en) Improvements relating to printing
GB2539352B (en) Printing ink
SG11201608576WA (en) Process for plasmonic-based high resolution color printing
GB201508135D0 (en) Method of Printing
GB201617635D0 (en) Printing ink
EP3152535A4 (en) Color predicton for color printing
GB201418616D0 (en) Printing ink
GB201716511D0 (en) Method of printing
FI20145416A (en) printing process
GB201418615D0 (en) Printing ink
GB201418777D0 (en) Printing process